D0324 Search Results

car amplifier

Contextual Info: • bbS3T31 D0324b3 401 H A P X N AUER PHIL IPS /DISCRE TE b'îE » OM2Q45 HYBRID INTEGRATED CIRCUIT VHF/UHF WIDE-BAND AMPLIFIER One-stage wide-band amplifier in hybrid integrated circuit technique on a thin-film substrate, intended for aerial amplifiers in car radios, caravans or RATV and M ATV applications.

Contextual Info: HN29WT800/HN29WB800 Series 1048576-word x 8-bit / 524288-word x 16-bit CMOS Flash Memory HITACHI ADE-203-537 Z Preliminary - Rev. 0.0 J u n .14,1996 Description The Hitachi HN29WT800 Series, HN29WB800 Series are 1-Mword x 8-bit/512-kword x 16-bit CMOS Flash Memory with DINOR (Divided bitlineNOR) type memory cells, thatrealize programming and erase

Z08030, Z08530

Abstract: Z8523010VSC Z85230 Z8523010VEC Z8523016VEC ESCC technical manual IN SDLC PROTOCOL Z08030 Z8523020PSC M043
Contextual Info: Pr o d u c t S p e c if ic a t io n < £ 2 iL Œ Z85230 ESCC Enhanced S erial Com m unication Controller FEATURES • Deeper Data FIFOs - 4-Byte Transmit FIFO - 8-Byte Receive FIFO ■ Programmable FIFO Interrupt Levels Provide Flexible Interrupt Response

rbbb

Contextual Info: KM416V254DJ ELECTRONICS CMOS DRAM 256K x 16 Bit CMOS Dynamic RAM with Extended Data Out DESCRIPTION This is a family of 262,144 x 16 bit Extended Data Out CMOS DRAMs. Extended Data Out offers high speed random access of memory cells within the same row. Power supply voltage +5.0V or +3.3V ,

am29f010

Contextual Info: a Am29F010 Advanced Micro Devices 1 Megabit 131,072 x 8-Bit CMOS 5.0 Volt-only, Sector Erase Flash Memory DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% read, write, and erase — Minimizes system level power consumption ■ Compatible with JEDEC-standard commands

philips om360

Abstract: OM360 HYBRID V.H.F./U.H.F. WIDE-BAND AMPLIFIER V360
Contextual Info: • bbS3R31 0G3243Û 25b IAPX i N AMER PHILIPS/DISCRETE 0|V360 bSE J> v_ HYBRID INTEGRATED CIRCUIT VHF/UHF WIDE-BAND AMPLIFIER Three-stage wide-band am plifier in hybrid integrated circu it technique on a th in -film substrate, ir'te r>decl fo r use in mast-head booster-amplifiers, as pream plifier in M ATV systems, and as general-purpose am pli­

Contextual Info: Pr o d u c t S p e c if ic a t io n < £ 3 L0 E Z85230 E S C C E n h a n c e d S e r ia l C o m m u n ic a t io n C o n t r o l l e r FEATURES • Deeper Data FIFOs - 4-Byte Transm it FIFO - 8-Byte Receive FIFO ■ Program m able FIFO Interrupt Levels Provide Flexible

HV5812P

Abstract: 16Strobe diagram HV5812 HV5812PJ 2.65mm A0324 uA78
Contextual Info: HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid General Description Features ► ► ► ► ► ► ► HVCMOS technology for high performance Operating voltage of to up to 80V High speed source driver 5.0V CMOS logic circuitry

Contextual Info: SM Crystal for NFC, Smartcard etc GSX-213 Specifications Product Parameters Frequency range: GSX-213 26.0 ~ 60.0MHz 1.25 ±0.07 ACTUAL SIZE +0.03 0.32 -0.02 SOLDER PAD LAYOUT 0.40 1 2 4 3 0.20 0.60 0.30 typ 0.50 (typ) 0.60 0.70 PAD     1 P

Contextual Info: K S 8 8 C 0 1 16 Mi crocontroller ELECTRO NICS DESCRIPTION The KS88C0116 single-chip 8-bit microcontroller is fabricated using an advanced CMOS process. With two 8-bit timer/counters, two 16-bit timer/counters, a large number of general I/O pins, a UART, and a 16-bit backup timer,

om361

Abstract: philips ferrite core 4b1 philips hybrid amplifier modules
Contextual Info: N AMER PHILIPS/DISCRETE ]> • bbS3T31 003B444 5ST OM361 IAPX HYBRID INTEGRATED CIRCUIT VHF/UHF WIDE-BAND AMPLIFIER Three-stage wide band am plifier in hybrid integrated circuit technique on a thin -film substrate, intended fo r use in mast-head booster-amplifiers, as an am plifier in M ATV systems, and as generalpurpose am plifier fo r v.h.f. and u.h.f. applications.

124-pin connector

Contextual Info: MITSUMI 1mm Density Card Edge Connectors CEM-D03, D10 Connectors FEATURES 1. The CEM-D03 is a 242-pin connector conforming to the SC242 Slot1 standard used with PentiumII processors. The CEM-D10 is a 124-pin connector conforming to the AGP graphics bus standard.

bt438

Abstract: bt ramdac BT438KPJ BT438KC
Contextual Info: Bt438 Distinguishing Features Customer Benefits • 250 MHz Operation • Differential ECL Clock Generation • Ability to Divide by 3,4, 5, or 8 of the Clock • Ability to Divide by 2 and 4 of the Load • Ability to Reset Pipeline Delay of the RAMDAC • 1.2 V Voltage Reference Output

Contextual Info: N AMER PH IL IPS /DI SCRE TE b^E ]> bbS3T31 0033444 SST OM361 APX _ / V _ HYBRID INTEGRATED CIRCUIT VHF/UHF WIDE-BAND AMPLIFIER Three-stage wide band amplifier in hybrid integrated circuit technique on a thin-film substrate,

BGY787

Contextual Info: 0D32423 Philips Semiconductors 6ES APX Preliminary specification CATV amplifier module BGY787 N AMER PHILIPS/DISCRETE PINNING -SOT115C FEATURES PIN • Excellent linearity PIN CONFIGURATION DESCRIPTION • Extremely low noise 1 input • Silicon nitride passivation

Contextual Info: P r o d u c t S p e c if ic a t io n < £ > Z iL 0 5 Z85233 EMSCC e n h a n c e d mono S e r ia l C o m m u n ic a t io n C o n t r o l l e r FEATURES • Deeper Data FIFOs - 4-Byte Transmit FIFO - 8-Byte Receive FIFO ■ Improved SDLC Frame Status FIFO

I1N4148-1

Abstract: MR 4011 hall IC 44E 11N4148-1 1N414S-1 ic 4081 pin diagram 1N914/1N4148 AD3247 1N4148-1 JANS zc 5094
Contextual Info: MIL SPECS 44E □ □□ □1 55 J> □ □ 3 5 M b cî 1 • MILS The documentation and process conversion \ measures necessary to comply with this | revision shall be completed b y ^ , INCH POUND MIL-S-19500/116J 23 Julv 1992 SUPERSEDING MI L- S - 1 9 5 0 0 / 1 1 6 H

Contextual Info: STE D • G 2 S 7 S S b Ü G 3 2 4 S 2 ISO ■ AMD2 ADV MICRO P L A / P L E / A R R A Y S _ MIL: H-10/15/20/25/30 COM’L: H-10/15/25, Q-25 PHfe-I 9*07 PALCE22V10 Family 24-Pin EE CMOS Versatile PAL Device ti Advanced Micro Devices DISTINCTIVE CHARACTERISTICS

1763744

Abstract: T160 176372-2 176372-1 179536-1
Contextual Info: AMP Products fo r Surface Mount Assembly Catalog 65230 • Through-Hole Revised 11-95 .050 Series Connectors C H A M P , FH Connectors (Continued) Vertical Receptacle, 1 1 mm to 18 mm Stack M aterial and Finish Through-Hole Board-to-Board Connectors Housing, Standard Temperature—