DIE MARKING 1030 Search Results

M82172G-13

Abstract: GE-100L CEL-9750ZHF10AKL CEL9750 M82154G-13 CEL-9750 M82154-13 GE100L M82108G-13 M82152G-13
Contextual Info: October 30, 2009 CN-103009 Customer Notification M821XX Second Source Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the products listed below. Purpose To assure long term supply for the M821XX product family, Mindspeed is qualifying a second assembly site at ASE

B82799S0513N001

Abstract: B78417A1967A003 EHP 16 B82791H2401N001 B78416 FERRITE CORE coil former B82442A1223K000 SMD INDUCTOR marking code UM B82721K2202N001 siemens ferrit core
Contextual Info: Product Profile 2007 Chokes and Inductors Drosseln und Induktivitäten www.epcos.com Welcome to the World of Electronic Components With its broad portfolio in electronic components EPCOS provides one-stop shopping for a comprehensive range of products and is market leader in Europe and

spansion top marking am29lv

Abstract: S29CL016J S29CD016J S29CD-J S29CL-J Spansion wafer marking spansion am29f part marking
Contextual Info: S29CD016J/S29CL016J Known Good Die 16 Megabit 512k x 32-Bit CMOS 2.6 or 3.3 Volt-only Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory Supplement (Advance Information) General Description The Spansion S29CD016J and S29CL016J devices are Floating Gate products fabricated in 110 nm process technology.

S29CL016J

Abstract: S29CL032 S29CD016J am29lv JC42 S29CD-J S29CL-J CD016J cl016 CL-016
Contextual Info: S29CD016J/S29CL016J Known Good Die 16 Megabit 512k x 32-Bit CMOS 2.6 or 3.3 Volt-only Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory with VersatileI/O Supplement (Preliminary) General Description The Spansion S29CD016J and S29CL016J devices are Floating Gate products fabricated in 110 nm process technology.

lg led tv electronic diagram

Abstract: LG 631 TV LG lcg M67s p2q2 datasheet light emitting diode Q65110A2431 LYYYG6SF-CADB-35 LCB E6SG LED 5mm 12000 mcd white 2700K LCB M67S LW W5SM
Contextual Info: Light Emitting Diodes Lumineszenzdioden 11 Light Emitting Diodes . Lumineszenzdioden . 11 Safety Instructions .

26c32at

Abstract: 26c32a 26C32AM 26c32
Contextual Info: DS26C32AT/DS26C32AM Quad Differential Line Receiver General Description Features The DS26C32A is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS.

Tape Resistivity 10E8 Ohm 10E4

Abstract: STMicroelectronics smd marking code smd diode order marking code stmicroelectronics 10E12 10E4 10E8 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA
Contextual Info: AN1235 APPLICATION NOTE ASD and IPAD™ FLIP-CHIP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE I - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce

EIA 763

Abstract: EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348
Contextual Info: AN1235 Application note IPAD and ASD Application Specific Devices 500 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip-Chips. For information on 400 µm FlipChips, see Application note AN2348.

B82498B3331 000

Contextual Info: SMT Inductors SMT-Induktivitäten 1,45 max. 2,2 max. 1,4 max. SMT inductors SIMID 0805-B 1,2 _ 0,1 • Size 0805 EIA and/or 2012 (IEC) ■ Core material: ceramics or ferrite ■ RoHS-compatible (see page 112) ■ Baugröße 0805 (EIA) bzw. 2012 (IEC) ■ Kernmaterial: Keramik oder Ferrit

B8249

Abstract: B82422-A1 epcos b82462-a4224k b82476a1104m B82471-A1223-M -EPCOS B82464A4474K B82432-T1473-K B82432-C1182-K B82462-A4334K B82432-T1684-K
Contextual Info: 10000 Seite Page 1000 100 10 10000 1000 100 10 IR mA 1,0 0,10 0,010 LR (µH) 0,001 Merkmale Features Gewickelt Wire-wound Baugröße Bauform Size Type Laser-cut SMT-Induktivitäten SMT Inductors 0402 SIMID 0402-A B82499-A Standard ● 9 Standard ● 10 0603

EIA standards 783

Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Contextual Info: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.

EIA 763

Abstract: AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC
Contextual Info: AN2348 Application note IPAD and ASD Application Specific Devices 400 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip-Chips. For information on 500 µm FlipChips, see Application note AN1235.

B 817 c

Contextual Info: SN54AC02-DIE www.ti.com SCHS392 – MAY 2013 RAD-TOLERANT SPACE GRADE DIE, QUADRUPLE 2-INPUT POSITIVE-NOR GATES Check for Samples: SN54AC02-DIE FEATURES 1 • • 1 AC Types Feature 1.5-V to 5.5-V Operation Rad-Tolerant: 50 KRad(Si) TID (1) – TID Dose Rate < 2 mRad/sec

251A172

Abstract: 250A783 4927N 251A172-417 F1192M-95 1RU44 512KX32 251A137 270 uf 375v T1A 250v
Contextual Info: REVISIONS R E L or E C O D E S C R I P T I O N REV ECO EOA20188 A D A T E Refer to Document Change History Herein 01-19-04 A P P R O V E D K. Mason NOTES: 1. This is a TOP LEVEL DRAWING TLD . 2. BAE SYSTEMS - Manassas, VA reference only. 3. All sheets are the same revision status.

251A137

Abstract: 512KX40 251A137-517 4927N w26m 251a137-527 251A137-101-PS001 EOA20156 BAE 0002 BAE Systems 251A137
Contextual Info: REVISIONS R E L or E C O D E S C R I P T I O N REV ECO EOA20156 G D A T E Refer to Document Change History herein 01-19-04 A P P R O V E D K. Mason NOTES: 1. This is a TOP LEVEL DRAWING TLD . 2. BAE SYSTEMS - Manassas, VA reference only. 3. All sheets are the same revision status.

kds9

Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
Contextual Info: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at appseng@simtek.com. For RoHS Materials

MO-187

Abstract: SB20 MAS9275 MAS9275ATC1 MAS9275ATG1
Contextual Info: DA9275.004 23 April 2003 MAS9275 IC FOR 10.00 – 36.00 MHz VCXO • • • • • • Low Power Wide Supply Voltage Range Square Wave Output Very High Level of Integration Very Low Phase Noise Low Cost DESCRIPTION MAS9275 is an integrated circuit well suited to build

Contextual Info: DA9275.004 23 April 2003 MAS9275 IC FOR 10.00 – 36.00 MHz VCXO • • • • • • Low Power Wide Supply Voltage Range Square Wave Output Very High Level of Integration Very Low Phase Noise Low Cost DESCRIPTION MAS9275 is an integrated circuit well suited to

kyocera CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
Contextual Info: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count

DS26F32MJ-QMLV

Abstract: delta w16A 5962-7802005MEA
Contextual Info: DS26F32M Quad Differential Line Receivers General Description Features The DS26F32 is a quad differential line receiver designed to meet the requirements of EIA Standards RS-422 and RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission.

instruction sheet 408-7424

Abstract: AMP crimper AMP wire crimper 408-7424 Terminal crimping training crimping tool equivalent 224027-1 4-520448-2 408-7424* figure 6 SAE-20
Contextual Info: Instruction Sheet Crimping Die Assemblies 224027-1 and -2 for Use with AMP* 626 Pneumatic Tooling Assemblies AIVIF» Die Holding Screw 408-4153 24 JUN 99 Rev A Wire and Receptacle Size Identification Marked in This Approximate Area Moving Die Indenter ♦

Contextual Info: SMT Power Inductors SMT-Power-Induktivitäten B82462A2, B82462G2 High performance B82462G2: 6.3 x 6.3 x 2.5 mm • Core material: ferrite ■ Version B82462G2: Magnetically shielded ■ Current derating up to 140 °C ■ RoHS-compatible (see page 112) 2.5 max.

instruction sheet 408-7424

Abstract: 4-520447-2 tyco 17105-3608 E2011 DIES
Contextual Info: Instruction Sheet Crimping Die Assemblies 224027- 1 and - 2 for Use with 626 Pneumatic Tooling Assemblies Die Holding Screw 408- 4153 21 Mar 11 Rev B Wire and Receptacle Size Identification Marked in This Approximate Area ~ Moving Die Indenter Wire Barrel

Contextual Info: SMT Power Inductors SMT-Power-Induktivitäten 10.4 max. Bottom view Ansicht von unten 4.8 max. 3±0.1 10.4 max. B82464A4 2±0.2 10±0.2 • Size: 10.4 x 10.4 x 4.8 mm ■ Core material: ferrite ■ Current derating up to 140 °C ■ RoHS-compatible (see page 112)