CBGA MOTOROLA Search Results

CBGA

Contextual Info: 1.5 Pin Assignments Motorola and IBM both offer a ceramic bail grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout o f the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top

CBGA

Contextual Info: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

PowerPC-604e

Abstract: microprocessor pin
Contextual Info: 1.5 PowerPC 604e Microprocessor Pin Assignments The following sections contain the pinout diagrams for the 604e. Note that the 604e is currently offered by Motorola and IBM in a ceramic ball grid array CBGA package. The IBM and Motorola CBGA packages have identical pinouts.

b09 n03

Abstract: A09 N03 B07 P03
Contextual Info: 1.6 PowerPC 604e Microprocessor Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Signal Name Pin Number Active I/O A[0—31 ] C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13,

l03 H04

Abstract: SIGNAL PATH DESIGNER AAVID THERMALLOY COMPOUND 350
Contextual Info: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Signal Name Pin Number Active I/O AfO-31] C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G02, E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,

FCS 1861

Abstract: wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER
Contextual Info: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Pin Number Signal Name Active I/O A [0-31 C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G 0 2 , E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,

Die Attach epoxy stamping

Abstract: flotherm MODEL U.S.A Eurotherm Controls Eurotherm 461
Contextual Info: The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors 1 1 2 John Parry , Harvey Rosten and Gary B. Kromann 1 Flomerics Group plc 81 Bridge Road Hampton Court

intercom phone system block diagram

Abstract: audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller
Contextual Info: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack

P6434

Abstract: LA-BGA-MPC7445-Z-B-01 MPC7445 TLA700 ST 0366 mictor
Contextual Info: Page 1 of 3 3.100" [78.74mm] Description: Logic Analyzer Adaptor for Motorola MPC7445 and TEKTRONIX TLA700 Series Logic Analyzer 360 position CBGA surface mount lands to 360 position surface mount BGA foot with high density Mictor connectors with latch housing for connection of Tektronix P6434 probes . Pin assignment

intercom phone system block diagram

Abstract: Intercom hands free audio howling mic preamp with echo ZL38004 Application of Intercom MT93L16 ZL38001 ZL38003 ZL38003GMG
Contextual Info: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack

micro electret

Abstract: echo mic preamp Intercom hands free intercom phone system block diagram Analog ECHO microphone electret mic mic preamp with echo MT93L16 ZL38001 ZL38002
Contextual Info: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet A full Design Manual is available to qualified customers. To register, please send an email to VoiceProcessing@Zarlink.com. May 2006 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack

TMS 320 C 6X processor

Abstract: 2164A PC745 PC755M8 2164A dynamic ram cop interface l2-dp
Contextual Info: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 300 MHz Maximum L2 Cache Frequency = 150 MHz Maximum 60x Bus Frequency = 66 MHz

S1998

Abstract: Coffin-Manson Equation CBGA manson 100C 110C N100 N50M IBM supports ccga CBGA 304 motorola
Contextual Info: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S. Goldmann IBM Microelectronics Hopewell Jct, New York 12533 Biography Marie Cole is a Senior Engineer in Ceramic Packaging Applications at IBM Microelectronics. She holds a B.S.

7448

Abstract: 7448 datasheet "hard drive" pcb Mictor 48-Z-B-01 P6434 MPC7447
Contextual Info: Page 1 of 3 3.100" [78.74mm] Top View 2.800" [71.12mm] Description: Logic Analyzer Adaptor for Motorola MPC7447/7448 and TEKTRONIX TMS546 Series Logic Analyzer 360 position CBGA surface mount lands to 360 position surface mount BGA foot with high density Mictor connectors with latch housing for connection of Tektronix P6434 probes . Pin assignment

PC755BM8

Abstract: MCP 67 MV PC745 PC755M8 PCX755B
Contextual Info: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz

cop interface

Abstract: PC745 PC755M8 PLL VCO MIL-PRF-38535 X755M
Contextual Info: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz

PC745

Abstract: PC755M8 PCX755B
Contextual Info: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz

Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

S4804

Abstract: hdlc GR-253 STM-16 STS-48 AU4A
Contextual Info: Part Number - S4804 Revision 1.2 - July 2000 RHINE ADVANCED SUMMARY DATASHEET STS-48 POS/ATM SONET MAPPER Features • Provides a SONET/SDH STS-48/STM-16, 4 STS-12/STM4, or 16 STS-3/STM-1 line interfaces. • Packaged in a 624 Pin CBGA. The S4804 is a highly-integrated VLSI device that provides

90Pb 10Sn solder paste

Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA

62Sn36Pb2Ag

Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

CBGA 255 motorola

Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

CQFP 240

Abstract: MIPs datasheet
Contextual Info: Motorola PowerPC CPU Summary revised 05-18-98 EC603e 100-133 MHz 603e 166-200 MHz 166-300 MHz 100 MHz 133 MHz 166 MHz 200 MHz 166 MHz 200 MHz 233 MHz 266 MHz 300 MHz x1.5, x2, x2.5, x3, x3.5, x4 x2, x2.5, x3, x3.5, x4, x4.5, x5, x5.5, x6 Bus Interface 64- & 32-bit