CBGA Search Results

61995AB124D1

Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm

N429

Abstract: S-CBGA-N429
Contextual Info: MECHANICAL DATA MCBG004 – SEPTEMBER 1998 GLP S-CBGA-N429 CERAMIC BALL GRID ARRAY 27,20 SQ 26,80 25,40 TYP 1,27 1,27 AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 1,22 1,00 5 4 9 7 6 8 10 11 13 15 17 19 21 12 14 16 18 20 3,30 MAX Seating Plane 0,90 0,60

Contextual Info: MECHANICAL DATA MCBG005 – NOVEMBER 1998 GLK S-CBGA-N567 CERAMIC BALL GRID ARRAY 31,20 SQ 30,80 29,21 TYP 1,27 0,635 0,635 1,27 AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 7 5 4 6 9 8 10 11 13 15 17 19 21 23 12 14 16 18 20 22 24 3,30 MAX Seating Plane

FXBI04

Abstract: CY7C965 Signal Path Designer CY7C96
Contextual Info: ADVANCED INFORMATION CY7C965 Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Fault tolerant systems may require the implementation of mul­ tiple redundant paths between nodes in the fabric. Time-critical elements in the fabric may require interrupt support, low

reliability data

Abstract: MOS13 XPC7410 XPC7410RX
Contextual Info: M XPC7410RX RELIABILITY DATA SUMMARY XPC7410 Fab: Mask: Process: Package: Assy: - Nitro - Information MOS13, Austin, TX K65D HiP6L 25 x 25 mm CBGA, 360 Pin BAT-1, Austin, Tx XPC7410 - Nitro - TECHNOLOGY: MOS13 on the 0.15µm Nominal HiP6L process DYNAMIC LIFETEST (2.35V, 90°C)

120C

Abstract: 140C 210C
Contextual Info: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using

16M Flash Memory

Abstract: AT49BV163D
Contextual Info: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •

3466A

Abstract: AT52BC3221A AT52BC3221AT SA70
Contextual Info: Features • 32-Mbit Flash and 4-Mbit/8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • • • • • • • • • • • • • • 32-megabit (2M x 16) 2.7V to 3.3V Read/Write Access Time – 70 ns

CBGA

Contextual Info: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top

Contextual Info: data sheet CERAMIC / HERMETIC CMCM Ceramic Multi-Chip Module Package CMCM The MCM/CBGA and MCM/PBGA by Amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package

DH11

Abstract: DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29
Contextual Info: OFFICIAL - 9/17/97 CBGA Footprints Rev. F 603 Family CBGA C16 E04 D13 F02 D14 G01 D15 E02 D16 D04 E13 G02 E15 H01 E16 H02 F13 J01 F14 J02 F15 H03 F16 F04 G13 K01 G15 K02 H16 M01 J15 P01 L02 K04 C01 B04 B03 B02 A04 B07 J04 A10 L01 B06 E01 D08 A06 D07 B01 B05

FCS 1861

Abstract: wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER
Contextual Info: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Pin Number Signal Name Active I/O A [0-31 C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G 0 2 , E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,

12-Bit Parallel-IN Serial-OUT Shift Register

Abstract: cypress IM103 adaptive cruise control cruise control CYIA2SC0300AA-BQE Glass Seal Cmos imager sensor
Contextual Info: CYIA2SC0300AA-BQE 1/3” VGA-Format CMOS Image Sensor Features • • • • • • 1 VGA Resolution 1/3” Optical Format Automotive Grade device 120 db Dynamic Range 60 PIN CBGA Low power dissipation Functional Description Cypress IM103 is Automotive grade CMOS Image Sensor with

intercom phone system block diagram

Abstract: audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller
Contextual Info: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack

BGA reflow guide

Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Contextual Info: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

AT52BR1672

Abstract: AT52BR1674
Contextual Info: Features • 16-Mbit Flash and 2-Mbit/4-Mbit SRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • •

LC2D

Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting
Contextual Info: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned

SA8 357

Abstract: AT52BR3244 AT52BR3244T SA10 SA11 SA70
Contextual Info: Features • 32-Mbit Flash and 4-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • • • • • •

PC755BM8

Abstract: MCP 67 MV PC745 PC755M8 PCX755B
Contextual Info: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz

Contextual Info: CYPRESS ADVANCED INFORMATION Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Building Block for Scaleable Networks Preemptable prioritized transactions Adaptive Routing support

3618A

Contextual Info: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •

66c4

Contextual Info: Features • 32-Mbit Flash and 4-Mbit/8-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85, 90, 110 ns • Sector Erase Architecture • • • • • • •

AT52BC6402DT-70CU

Abstract: 3619a AT49BV640D AT52BC6402D AT52BC6402DT 66C7
Contextual Info: Features • 64-Mbit Flash and 16-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.1V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •