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    DAEWON TRAY ALTERA Search Results

    DAEWON TRAY ALTERA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10067847-001TLF
    		Amphenol Communications Solutions 10067847-001TLF-SD CARD TRAY PACKAGING Visit Amphenol Communications Solutions
    U77A11282021
    		Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A11282001
    		Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A61142001
    		Amphenol Communications Solutions SFP 1X6 CAGE NI TRAY Visit Amphenol Communications Solutions
    U77A11192001
    		Amphenol Communications Solutions SFP CAGE 1X1 NICKEL TRAY Visit Amphenol Communications Solutions

    DAEWON TRAY ALTERA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    FC-BGA

    Abstract: T0812012 daewon tray
    Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		AN-659-1 FC-BGA T0812012 daewon tray PDF

    KS-886H

    Abstract: Kostat tray
    Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		AN-657-1 KS-886H Kostat tray PDF