BGA16 Search Results

SF-BGA160B-B-11

Contextual Info: D Package Code: BGA160B C See BGA pattern code to the right for actual pattern layout Y 21.59mm [0.850"] 15.24mm [0.600"] X 1.27mm typ. [0.050"] Top View reference only 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 5.33mm 3.74mm [0.147"] [0.210"] B 1

SF-BGA160A-B-11

Contextual Info: D Package Code: BGA160A C 20.98mm [0.826"] See BGA pattern code to the right for actual pattern layout Y 1.5mm [0.059"] X Top View reference only 21.01mm [0.827"] 2 1.27 mm [0.059"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]

SF-BGA169B-B-11

Contextual Info: D Package Code: BGA169B C 18mm [0.709"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y X 18mm [0.709"] Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] 1.5mm [0.059"]

SF-BGA169A-B-11

Abstract: 0074X
Contextual Info: D Package Code: BGA169A C 15.24mm [0.600"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] X 15.24mm [0.600"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]

BGA168

Abstract: SF-BGA168A-B-11 ST BGA
Contextual Info: D Package Code: BGA168A C 20.32mm [0.800"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 0.64mm [0.025"] X Top View reference only 20.32mm [0.800"] 1.27mm [0.050"] 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

SF-BGA169C-B-01

Contextual Info: D Ø 0.40mm [0.0156"] Tooling Hole SF-BGA169C-B-01 C 18.29mm [0.720"] See BGA pattern code to the right for actual pattern layout Y 1.52mm [0.060"] X Top View (reference only) 18.29mm [0.720"] 1.52mm [0.060"] 0.36mm dia. [0.014"] 2 3.81mm[0.150"] 6.22mm[0.245"]

BGA169

Abstract: BGA169D 13X13 SF-BGA169D-B-11
Contextual Info: D Package Code: BGA169D C 18mm [0.709"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 18mm [0.709"] X 1.5mm typ. [0.059"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.5mm [0.059"] Ø 0.64mm pad [Ø 0.025"]

BGA165

Abstract: SF-BGA165A-B-11
Contextual Info: D Package Code: BGA165A C 17.98mm [0.708"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 18.01mm [0.709"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. Ø 0.64mm pad [Ø 0.025"] 5.33mm 3.74mm [0.147"] [0.210"]

pitch 0.4mm BGA

Abstract: 14X14 SF-BGA160C-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA160C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.53mm [0.021"]

BGA-160

Abstract: 0.4mm pitch BGA 14X14 SF-BGA160D-B-11 BGA Package 14x14 pitch 0.4mm BGA 160 BGA Package 14x14
Contextual Info: C Package Code: BGA160D D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.53mm [0.021"] 0.508 mm [0.020"]

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

ba37

Abstract: 48FBGA K8D1716U K8D1716UBC K8D1716UTC samsung nor flash BA251
Contextual Info: K8D1716UTC / K8D1716UBC FLASH MEMORY Document Title 16M Bit 2M x8/1M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft July 25, 2004 Advance 0.1 Support 48TSOP1 Lead Free Package Sep 16, 2004 Preliminary

SAMSUNG MCP

Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Contextual Info: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary

CHN 703

Abstract: CHN G4 112
Contextual Info: IDT82V2048 OCTAL T1/E1 SHORT HAUL LINE INTERFACE UNIT FEATURES ♦ ♦ ♦ ♦ ♦ ♦ ♦ Fully integrated octal T1/E1 short haul line interface which supports 100Ω T1 twisted pair, 120Ω E1 twisted pair and 75Ω E1 coaxial applications Selectable single rail or dual rail mode and AMI or HDB3/B8ZS

fcbga16

Contextual Info: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The NBSG11 is a 1-to-2 differential fanout buffer, optimized for low skew and ultra-low JITTER. Inputs incorporate internal 50 W termination resistors and accept

Contextual Info: NBSG53A 2.5V/3.3V SiGe Selectable Differential Clock and Data D Flip−Flop/Clock Divider with Reset and OLS* The NBSG53A is a multi-function differential D flip-flop DFF or fixed divide by two (DIV/2) clock generator. This is a part of the GigaComm family of high performance Silicon Germanium

BQ24153

Abstract: schematic diagram TCON lcd samsung tps51631 LG 21 color tv Circuit Diagram schematics ultraslim UCD90120 TPS65175 tps65642 LM2740 INA230 QFN 10 2x2 footprint
Contextual Info: Power Management Guide Power Management Guide 2014 2014 www.ti.com/power www.ti.com/power Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solu­tions with a full line of highperformance products. These products, which range from standard linear

88E6097

Abstract: 88E6020 88E1119 88E6071 Marvell 88E1512 88AP270M 88W8897 Marvell PHY 88E6352 88PG867 MV64460
Contextual Info: 2015 Marvell Product Selector Guide TOTAL SOLUTIONS FROM MARVELL Providing a b ro a d s p e c t r u m o f s o l u t i o n s a c ro ss a w i d e ra n g e o f m a r ke t s e g m e n t s . TABLE OF CONTENTS Application Processors .

LSE B10 transformer

Contextual Info: DATA SH EET FEBRUARY 1999 Revision 1.0 LXT380 Octal E1 G.703 Transceiver General Description The LXT380 is an octal short haul PCM transceiver for ITU G.703 2.048 Mbit/sec. transmission systems. It incorporates eight independent receivers and eight independent transmitters in a sin­

Contextual Info: PCI 6350 Data Book PCI 6350 Data Book Version 0.73 June 2004 Website: Technical Support: Phone: FAX: http://www.plxtech.com http://www.plxtech.com/support/ 408 774-9060 800 759-3735 408 774-2169 2004 PLX Technology, Inc. All rights reserved. PLX Technology, Inc., retains the right to make changes to this product at any time, without notice. Products may

MCF5249UM

Abstract: IC1 4047 CBM 4080 gpo38 IR 448H MCF5249 IEC958 IEC958-3 decoder 4to16 7ba26
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. MCF5249 ColdFire Integrated Microprocessor User’s Manual MCF5249UM/D Rev. 4.0, 10/2003 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Document Revision History

Contextual Info: NBSG16VS 2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing The NBSG16VS is a differential receiver/driver targeted for high frequency applications that require variable output swing. The device is functionally equivalent to the EP16VS device with much higher

Yamaichi IC51-0804-808

Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board