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    T37Z

    Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
    Text: 1 GigaBit Stacked DDR1 SDRAM 128M x 8 DD55E, DD55ER Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and


    Original     		PDF DD55E, DD55ER DD54ER) DDR400) DD128M82U3BA DD55E 3887x132 DD55E) T37Z DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps