BGA22 Search Results

PBGA225

Abstract: BGA225
Contextual Info: P-BGA225-2727-1.5 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

tray bga

Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
Contextual Info: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)

SF-BGA225C-B-11

Contextual Info: D Package Code: BGA225C C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]

PBGA225

Abstract: PRBG0225CB-A
Contextual Info: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CB-A D Previous Code 225F7X-B MASS[Typ.] 2.0g A D1 b S AB B A ZD e e A1 R P N M L K H G F E D C ZE E E1 J B A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x y

SF-BGA224A-B-01

Contextual Info: D Ø 0.40mm [0.0156"] Tooling Hole SF-BGA224A-B-01 C 21.59mm [0.850"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 21.57mm [0.849"] X Top View (reference only) 1.27 mm [0.050"] 0.36mm dia. [0.014"] 0.64mm

BGA225

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C R P e N M L K J H G F E D C

SF-BGA228B-B-11

Abstract: BGA228B 1.4mm pitch BGA
Contextual Info: D Package Code: BGA228B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

PRBG0225CA-A

Abstract: PBGA225
Contextual Info: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CA-A B D Previous Code 225F7X-A MASS[Typ.] 2.0g A b A D1 S ZD AB e e A1 R P N M L H G F E D C ZE E E1 K J B A y S 1pin corner S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x

SF-BGA225B-B-11

Contextual Info: D Package Code: BGA225B C 20.98mm [0.826"] See BGA pattern code to the right for actual pattern layout Y 1.5mm [0.059"] X Top View reference only 21.01mm [0.827"] 1.27 mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]

BGA228

Abstract: SF-BGA228A-B-11
Contextual Info: D Package Code: BGA228A C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

SF-BGA225A-B-11

Abstract: BGA225A
Contextual Info: D Package Code: BGA225A C 17.78mm [0.700"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] X 17.78mm [0.700"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]

BGA225

Abstract: MO-151 sot648
Contextual Info: PDF: 2000 Sep 21 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e y y1 C ∅w M v M A R P N e M L K J e1 H G F E

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM26-10113-1E F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM26-10107-1E F2MC-8FX 8-BIT MICROCONTROLLER MB95100A/H Series HARDWARE MANUAL 2 F MC-8FX 8-BIT MICROCONTROLLER MB95100A/H Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

Contextual Info: FUJITSU MICROELECTRONICS CONTROLLER MANUAL CM26-10109-3E F2MC-8FX 8-BIT MICROCONTROLLER MB95110B/M Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95110B/M Series HARDWARE MANUAL The information for microcontroller supports is shown in the following homepage.

Contextual Info: FUJITSU MICROELECTRONICS CONTROLLER MANUAL CM26-10112-3E F2MC-8FX 8-BIT MICROCONTROLLER MB95100B/AM Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95100B/AM Series HARDWARE MANUAL The information for microcontroller supports is shown in the following homepage.