CHIPS TECHNOLOGY MSL Search Results

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

MSL-155XX

Contextual Info: MSL-155XX SERIES Surface Mount Bi-Color Chip LEDs Package Dimensions The MSL-155xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for LED die B (Long wavelength) 2.7 (.106) + range choices in wavelength and intensity . They are

MSL-155XX

Contextual Info: Surface Mount Bi-Color Chip LEDs Description MSL-155XX SERIES Package Dimensions The MSL-155xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for SMT assembly method . This series contain different

Contextual Info: Surface Mount Bi-Color Chip LEDs Description MSL-156X SERIES Package Dimensions The MSL-156xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for SMT assembly method . This series contain different

APD0520-000

Contextual Info: DATA SHEET APD Series: Silicon PIN Diode Chips Features Established Skyworks PIN diode process For switch and attenuator applications ● Low capacitance designs to 0.05 pF ● Voltage ratings to 100 V ● Chip size smaller than 15 mils square ● Available Green MSL-1 @ 250 °C per JEDEC J-STD-020

TRILITHIC

Abstract: P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1 7741G
Contextual Info: Powe r Key Features: • No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C ■ Green materials - no antimony III Robust Package for OptiMOS BTS 7741G & BTS 7751G Join the TrilithIC Family As a result of recent environmental concerns regarding the use of lead, the

AN2348

Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Contextual Info: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.

EIA standards 783

Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Contextual Info: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.

PXA27x

Abstract: sychip wifi schematic PXA27x Processor Family Users Manual schematic GSM Modem USB wifi to i2c schematic intel MSL wifi schematic in mobile wifi transceiver chip wi fi
Contextual Info: Interfacing the Intel PXA27x Processor Family to 802.11 Companion Chips Application Note Document Order Number: 280009-001 Information in this document is provided in connection with Intel ® products. No license, express or implied, by estoppel or otherwise, to any intellectual

PHILIPS UOC tv kit service code with data

Abstract: All nokia mobile ic code number image BCM3419 Nokia BTS BENQ gsm module circuit PNX8550 CMOS Camera Module NOKIA philips 5.1 home theater remote control ic 14 pin CHINA TV uoc Broadcom product roadmap
Contextual Info: World News Volume 13 Semiconductors Number 2 Technology Focus May - June 2004 Inside World News page Automotive 2 Networking 3 Technology 4 to 6 Consumer 7&8 MultiMarket Semiconductors Identification 10 Products in brief 11 Communications 12 First 32-bit IVN gateway controller

Clock Generators

Contextual Info: IDT - Integrated Device Technology - Clock Generators PLL > 841204-245 > 841204B. Page 1 of 2 Integrated Device Technology Products | Applications Clock / Timing Devices | Search Clock Distribution | Support The Analog and Digital Company | Investor

smd transistor h2a

Abstract: H2A SMD transistor H2A transistor SMD transistor smd H2A SMD Transistor Y8 TSHARC-12D TSHARC A2 smd transistor Y10 HSA2-040SIA/A2S23 HSA2-040SAA/A2320A
Contextual Info: TSHARC-A2 Touch Screen Microcontroller Application Guide Ver. 2.0 3.3 – 5vDC 28 pin SOIC 12 – Bit Resolution TTL, RS-232 and USB

PEAK tray drawing 3x3

Contextual Info: SBT-90 Product Datasheet SBT-90 LEDs Features: • Extremely high optical output: Over 1,800 lumens at 9.0A from a single chip white Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3

luminus

Abstract: microdisplay SBT-90 The MicroDisplay
Contextual Info: SBT-90 Product Datasheet SBT-90 LEDs Features: • Extremely high optical output: Over 1,300 lumens at 9.0A from a single chip white Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3

Semicon volume 1

Abstract: microcontroller based cell phone detector PROJECT sgs 601 gas sensor
Contextual Info: EPSON CMOS LSIs Product Catalog 2013 Microcontrollers 4-bit / 16-bit / 32-bit Gate Arrays / Embedded Arrays / Standard Cells 2010 2010 CMOS LSIs Product Catalog ASICs CMOS LSIs Product Catalog 2013 ASSPs Application Specific Standard Products 2013 http://www.epson.jp/device/semicon_e/

Contextual Info: SST-50 W Product Datasheet SST-50 W LEDs Features: Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3 Chromaticity Bins. . . . . . . . . . 4 • Extremely high optical output: Over 1,150 lumens from a single chip white

Contextual Info: SST-50 W Product Datasheet SST-50 W LEDs Features: Table of Contents Technology Overview . . . . . .2 Test Speciications . . . . . . . . .2 White Binning Structure . . . .3 • Extremely high optical output: Over 1,150 lumens from a single chip white • Extremely high eiciency: Over 100 lumens per watt at 1.75A

Harris CMOS Integrated Circuits

Abstract: AN6525 CD4001BEX AN6532 IC CD4047 CD4001* using NAND gates CD4094B FREE CD4047B Harris an6558 Harris an6532
Contextual Info: Technical Overview CD4000B Series Dynamic power dissipation has three components: 1. The dissipation that results from current that charges and discharges the external load capacitance of the output buffers. The dissipation of each output buffer is equal to

CWR11

Abstract: T49x
Contextual Info: TANTALUM CHIP CAPACITORS PRODUCT DESCRIPTION KEMET’s family of solid tantalum chip capacitors is designed and manufactured with the demanding requirements of surface mount technology in mind. These devices extend the advantages of solid tantalum technology to today’s surface mount circuit

Tantalum Capacitor kemet 10 uF

Abstract: 104 TANTALUM capacitor 3528 FOR SMPS 7343 PACKAGE DIMENSIONS capacitive discharge ignition chip capacitors 3528 eia 3216-12 capacitor tantalum CD 7343 datasheet dielectric absorption mechanism
Contextual Info: TANTALUM CHIP CAPACITORS PRODUCT DESCRIPTION KEMET’s family of solid tantalum chip capacitors is designed and manufactured with the demanding requirements of surface mount technology in mind. These devices extend the advantages of solid tantalum technology to today’s surface mount circuit

IC 7806 working

Abstract: pin of 7806 ic puls transformer 141CT E5002 E5002NL E5002NLT E5002T PE-68051 PE-68062L
Contextual Info: 10BASE-T QUAND SMT TRANSFORMER MODULES For RoHS part add suffix NL5 Peak solder temperature rating per Table 5-2 in IPC/ JEDEC J-STD-020C Family of parts – common foot print and pinout with a choice of filtering for customized EMI performance Space-efficient – 12 ports across 3.6 inches for

TPS65168

Abstract: TPS65194 intel i3 mtbf TPS65168RSBR
Contextual Info: Lighting and Display Solutions - LCD/OLED Display Bias Solutions - TPS65168 - TI.com Page 1 of 3 Samples & Purchase Cart | Contact Us | TI Worldwide: United States | my.TI Login All Searches Search by Keyword GO Search by Part Number GO TI Home > Semiconductors > Power Management > Lighting and Display Solutions > LCD/OLED Display Bias Solutions >

DS90C583

Abstract: D SUB 15 MALE VGA PIN OUT 30 pin LCD connector CH-4542 DS90CF584 PC104 connector 20 pin lcd VGA 15 PIN wiring DIAGRAM DS90C563 lcd 7" 18-bit digital
Contextual Info: TECHNICAL USER'S MANUAL FOR: PERIPHERAL BOARD MSLVDS- T ransmitter MSLVDS- R eceiver Nordstrasse 11/F CH- 4542 Luterbach Tel.: +41 0 32 681 58 00 Fax: +41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com DIGITAL-LOGIC AG