CPGA Search Results

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

S-CPGA-P181

Contextual Info: MECHANICAL DATA MCPG020 – NOVEMBER 1995 GE S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.060 (1,52) 0.040 (1,02)

CPGA

Abstract: cpga dimensions
Contextual Info: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed

top 48 C1

Contextual Info: MECHANICAL DATA MCPG005A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P13 X 13 CERAMIC PIN GRID ARRAY A or A1 SQ 1.200 (30,48) TYP N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 DIM B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55)

F 524

Abstract: MO-067 MO-066 CMGA13-PN S-CPGA-P68
Contextual Info: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)

PQFP chip size

Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ

CPGA223

Abstract: sot738
Contextual Info: PDF: 2002 Nov 13 Philips Semiconductors Package outline SOT738-1 CPGA223: ceramic pin grid array package; 223 pins; body 47.25 x 47.25 x 2.8 mm D pin 1 index mark location VSS VDD A2 E A1 L detail X VDD VSS D1 e 1/2 e b e V U T R P N M L K E1 J H 1/2 G e F

CPGA84

Abstract: CPGA sot258 cpga84 Package SOT258-2
Contextual Info: PDF: 2002 Nov 01 Philips Semiconductors Package outline SOT258-2 CPGA84: ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 X

Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK

CMGA23

Contextual Info: MECHANICAL DATA MCPG011A – JANUARY 1997 GA-GB S-CPGA-P19 X 19 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.800 (45,72) TYP W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DIM B or B1 MIN MAX Notes A 1.940 (49,28) 1.980 (50,29)

Contextual Info: MECHANICAL DATA MCPG013E – JUNE 1997 GF S-CPGA-P325 CERAMIC PIN GRID ARRAY PACKAGE 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35

Contextual Info: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)

Contextual Info: MECHANICAL DATA MCPG010A – JANUARY 1997 GA-GB S-CPGA-P18 X 18 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.700 (43,18) TYP V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 DIM B or B1 C or C1 0.140 (3,56) 0.120 (3,05) 0.050 (1,27) DIA

ceramic pin grid array package

Abstract: CMGA7-P145C G145 CMGA7-P145
Contextual Info: Ceramic Package Ceramic Pin Grid Array Packages CPGA S1 G145.A MIL-STD-1835 CMGA7-P145C (P-AG) –A– D 145 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E SYMBOL MIN MAX MIN MAX NOTES A 0.215 0.345 5.46 8.76 - A1 0.070 0.145 1.78 3.68 3 b

Contextual Info: MECHANICAL DATA MCPG014 – OCTOBER 1995 GB S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.055 (1,40) 0.045 (1,14)

Contextual Info: MECHANICAL DATA MCPG001A – JANUARY 1997 GA-GB S-CPGA-P9 X 9 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.800 (20,32) TYP J H G F E D C B A 1 2 DIM 0.100 (2,54) 0.050 (1,27) DIA 4 Places 0.016 (0,41) 4 MIN 5 6 7 8 9 MAX A 0.940 (23,88) 0.980 (24,89) A1 0.880 (22,35)

cpga dimensions

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G36.760x760A 36 LEAD CERAMIC PIN GRID ARRAY PACKAGE 15 17 19 21 22 A 0.008 (0.20) 13 14 12 11 16 18 20 23 24 25 26 0.050 (1.27) A 10 9 27 28 8 7 29 30 NOTE: Leads 5, 14, 23, & 32

Contextual Info: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)

Contextual Info: Nomenclature Guide HMU/HMA Types H MU 16 J C - PREFIX FAMILY MU: Multiplier MA: Multiplier/ Accumulator DEVICE TYPE 16, 17, 510 PACKAGE DESIGNATOR J: Plastic Leaded Chip Carrier PLCC G: Ceramic Pin Grid Array (CPGA) 1 35 /883 HIGH RELIABILITY DESIGNATOR

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

Contextual Info: Package outline SOT258-2 CPGA84: ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 X seating plane DIMENSIONS mm dimensions are derived from the original inch dimensions

Contextual Info: MECHANICAL DATA MCPG013E – JANUARY 1995 – REVISED JUNE 1997 GF S-CPGA-P325 CERAMIC PIN GRID ARRAY 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35

4914B

Abstract: 361 pin CPGA large cavity MCPG011A
Contextual Info: MECHANICAL DATA MCPG011A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P19 X 19 CERAMIC PIN GRID ARRAY A or A1 SQ 1.800 (45,72) TYP W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DIM B or B1 MIN MAX Notes A

MO-067-AJ

Contextual Info: MECHANICAL DATA MCPG009A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline