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    CPGA Search Results

    CPGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG80C186-12/BZC Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MC68040RC33A Rochester Electronics LLC Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 179 CPGA Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-12/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-10/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    TA80C186XL-20 Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
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    CPGA Price and Stock

    AMD XC7S15-1CPGA196I

    IC FPGA 100 I/O 196CSBGA
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    AMD XC7S15-1CPGA196C

    IC FPGA 100 I/O 196CSBGA
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    AMD XC7S6-2CPGA196I

    IC FPGA 100 I/O 196CSBGA
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    DigiKey XC7S6-2CPGA196I Tray 14 1
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    AMD XC7S15-2CPGA196C

    IC FPGA 100 I/O 196CSBGA
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    DigiKey XC7S15-2CPGA196C Tray 12 1
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    AMD XC7S15-2CPGA196I

    IC FPGA 100 I/O 196CSBGA
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    DigiKey XC7S15-2CPGA196I Tray 4 1
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    Find more CPGA price and stock on Findchips.com

    CPGA Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    CPGA Amkor Technology Ceramic Pin Grid Array Package Original PDF

    CPGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    S-CPGA-P181

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG020 – NOVEMBER 1995 GE S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.060 (1,52) 0.040 (1,02)


    Original     		PDF MCPG020 S-CPGA-P181) 4073425/A S-CPGA-P181

    top 48 C1

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG005A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P13 X 13 CERAMIC PIN GRID ARRAY A or A1 SQ 1.200 (30,48) TYP N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 DIM B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55)


    Original     		PDF MCPG005A S-CPGA-P13 4040114XIMUM MIL-STD-1835 CMGA17-PN, MO-067AE MO-066AE, top 48 C1

    F 524

    Abstract: MO-067 MO-066 CMGA13-PN S-CPGA-P68
    Text: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)


    Original     		PDF MCPG023 S-CPGA-P68) 4040114-14/C CMGA13-PN MO-067 MO-066 F 524 S-CPGA-P68

    PQFP chip size

    Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
    Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ


    Original     		PDF

    CPGA223

    Abstract: sot738
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline SOT738-1 CPGA223: ceramic pin grid array package; 223 pins; body 47.25 x 47.25 x 2.8 mm D pin 1 index mark location VSS VDD A2 E A1 L detail X VDD VSS D1 e 1/2 e b e V U T R P N M L K E1 J H 1/2 G e F


    Original     		PDF OT738-1 CPGA223: CPGA223 sot738

    CPGA84

    Abstract: CPGA sot258 cpga84 Package SOT258-2
    Text: PDF: 2002 Nov 01 Philips Semiconductors Package outline SOT258-2 CPGA84: ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 X


    Original     		PDF OT258-2 CPGA84: CPGA84 CPGA sot258 cpga84 Package SOT258-2

    Untitled

    Abstract: No abstract text available
    Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK


    Original     		PDF

    CMGA23

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG011A – JANUARY 1997 GA-GB S-CPGA-P19 X 19 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.800 (45,72) TYP W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DIM B or B1 MIN MAX Notes A 1.940 (49,28) 1.980 (50,29)


    Original     		PDF MCPG011A S-CPGA-P19 CMGA23

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG013E – JUNE 1997 GF S-CPGA-P325 CERAMIC PIN GRID ARRAY PACKAGE 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35


    Original     		PDF MCPG013E S-CPGA-P325)

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		PDF MCPG004A S-CPGA-P12

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG010A – JANUARY 1997 GA-GB S-CPGA-P18 X 18 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.700 (43,18) TYP V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 DIM B or B1 C or C1 0.140 (3,56) 0.120 (3,05) 0.050 (1,27) DIA


    Original     		PDF MCPG010A S-CPGA-P18

    ceramic pin grid array package

    Abstract: CMGA7-P145C G145 CMGA7-P145
    Text: Ceramic Package Ceramic Pin Grid Array Packages CPGA S1 G145.A MIL-STD-1835 CMGA7-P145C (P-AG) –A– D 145 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E SYMBOL MIN MAX MIN MAX NOTES A 0.215 0.345 5.46 8.76 - A1 0.070 0.145 1.78 3.68 3 b


    Original     		PDF MIL-STD-1835 CMGA7-P145C 5M-1982. ceramic pin grid array package CMGA7-P145C G145 CMGA7-P145

    CMGA3-P84C

    Abstract: CMGA3-P84
    Text: Ceramic Package Ceramic Pin Grid Array Packages CPGA G84.A MIL-STD-1835 CMGA3-P84C (P-AC) S1 84 LEAD CERAMIC PIN GRID ARRAY PACKAGE –A– D INCHES D1 –B– S E1 E SYMBOL MIN MAX MIN MAX NOTES A 0.215 0.345 5.46 8.76 - A1 0.070 0.145 1.78 3.68 3 b 0.016


    Original     		PDF MIL-STD-1835 CMGA3-P84C 5M-1982. CMGA3-P84C CMGA3-P84

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG014 – OCTOBER 1995 GB S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.055 (1,40) 0.045 (1,14)


    Original     		PDF MCPG014 S-CPGA-P181) 4073426/A

    cpga dimensions

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G36.760x760A 36 LEAD CERAMIC PIN GRID ARRAY PACKAGE 15 17 19 21 22 A 0.008 (0.20) 13 14 12 11 16 18 20 23 24 25 26 0.050 (1.27) A 10 9 27 28 8 7 29 30 NOTE: Leads 5, 14, 23, & 32


    Original     		PDF 760x760A cpga dimensions

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)


    Original     		PDF MCPG023 S-CPGA-P68) 4040114-14/C 76ocal

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HMU/HMA Types H MU 16 J C - PREFIX FAMILY MU: Multiplier MA: Multiplier/ Accumulator DEVICE TYPE 16, 17, 510 PACKAGE DESIGNATOR J: Plastic Leaded Chip Carrier PLCC G: Ceramic Pin Grid Array (CPGA) 1 35 /883 HIGH RELIABILITY DESIGNATOR


    Original     		PDF MIL-STD-883, 1-888-INTERSIL

    ME 1117

    Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
    Text: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6


    Original     		PDF 84-Pin 100-Pin MO-136 ME 1117 MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions

    Untitled

    Abstract: No abstract text available
    Text: Package outline SOT258-2 CPGA84: ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 X seating plane DIMENSIONS mm dimensions are derived from the original inch dimensions


    Original     		PDF OT258-2 CPGA84:

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG013E – JANUARY 1995 – REVISED JUNE 1997 GF S-CPGA-P325 CERAMIC PIN GRID ARRAY 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35


    Original     		PDF MCPG013E S-CPGA-P325) MO-128AK

    4914B

    Abstract: 361 pin CPGA large cavity MCPG011A
    Text: MECHANICAL DATA MCPG011A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P19 X 19 CERAMIC PIN GRID ARRAY A or A1 SQ 1.800 (45,72) TYP W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DIM B or B1 MIN MAX Notes A


    Original     		PDF MCPG011A S-CPGA-P19 MIL-STD-1835 CMGA11-PN CMGA23-PN, MO-067AL MO-066AL, 4914B 361 pin CPGA large cavity MCPG011A

    MO-067-AJ

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG009A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline


    Original     		PDF MCPG009A S-CPGA-P17 MIL-STD-1835 CMGA21-PN, MO-067AJ MO-066AJ, MO-067-AJ

    Untitled

    Abstract: No abstract text available
    Text: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </


    OCR Scan     		PDF 1200XL

    CPGA

    Abstract: cpga dimensions
    Text: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed


    OCR Scan     		PDF