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    T0812012 Search Results

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    T0812012 Price and Stock

    Daewon CTS Co Ltd

    Daewon CTS Co Ltd T0812012

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components T0812012 54
    • 1 $8.98
    • 10 $8.98
    • 100 $5.54
    • 1000 $5.54
    • 10000 $5.54
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    T0812012 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    FC-BGA

    Abstract: T0812012 daewon tray
    Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		AN-659-1 FC-BGA T0812012 daewon tray PDF