Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    C7025 STRIP Search Results

    C7025 STRIP Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    Smart-Power-Strip Renesas Electronics Corporation Smart Power Strip Reference Design Visit Renesas Electronics Corporation
    Wi-Fi-Smart-Power-Strip Renesas Electronics Corporation Wi-Fi Smart Power Strip Reference Design Visit Renesas Electronics Corporation
    8609153003LF Amphenol Communications Solutions 8609153003LF-DIN KEYING STRIP Visit Amphenol Communications Solutions
    8609153007LF Amphenol Communications Solutions 8609153007LF-DIN KEYING STRIP Visit Amphenol Communications Solutions

    C7025 STRIP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp


    Original     		PDF C7025,

    567297-2

    Abstract: No abstract text available
    Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp


    Original     		PDF C7025, 567297-2

    104480-9 crimp tool

    Abstract: No abstract text available
    Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in


    Original     		PDF C7025, 104480-9 crimp tool

    TM 1222

    Abstract: 1092-HTA m9625 quick disconnect terminal 4na11 M6112 1262TH st 6062 tape IPC-4-45 IPC-4-45T
    Text: Part Number Cross Reference Part Number 7/16 632 BET SC 7/16 SEMS SCREW 348 731 792 798 834 835 836 / 836-TAPE 892 893 894 895 901 906 926 927 928-No Screw 928 934 ST.S 934 ST. SC 934 MSS 948 949 953 953-MOD 956 / 956-No Hole 957 972 972-TAB 983 984 990 1021


    Original     		PDF 836-TAPE 928-No 953-MOD 956-No 972-TAB Termina15 TM 1222 1092-HTA m9625 quick disconnect terminal 4na11 M6112 1262TH st 6062 tape IPC-4-45 IPC-4-45T

    Untitled

    Abstract: No abstract text available
    Text: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability


    Original     		PDF com/catalog/pn/en/104480-4 13-Jun-2012

    Untitled

    Abstract: No abstract text available
    Text: AMPMODU Interconnection System Short Point, Crimp Snap-In Wire-Applied Contacts and Housings Product Facts • Short point of contact mates with .169 [4.29] to .259 [6.58] long post ■ Double-row housings are end-to-end and side-to-side stackable ■ Terminates 32-20 AWG


    Original     		PDF

    FLUX TYPE ROL0

    Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
    Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract


    Original     		PDF ST-300 Workshop/54th FLUX TYPE ROL0 ALLOY leadframe C7025 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194

    AN-772

    Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
    Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents


    Original     		PDF AN-772 EM-2000-011) TM-00-11) AN05425 AN-772 EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp

    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


    Original     		PDF D-93009 ALLOY leadframe C7025 ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415

    Tyco 108-25007

    Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
    Text: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    C7025 strip specification

    Abstract: 103960-1 tyco 108-25034 1307819 103672-3 103673-3 104480-9 crimp tool amp 20 pin shrouded header latches amp tyco applicator AMP Application Specification 114-25026
    Text: Catalog 1307612 Revised 7-01 Product Facts • Receptacle assemblies mate with .025 [0.64] sq. posts; mating post length is .200 [5.08] min., .250 [6.35] max. ■ Proven AMPMODU receptacle contact design; dual cantilever beams, built-in antioverstress, completely


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    N20X DIODE

    Abstract: A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825
    Text: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1


    Original     		PDF 100LPQFP 160LPQFP 28LSOIC N20X DIODE A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    567297-2

    Abstract: No abstract text available
    Text: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,


    OCR Scan     		PDF C7025, 567297-2

    Untitled

    Abstract: No abstract text available
    Text: 1 , 5 t ° 05 s^g 0.3 3.3to 1 9.0 CIRCUIT DIAGRAM _r | (|) tu . to co ^ © © d) HOLE LAYOUT, TOP VIEW ^ 0 05 I 6x 00.9 C: COMMON PIN Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:


    OCR Scan     		PDF 300mA, 70mOhm 50/60Hz, 200gf C7025,

    Untitled

    Abstract: No abstract text available
    Text: 9.0 _r “L CO CO 1 = _ !_ _ = [ o ,1 .5 T csi oo +1 LO 3 ^ CO CO / ,0 .8 P.C.B. LAND DIMENSION Viewed from the switch mounting face CIRCUIT DIAGRAM C Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength:


    OCR Scan     		PDF 70mOhm 50/60HZ, /-150gf C7025,

    Untitled

    Abstract: No abstract text available
    Text: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,


    OCR Scan     		PDF C7025,

    Untitled

    Abstract: No abstract text available
    Text: 9.0 HOLE LAYOUT 0.05 TOP VIEW 6x 0 O.9 r 1.5 t 0 . 05 -x.y -x 2.5 b . 2.5 a 2.0 LO 0.3 L 3.3 . CIRCUIT DIAGRAM Vr// -q C: COMMON PIN 0.25 Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:


    OCR Scan     		PDF 70mOhm 50/60HZ, /-100gf C7025,

    104480-9

    Abstract: 567297-2
    Text: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—


    OCR Scan     		PDF C7025, 104480-9 567297-2