C18070 Search Results

ALLOY leadframe C7025

Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,

FeNi42

Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Contextual Info: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.

C18070

Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Contextual Info: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth

Contextual Info: REV RoHS COMPLIANT 592-0002F ECN NO REVISIONS A Part Numbers with the "F" suffix ending are RoHS Compliant. Packaging is marked with "RoHS Compliant" label or equivalent markings. These parts can be used with RoHS reflow profile. Parts can be wave soldered, dip soldered or hand soldered

C18070

Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract