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    DE009456ACE Search Results

    DE009456ACE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    25804

    Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		DS1000Z-25 DS1000 DE009456ACE 150x1 DS87C520 DE029195AAB 650x65 25804 PDF

    25821

    Abstract: dallas date code ds12887 25854
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC


    Original     		DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854 PDF

    997E-07

    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY


    Original     		DK031452AB DS21352 DM941230AG DN041061AAE DK007198AAF DK016058AA DK016058AA DS2108 997E-07 PDF