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    COMPOUND C7025 Search Results

    COMPOUND C7025 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SMOD707KITV1 Renesas Electronics Corporation Volatile Organic Compound (VOC) Sensor Evaluation Kit Visit Renesas Electronics Corporation
    D12320VTE20V Renesas Electronics Corporation Microcontrollers for General Purpose System Control Applications (Non Promotion), TFQFP, / Visit Renesas Electronics Corporation
    D12324SVF25V Renesas Electronics Corporation Microcontrollers for General Purpose System Control Applications (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    D12373RVFQ33V Renesas Electronics Corporation Microcontrollers for General Purpose System Control Applications (Non Promotion), LQFP, /Tray Visit Renesas Electronics Corporation
    D12670VFC33V Renesas Electronics Corporation High-end Microcontrollers for Automotive Control and Factory Automation Applications (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    COMPOUND C7025 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sumitomo epoxy

    Abstract: C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo
    Text: Cypress Semiconductor Qualification Report QTP# 99302 VERSION 1.0 November, 1999 32L Small Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069


    Original     		PDF 7351LS C7025 85C/85% CY62128V-ZAIB sumitomo epoxy C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo

    ABLEBOND

    Abstract: No abstract text available
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086L, JESD78, ABLEBOND

    G700K

    Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026

    Sumitomo G700K

    Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL

    Nitto MP8000

    Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026

    Sumitomo G700K

    Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K

    sumitomo G700

    Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
    Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF

    LMISR4

    Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
    Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com


    Original     		PDF DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841

    JESD78

    Abstract: Sumitomo 6730B Compound c7025 RH-1750
    Text: 05/04/2004 RELIABILITY REPORT FOR DS2770, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750

    QMI519

    Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
    Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


    Original     		PDF epax02 Ext686 MM74HCT00MTCX MM74HCT05MTC MM74HCT08MTCX MM74HCT14MTC MM74HCT240MTCX QMI519 KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel

    Untitled

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS80C310, JESD78,

    7320CR

    Abstract: Eftec 64t
    Text: 03/06/2003 RELIABILITY REPORT FOR DS21552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS21552, JESD78, 7320CR Eftec 64t

    tanaka wire

    Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL


    Original     		PDF G9911-05 KMC184 KMC184VA EME-6730 EME-9730 Mil-Std-883, tanaka wire MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 tanaka wire 10 mils

    ALLOY leadframe C7025 material property

    Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
    Text: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore


    Original     		PDF

    J-STD-020

    Abstract: S0309
    Text: 08/02/2004 RELIABILITY REPORT FOR DS1267, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1267, J-STD-020 S0309

    9936

    Abstract: 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b
    Text: 11/05/2003 RELIABILITY REPORT FOR DS1780, Rev A4, 24 TSSOP 4.4mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF DS1780, 9936 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b

    9936

    Abstract: 9936 b EFTEC 64T Epoxy
    Text: 12/04/2002 RELIABILITY REPORT FOR DS21Q42 & DS21Q44 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS21Q42 DS21Q44 30C/60% 9936 9936 b EFTEC 64T Epoxy

    Ablestik 84-1

    Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
    Text: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM


    Original     		PDF CS100HEE CS100HEE 200mA 200mA) 200mA FM93C46EA FM93C56CA FM93C66BA FM93C86AA FM93CS46AA Ablestik 84-1 KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester

    CDA 194

    Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
    Text: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.


    Original     		PDF D2863-77, CDA 194 jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108

    FLUX TYPE ROL0

    Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
    Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract


    Original     		PDF ST-300 Workshop/54th FLUX TYPE ROL0 ALLOY leadframe C7025 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194

    AN-772

    Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
    Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents


    Original     		PDF AN-772 EM-2000-011) TM-00-11) AN05425 AN-772 EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp

    ph44

    Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark


    Original     		PDF G9911-04 Mil-Std-883, S-7390) S-7383 ph44 Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025

    Infineon diffusion solder

    Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
    Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com


    Original     		PDF D-93009 F-38019 Infineon diffusion solder Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 OLIN194

    10190N

    Abstract: tsmc Activation Energy
    Text: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A


    Original     		PDF L28-TSMC CY2280 CY2280PVC 100-MHz CY2280-OC 85C/85 10190N tsmc Activation Energy