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    BGA AND QFP PACKAGE 14X14 Search Results

    BGA AND QFP PACKAGE 14X14 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ331KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ102MB4B
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ332MN4A
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    BGA AND QFP PACKAGE 14X14 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SOP48

    Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
    Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7


    OCR Scan     		QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 CF RM sot89 SOP38 14X14X2 epson QFP 216 45x45 mm bga 14x14x2.7 PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow PDF

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking PDF

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK PDF

    7303b

    Abstract: LGA 1150 ED-7300 ED-7303B
    Contextual Info: JEITA package codes are uniformly given to our IC packages according to the JEITA standard “EIAJ ED-7303B”. The construction of JEITA package code is explained below. JEITA Package Code excerpt from the JEITA standard “EIAJ ED-7303B” 1. Construction of package code


    Original     		ED-7303B. ED-7303B) ISO-R370) -SOP28 -QFP80 7303b LGA 1150 ED-7300 ED-7303B PDF

    841S101

    Contextual Info: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology | | POWER MANAGEMENT ANALOG & RF INTERFACE & CONNECTIVITY | CLOCKS & TIMING | MEMORY & LOGIC | TOUCH & USER INTERFACE | VIDEO & DISPLAY | AUDIO PCI Express Timing Solutions


    Original     		100MHz REVB0111 841S101 PDF

    89H48H12G3

    Abstract: TSI350A
    Contextual Info: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology ANALOG AND RF | INTERFACE AND CONNECTIVITY PCI Express Timing Solutions Highly Integrated Clocks for PCIe-based Systems The IDT PCI Express timing products meet or


    Original     		100MHz REVD0813 89H48H12G3 TSI350A PDF

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Contextual Info: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


    Original     		32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239 PDF

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


    Original     		PDF

    144 QFP body size

    Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
    Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF

    synopsys Platform Architect

    Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27
    Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF

    QFN tray

    Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
    Contextual Info: Packaging Product Specification PS007229-1010 Copyright 2010 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PS007229-1010 2000/REEL 1000/REEL 160/TRAY 1600/BAG 490/TRAY 260/TRAY QFN tray 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray PDF

    oki cross

    Abstract: BGA 27X27 pitch
    Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG87P3/87P4/87P5 0.25µm Standard Cell August 2002 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––


    Original     		MG87P3/87P4/87P5 oki cross BGA 27X27 pitch PDF

    oki cross

    Contextual Info: D ATA SHEET O K I A S I C P R O D U C T S MG87P3/87P4/87P5 0.25µm Standard Cell July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––


    Original     		MG87P3/87P4/87P5 oki cross PDF

    9953

    Abstract: STM-64 VSC8174 OSCILLATOR 10.66 ghz
    Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Product Brief 9.953 Gbit/sec SONET/SDH 1:16 Demultiplexer withh Clock Generator VSC8174 Features • 10 Gbit/sec SONET/SDH 1:16 Demux • Data Polarity Invert • Integrated Clock and Data Recovery • Bit Order Swap • Input Data Sensitivity of 50mV


    Original     		VSC8174 OC-192 STM-64 VSC8174 G52315-0, 9953 OSCILLATOR 10.66 ghz PDF

    S1R72U16

    Abstract: S1R72V17 S1R72V05B00A2 S1R72V05F00A2 S2R72C05 wireless video camera construction S1R72C05F15E1 Wireless Camera Circuit Diagram S2S65P10 wireless vga camera circuit
    Contextual Info: � � � � � � � � � ・� � � � � � � � � � � � � � Our goal is to be a true partner that strategically contributes to your product development through our concept of "saving technologies" that save power, time, and space.


    Original     		PDF

    TI 35X35 BGA 368 BGA

    Abstract: 547 B34 kl 668 sem 304
    Contextual Info: •SSSS D a t a S h e e t _ O K I A S I C P R O D U MG73Q000/74Q000 and MSM98Q000/99Q000 0.35iim Customer Structured Arrays April 1999 Oki Semiconductor CONTENTS D


    OCR Scan     		MG73Q000/74Q000 MSM98Q000/99Q000 35iim G73Q/74Q 98Q/99Q 98Q/99Q108X108 35x35 27x27 TI 35X35 BGA 368 BGA 547 B34 kl 668 sem 304 PDF

    AN1010

    Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
    Contextual Info: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and


    Original     		AN1010 BCM8320 AN1010 BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BDN14-6CB EXTRUDED ALUMINUM PDF

    JEDEC qfn tray

    Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
    Contextual Info: Packaging Product Specification PS007230-0812 Copyright 2012 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE THESE PRODUCTS IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN PDF

    GAL20V8B-15LD

    Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
    Contextual Info: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.


    Original     		I0162 GAL20V8B-15LD pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2 PDF

    APPLE AUTHENTICATION COPROCESSOR 2.0C

    Abstract: AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module emmc spi bridge iMX233 Apple Authentication
    Contextual Info: August, 2010 i.MX2x Portfolio Overview CON-F0960 Shailendra Miglani Senior Field Applications Engineer, Freescale India TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc.,


    Original     		CON-F0960 MX233 APPLE AUTHENTICATION COPROCESSOR 2.0C AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module emmc spi bridge iMX233 Apple Authentication PDF

    microprocessors architecture of 8251

    Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
    Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		CLA200 DS4812 microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 PDF