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Catalog Datasheet	MFG & Type	PDF	Document Tags
BGA168 Abstract: SF-BGA168A-B-11 ST BGA Text: D Package Code: BGA168A C 20.32mm [0.800"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 0.64mm [0.025"] X Top View reference only 20.32mm [0.800"] 1.27mm [0.050"] 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]	Original	PDF	BGA168A FR4/G10 SF-BGA168A-B-11 BGA168 ST BGA
BGA676 Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18	Original	PDF	BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
B1680 Abstract: No abstract text available Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC BGA-168P-M01 168-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Package width x package length 12.00 × 12.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX	Original	PDF	BGA-168P-M01 168-pin BGA-168P-M01) B168001S-2C-2 B1680
ADS7924 Abstract: TRF3761-E CDCLVC1102 INA3221 Text: Analog Signal Chain Guide Amplifiers Data Converters Interface Clocks and Timing Sensing Wireless Connectivity www.ti.com 2013 Analog Signal Chain Guide Table of Contents Overview. 3 Interface Amplifiers and Comparators	Original	PDF
LGA 1156 PIN OUT diagram Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original	PDF
LGA 1155 Socket PIN diagram Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08 Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original	PDF
Yamaichi ic354 Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3	Original	PDF	LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
FP-X4KPG223-01 Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators	Original	PDF	XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01