COPPER BOND WIRE AMKOR Search Results
COPPER BOND WIRE AMKOR Result Highlights (2)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| DP83869HMRGZT |
|
High-immunity gigabit Ethernet PHY with copper & fiber interface 48-VQFN -40 to 125 |
|
|
|
| DP83869HMRGZR |
|
High-immunity gigabit Ethernet PHY with copper & fiber interface 48-VQFN -40 to 125 |
|
COPPER BOND WIRE AMKOR Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
copper wire datasheet
Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
|
Original |
||
DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
|
Original |
DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G | |
aec-q100
Abstract: AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782
|
Original |
MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433 92MHz 32-Lead AEC-Q100 QYK0BQ001D) MAX7042ATJ AEC-Q100 LF12Z AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782 | |
|
Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost. |
Original |
40mil 55/60nm 45/40nm 28/22nm | |
Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
|
Original |
DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL | |
ABLEBONDContextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS1086L, JESD78, ABLEBOND | |
G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
|
Original |
DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026 | |
Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
|
Original |
DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026 | |
Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
|
Original |
DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K | |
mark a7 sot23
Abstract: J-STD-20A atec 6710S CDA194 mp8000
|
Original |
DS1816, JESD78, mark a7 sot23 J-STD-20A atec 6710S CDA194 mp8000 | |
CDA194
Abstract: mark a7 sot23
|
Original |
DS1810, JESD78, CDA194 mark a7 sot23 | |
LMISR4Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS1811, JESD78, LMISR4 | |
CDA194
Abstract: mark a7 sot23 mold compound
|
Original |
DS1817, JESD78, CDA194 mark a7 sot23 mold compound | |
|
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS1818, JESD78, | |
|
|
|||
Ablebond 84-1 LMISR4Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS1812, JESD78, Ablebond 84-1 LMISR4 | |
|
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS1813, JESD78, | |
sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
|
Original |
||
LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
|
Original |
DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841 | |
JESD78
Abstract: Sumitomo 6730B Compound c7025 RH-1750
|
Original |
DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750 | |
cu pillar
Abstract: pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology
|
Original |
C/125 1000X 1000hrs cu pillar pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology | |
|
Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a |
Original |
DS550R | |
|
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
Original |
DS80C310, JESD78, | |
cu pillar
Abstract: Amkor Technology amkor flip PoP PACKAGE TESTING
|
Original |
1000hrs cu pillar Amkor Technology amkor flip PoP PACKAGE TESTING | |
PA168
Abstract: A3PE3000L-1PQ208I A3P400-1FG144
|
Original |
1201B PCN1201 PCN1201A, useNG68 AGLN010V2-QNG48I AGLN020V2-QNG68 AGLN030V2-ZQNG68I AGLN010V5-QNG48 AGLN020V2-QNG68I AGL030V5-QNG48 PA168 A3PE3000L-1PQ208I A3P400-1FG144 | |