CARRIER 28U Search Results

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

CERAMIC LEADLESS CHIP CARRIER

Contextual Info: ATV750 L Ordering Information Wx (ns) (ns) (MHz) Ordering Code Package 20 20 55 ATV750-20JC"' 28J ATV75U-20PC'1' 24P3 ATV750-20SC'1’ 24S 25 22 45 A T V 7 5 0 -2 0 jr""" "" 28J ATV750-20PI'-’-' 24P3 ATV750-20SI-1-' 24S ATV750-20DM'''1 24DW3 ATV750-20GM!:’-

MO-142

Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,

MJL-STD-1835

Contextual Info: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types.01 Package Description 32B 32 Lead, 0.600” Wide, Ceramic Side Braze Dual Inline Side

TSOP 66 Package

Abstract: TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A
Contextual Info: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

TSOP 66 Package thermal resistance

Abstract: 7244k 20P3 28P6 TSOP 66 thermal resistance
Contextual Info: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 tsop 66 atmel 24c 20P3 28P6 0636C 7244k ATMEL 719 24C
Contextual Info: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

20P3

Abstract: 28P6 ATMEL 40T
Contextual Info: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

atmel Heat Resistance SOIC

Abstract: atmel 24c ATMEL SOIC 8S1 PACKAGE MATERIAL ATMEL Package type 8S1 20P3 28P6 ATMEL 719 24C
Contextual Info: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

eeprom 28c64

Abstract: 5962-87514 AT28C64B-20DM at28c64-20dm AT28C64B-25DM 28C64 EEPROM 5962-88525 15 ZX at28c6425dm smd code led AT28C64-25DM
Contextual Info: Introduction to the SMD Product Listing Each Standard Microcircuit Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MILSTD-883, paragraph 1.2.1 and to the requirements of the applicable standard

ATMEL 350

Abstract: 5962-87514 AT28C64-15DM/883 transistor smd list at28hc64b-70dm atmel 718 AT28C64-20DM "SMD Code" SMD CODE list smd code book
Contextual Info: SMD Products Introduction to the SMD Product Listing Each Standard Microcircuit Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MILSTD-883, paragraph 1.2.1 and to the requirements of the applicable standard

5962-88525 15 ZX

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC AT28C256 CERAMIC LEADLESS CHIP CARRIER AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F
Contextual Info: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER AT28C256 AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F
Contextual Info: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

at28c256

Abstract: ATMEL at28c256
Contextual Info: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

28c256 atmel

Abstract: AT28C256 AT28C256-25 32-pad 28C256 AT28C256-15 AT28C256-20 AT28C256-35 AT28C256F
Contextual Info: Features • Fast Read Access Time - 150 ns • Automatic Page Write Operation • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

ATMEL at28c256

Abstract: AT28C256 AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F
Contextual Info: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

Contextual Info: Features • Fast Read Access Time - 150 ns • Automatic Page Write Operation - Internal Address and Data Latches for 64 Bytes - Internal Control Timer • Fast Write Cycle Times - Page Write Cycle Time: 3 ms or 10 ms Maximum - 1 to 64-Byte Page Write Operation

EZ722

Abstract: A7t smd EZ524 smd code A7t smd A6t zd 409 5962-88525 07 xa Select 642 UX A14C AT28C256
Contextual Info: Features • Fast Read Access Time -150 ns • Automatic Page Write Operation - Internal Address and Data Latches for 64 Bytes - Internal Control Timer • Fast Write Cycle Times - Page Write Cycle Time: 3 ms or 10 ms Maximum - 1 to 64-Byte Page Write Operation

Contextual Info: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

28HC256

Abstract: AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F
Contextual Info: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum

28HC256

Abstract: AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F
Contextual Info: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum