BK 300 MI Search Results

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Array Inductors BK array series BK32164M301-T Features Item Summary 300Ω, 150mA, 1206 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table

Contextual Info: Extract from the online catalog GPK 300X280X1,5 WH/BK Order No.: 5031919 The illustration shows various versions of the article Engraving plate, material thickness: 1.5 mm, length: 300 mm, width:

Contextual Info: BCX71K PNP General-Purpose Amplifier Description C This device is designed for applications requiring extremely high-current gain at collector currents to 300 mA. Sourced from process 68. E SOT-23 Mark: BK B Ordering Information Part Number Marking Package

Contextual Info: Extract from the online catalog GPA/SK 300X280X1,5 WH/BK Discontinued item Order No.: 0813983 The illustration shows various versions of the article Engraving plate, material thickness: 1.5 mm, length: 300 mm, width:

Contextual Info: BCX71K BCX71K C E SOT-23 B Mark: BK PNP General Purpose Amplifier This device is designed for applications requiring extremely high current gain at collector currents to 300 mA. Sourced from Process 68. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted

Contextual Info: BCX71K BCX71K C E SOT-23 B Mark: BK PNP General Purpose Amplifier This device is designed for applications requiring extremely high current gain at collector currents to 300 mA. Sourced from Process 68. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted

BCX71K

Contextual Info: BCX71K BCX71K C E SOT-23 B Mark: BK PNP General Purpose Amplifier This device is designed for applications requiring extremely high current gain at collector currents to 300 mA. Sourced from Process 68. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted

12P5001

Abstract: baum Baumer
Contextual Info: Intensity difference Background suppression Tw 250 mm Tw 300 mm • • • • • cable NPN light operate dark operate light/dark operate connector FZDM 12P5101 FZDM 12P5101/S35A cable connector FHDM 12P5001 FHDM 12P5001/S35A PNP BN 1 WH (2) BK (4) technical data

LM 7902

Contextual Info: ESQT-1XX-XX-XX-X-XXX-XXX-XX REVISION BK POSITION SPECIFICATION FIG 1 DO NOT SCALE FROM THIS PRINT LEAD STYLE SPEC No OF POS x .07874 [2.0000] + .0117 [.300]) -02: USE C-79-02-X -03: USE C-79-53-X .010 [.25] PLATING SPECIFICATION -F: FLASH SELECTIVE, 3 Au / 50 Ni MIN

Contextual Info: l c 2m o s ANALOG DEVICES 20-Bit Data Acquisition System AD79024 FEATURES 20-BK Sigma-Delta ADC Dynamic Range of 105 dB 150 Hz Input ±0.0015% Integral Nonlinearity (150 Hz Input) On-Chip Low-Pass Digital Filter Cut-Off Programmable from 300 Hz to 18.75 Hz

BKMH-200

Contextual Info: Data Sheet 2107, Issue 8, 02/14/11, Page 1 AIR CORE BONDED PASP CABLE BELL SYSTEM TYPE BH*H AND BK*H Pairs/ Gauge Cable Code Product Number Alum/ Steel Approx. Wgt. #/1000 Ft Alum/ Steel Nom. OD Inches Length (Feet) 25/19 50/19 100/19 200/19 300/19 25/22

Contextual Info: Data Sheet 2101, Issue 8, 02/14/11, Page 1 AIR CORE ALPETH CABLE BELL SYSTEM TYPE BH*A AND BK*A Pairs/Gauge Cable Code Product Number Alum Approx. Wgt. #/1000 Ft Alum Nom. OD Inches Length (Feet) 25/19 50/19 100/19 200/19 300/19 25/22 50/22 100/22 200/22

shaft current

Abstract: RXKH
Contextual Info: A SEA U'lK'KT'OTIÚN RE 300-001 E FiiiYv'DulH Rífl, 5^52 ffiffi, M arcii 1 3 7 5 E d i t i o n "I Relay Division Pn?ü 1 F i l o BK TO-^O E S e c tio n 5 I t e f i a i i a t i n e - l a g s e le y is f o r p r o t e c t i v e r e l a y i n g a rid i n d u s t r i a l c a s t j q !

lm 471

Abstract: BK1608LM 182,BK
Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

cables

Abstract: 12AC5
Contextual Info: CABLES - CAVI MD-EE PUR, halogen free, UL 300 V, shielded, twisted in pair PUR, senza alogeni, UL 300 V, con schermo, cordato a coppie Description. Conductor insulation: halogen free polyolefin PP9Y, conductors twisted in pairs, separation soft tape, tinned copper braid, min. coverage 85%, EMC 89/336/EC. Sheath of matt

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

lm 7412

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

cables

Contextual Info: CABLES - CAVI MP-TE MP-TK PVC, UL 300 V, shielded PVC, UL 300 V, con schermo Description. Conductor insulation: special PVC, separation soft tape, tinned copper braid, min. coverage 85%, EMC 89/336/EC. Outer sheath: special PVC. Application. Suitable for industrial application connection. It reduces EMI Electromagnetic

cables

Contextual Info: CABLES - CAVI MD-TE PUR, halogen free, UL 300 V, shielded PUR, senza alogeni, UL 300 V, con schermo Description. Conductor insulation of halogen free polyolefin PP9Y, separation soft tape, tinned copper braid, min. coverage 85%, EMC 89/336/EC. Sheath of matt halogen free polyether

mini combicon

Abstract: MCD 0 5/ 4-G1-2 5
Contextual Info: COMBICON Headers for Through Hole Reflow Applications MCD V 0,5/…G1-2,5 HT BK and MCD(V) 1,5/…G1-3,81 HT BK 2.5 or 3.81 mm Pitch The double-level headers of the MINI and MICROCOMBICON series are characterized by their low space requirement and high contact density. The new hightemperature resistant versions, MCD(V) 0,5-HT and

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

h11-0507

Abstract: H11-0547 H11-0509A
Contextual Info: TABLE 1. SINGLE 1 x 8 FIGURES 1,2 (NOTE 1) (NOTES 2,3) DEVICE SUFFIX CODES MIL SPEC RDS(ON) (QMAX) VINH MIN (V) VINL MAX (V) TECHNOLOGY •doff TYP (±nA) Ton TYP (ns) TYP(ns) 115 105 Low Rd»ON) Fault Protected t off DG408 DJ.DY DG408AK/883 40 2.4 0.8 44V CMOS-JI

079J

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.