DESICCANT POWDER Search Results

silica gel

Abstract: polyethylene film
Contextual Info: Issued March 1997 232-6168 Data Pack K Silica gel desiccant Data Sheet RS stock numbers 601-041, 601-057, 601-063 RS silica gel dessicant is a 99.0% pure amorphous silica in the form of hard irregular shaped crystals. The material is designed to adsorb moisture from air,

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

murata REEL label lot number

Contextual Info: PREPARED BY: DATE SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION U SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC

Contextual Info: PREPARED BY: Reference DATE SPEC NO. FILE No. CHECKED BY: ELECTRONIC COMPOMENTS DATE AND DEVICES GROUP APPROVED BY: ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION DATE SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC

murata REEL label lot number

Contextual Info: Reference PREPARED BY: SPEC NO. DATE FILE No. CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC

murata REEL label lot number

Contextual Info: PREPARED BY: DATE Reference SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

EGL210-J1-J3

Abstract: step down transformer EMP009-J1-LED egl 20109-b EMP009-J3-LED EGL210 EGL210-R1 resistance grounding desiccant powder class 1 div 2 relay
Contextual Info: EGL Static Grounding Indicator With Automated Pump Control and Static Ground Verification System Cl. I, Div. 1 & 2, Groups B, C, D Cl. I, Zone 1 & 2 IIB + H2 Cl. II, Div. 1, Groups E, F, G Cl. II, Div. 2, Groups F, G Cl. III UL/cUL Listed NEMA 3, 4X, 7BCD, 9FG, 12

NC-SMQ230

Abstract: tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste tamura solder paste PROFILE 97SC soft solder dispensing
Contextual Info: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents Moisture Barrier Envelope Packaging • • • • • • • The optical grade materials used in SMT LED components absorb moisture directly from the air. Moisture absorbed in SMT LED components that have been reflow soldered

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

SPRU811

Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
Contextual Info: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

desiccant powder

Abstract: WI-E-045
Contextual Info: SPECIFICATIONS FOR REFOND SURFACE MOUNT LED MODEL : RF-WTFA50DS-SIA Company Name: Confirmed By Customer: DATE: REFOND WI-E-045 <Cat.No.:731001> Package outlines [3] [5] [5] [3] [1] [2] [4] [6] [6] [4] [2] 1 3 5 2 4 6 MATERIALS Lens color Yellow Resin Dice

A22 SMD CODE

Contextual Info: A22 0.5W Series Features Applications  Moisture Sensitivity Level: 3  High Wattage Replacement Bulb  Main Parameters: Luminous Flux,  Down Light Forward Voltage , Chromaticity and  Recessed Can Light Color Rendering Index  Low/High Bay Light

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

A22 SMD CODE

Contextual Info: A22 1W/5S Series Features Applications  Multi-Chip PLCC Solution  High Wattage Replacement Bulb  Moisture Sensitivity Level: 3  Down Light  Main Parameters: Luminous Flux,  Recessed Can Light Forward Voltage , Chromaticity and  Low/High Bay Light

Contextual Info: A22 0.5W Series Features Applications  Moisture Sensitivity Level: 3  High Wattage Replacement Bulb  Main Parameters: Luminous Flux,  Down Light Forward Voltage , Chromaticity and  Recessed Can Light Color Rendering Index  Low/High Bay Light

Contextual Info: A22 1W/5S Series Features Applications  Multi-Chip PLCC Solution  High Wattage Replacement Bulb  Moisture Sensitivity Level: 3  Down Light  Main Parameters: Luminous Flux,  Recessed Can Light Forward Voltage , Chromaticity and  Low/High Bay Light

HSMX-T400

Abstract: 3M Touch Systems HP LED handbook FC-53-11
Contextual Info: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents • Surface Mount LED Indicators • Standard EIA Tape and Reel Packaging • Moisture Barrier Envelope Packaging • SMT LED Device Lead Material • PC Board Pad Design • Automatic Placement

Contextual Info: A22 1W/5S Series Features Applications  LM-80 Certified  High Wattage Replacement Bulb  Multi-Chip PLCC Solution  Down Light  Moisture Sensitivity Level: 3  Recessed Can Light  Main Parameters: Luminous Flux,  Low/High Bay Light Forward Voltage , Chromaticity and

cwi 1011

Abstract: 0910037 L5106 4mm banana plug socket B8170 IC 555 conductivity meter velcro straps J5260F Earth connection strip M5 screws working of light sensitive alarm with timer 555
Contextual Info: 1031 Technical portal and online community for Design Engineers - www.element-14.com Static Protection & Cleanroom Products Page Cleaning Products . . . . . . . . . . . . . . . . . . . . . . . . . Clothing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

SMT LED

Abstract: h730 HSMX-C650
Contextual Info: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents • Surface Mount LED Indicators • Standard EIA Tape and Reel Packaging • Moisture Barrier Envelope Packaging • SMT LED Device Lead Material • PC Board Pad Design • Automatic Placement

Contextual Info: Polymer Guide www.vishay.com Vishay Polytech Guide for Tantalum Solid Electrolyte Chip Capacitors with Polymer Cathode INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary