DIE BONDER Search Results

Contextual Info: Packaging - Handling Gallium Arsenide Die Handling Gallium Arsenide Die Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding

PIC16 example ay0438

Abstract: 30014 QCI-30014 sugar production process 85c72 PIC16 example codes QCI-30397 PIC16-17 27c64 EEPROM AY0438
Contextual Info: DIE SUPPORT Overview of Microchip Die Specifications INTRODUCTION This overview is intended to give our customers a better understanding of Microchip’s process of die usage and manufacture. This information is not intended as what is needed to manufacture die. It is highly recommended

Die Attach epoxy stamping

Abstract: 60022 pressure low die attach coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Contextual Info: Application Note Handling Gallium Arsenide Die Rev 2 INTRODUCTION Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding operations

Contextual Info: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip

7416a

Abstract: chip bonding die DIE BONDER
Contextual Info: HSXAWAVS Power FET Chip Handling Instruction Hexawave, Inc. Die Bonding Procedure Equipments and Tools 1. Die Bonder 2. Tweezers Type SS 3. Thermometer Procedure I. Perform all steps in a forcing N2gas environment. 2 Control the heated stage temperature within 310

AN-1060

Abstract: Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49
Contextual Info: AN-1060 International Rectifier • 233 Kansas Street, El Segundo, CA 90245 ! USA BARE DIE: HANDLING AND STORAGE By Richard Clark Introduction International Rectifier supply a range of power devices in a variety of packages and in Bare Die form. The Bare Die products are available in a

AN-1061

Abstract: Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter
Contextual Info: Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page Introduction .1 Storage and Handling .2

Contextual Info: VISHAY SEMICONDUCTORS www.vishay.com Optical Sensors Application Note Handling IR Emitters and Photo Detector Bare Die By Elena Poklonskaya This application note provides instructions for how to handle and mount IR emitter and photo detector bare die products

PC2400

Abstract: QMI-505MT QMI505 5310A EN-4088Z QMI505MT SN74F32 SN74F32N RH42
Contextual Info: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for PDIP Product March 18, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount compound

AuSn eutectic

Abstract: wire bond recommendations Die Attach and Bonding Guidelines Gan on silicon transistor Gan on silicon substrate AN008 DIE BONDER
Contextual Info: Application Note AN-008 Die Attach and Bonding Recommendations Introduction While Nitronex’s core market is packaged RF products, we sell die to select customers for use in modules and subsystems. One benefit of Nitronex GaN devices is they are fabricated on industry standard silicon wafers so

Silicon Controlled Rectifier Manual

Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
Contextual Info: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1

Contextual Info: Silicon PIN Diode Chips V3.0 Absolute Maximum Ratings1 @ TA = +25°C Unless otherwise specified Features • Hermetic Glass Passivated CERMACHIP • Oxide Passivated Planar Chips • Faster Switching Speed • Lower Loss, Higher Isolation • Switch & Attenuator Die

KCW-10

Abstract: AuSn solder GaAs MMIC ESD, Die Attach and Bonding Guidelines thermocompression bonder AuSn a/KCW-10
Contextual Info: H GaAs MMIC Assembly and Handling Guidelines Application Note 999 Mechanical Considerations Because of the small size of the devices, handling should always be performed with the aid of a microscope. There are several methods for picking up, transferring and die

SYLGARD

Abstract: SYLGARD 539 MA47416-132 MA4P202-134
Contextual Info: RoHS Compliant Silicon PIN Diode Chips V 6.0 Absolute Maximum Ratings1 @ TAMB = +25°C Unless otherwise specified Features • Switch & Attenuator Die • Extensive Selection of I-Region Lengths • Hermetic Glass Passivated CERMACHIP • Oxide Passivated Planar Chips

MA4P607-212

Abstract: MA4P165-134 MA47416-132 MA4P102-134 MA4P160-134 MA4P161-134 SYLGARD 539 MA4P504-132 MA4PK3000-1252 MA4P604-131
Contextual Info: RoHs Compliant Silicon PIN Diode Chips V 5.0 Absolute Maximum Ratings1 @ Ta = +25°C Unless otherwise specified Features • Switch & Attenuator Die • Extensive Selection of I-Region Lengths • Hermetic Glass Passivated CERMACHIP • Oxide Passivated Planar Chips

Contextual Info: Silicon PIN Chips V18 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

MADP-000488-13740W

Abstract: MADP-000135-01340W MA4P161-134 madp-000165-01340w MA4P504-132 MA4PK3000 Sylgard 170 13X13 19X19 MA47418-134
Contextual Info: Silicon PIN Chips V16 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

tech time

Contextual Info: Silicon PIN Chips V19 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

Contextual Info: Silicon PIN Chips V20 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

madp-000165-01340w

Contextual Info: Silicon PIN Chips V17 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

MA4P7493-134

Abstract: sylgard 186 MA4P303 MA4P7493 MA4P506 -1072T MADP
Contextual Info: Silicon PIN Chips V20 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

MXP400X

Abstract: 7400 family bonder 150-degree
Contextual Info: Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used. Wedge detail informations: * 45 degee wire feed angle. * .0015 in. hole size.

MADP-000488-13740W

Abstract: 13X13 19X19 MA47416-132 MA47418-134 MA4P161-134 MA4P203-134 MA4P303-134 MA4P404-132 MA4P504-132
Contextual Info: Silicon PIN Chips V18 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed Low Loss

SYLGARD

Contextual Info: Silicon PIN Chips RoHS Compliant V10 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar Chips Voltage Ratings to 3000V Fast Switching Speed