DIMENSIONS SO 14 PIN Search Results

Contextual Info: a 14-Lead SOIC Package SO-14 Dimensions shown in inches and (mm) 0.3444 (8.75) 0.3367 (8.55) 0.1574 (4.00) 0.1497 (3.80) PIN 1 14 8 1 7 0.050 (1.27) BSC 0.0688 (1.75) 0.0532 (1.35) 0.0098 (0.25) 0.0040 (0.10) 0.2440 (6.20) 0.2284 (5.80) 0.0196 (0.50) ؋ 45؇

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS423NSR Package Package Pins Type Drawing SO NS 16 SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1

SOL-28

Abstract: sol28
Contextual Info: a R-28 S-Suffix 28-Lead Wide Body SO SOL-28 Dimensions shown in inches and (millimeters) 28 15 0.2992 (7.60) 0.2914 (7.40) 0.4193 (10.65) PIN 1 14 1 0.3937 (10.00) 0.1043 (2.65) 0.7125 (18.10) 0.0926 (2.35) 0.6969 (17.70) 0.0291 (0.74) 0.0098 (0.25) 0.0118 (0.30)

Contextual Info: 3-PIN iIS sO oU la te d PACKAGE CSSP KT SERIES K T */'J -X OUTLINE DIMENSIONS 3.5-» KT15N14 KT15N 14 46 uu j!0I 2.5411 • RATINGS Absolute Maximum Ratings Item Symbol Conditions ~-_Type No, KT15N14 Units Storage Temperature Tstg r-40~12& ■c Junction Temperature

Contextual Info: MONITOR PRODUCTS CO INC 7b ÎËJ OQODSCI1 fi T^SO- 23 MONITOR PRODUCTS 970L LSTTL CLOCK OSCILLATORS PACKAGE DIMENSIONS INCHES In ,200 Max .175 Min PIN 1. N.C. PIN 8. Output PIN 7. GND. PIN 14. +5VDC -.600 - c RISE AND FALL TIME LESS THAN 5 NANOSECONDS RUGGED RESISTANCE

Motorola 206

Contextual Info: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

5962-9861101Q2A

Abstract: 5962-9861101QCA 5962-9861101QDA SN54128J SN74128D SN74128DE4 SN74128DG4 SN74128N SN74128N3 SN74128NE4
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9861101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9861101QCA ACTIVE CDIP

MS-012-AB

Abstract: 74ALS 74ALS20A 74ALS20AD 74ALS20AN SOL-24 TEXTOOL SOCKET DIP16
Contextual Info: 74ALS20A Signetics Dual 4-Input NAND Gates Product Specification ALS Products FUNCTION TABLE INPUTS TYPICAL PROPAGATION DELAY TYPE OUTPUT 4 .5 ns 74A L S 2 0 A TYPICAL SUPPLY CURRENT TOTAL 0 .6 5 mA A B c D Ÿ H H H H L L X X X H X L X X H X X L X H 14-Pin Plastic DIP

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 80019012A ACTIVE LCCC FK 20 1 TBD 8001901CA ACTIVE CDIP J 14 1 TBD

SN7437

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9754101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9754101QCA ACTIVE CDIP

mip 291

Abstract: 74ALS373 74ALS374 74ALS563A 74ALS563AD 74ALS563AN 74ALS564A 74ALS564AD 74ALS564AN 74ALS573B
Contextual Info: Signetics 74ALS563A, 74ALS564A Latch/Flip-Flops 74ALS563A Octal Transparent Latch, Inverting 3-State 74ALS564A Octal D Flip-Flop, Inverting (3-State) ALS Products Product Specification FEATURES TYPICAL PROPAGATION DELAY TYPE • 74ALS563A is broadside pinout

74ALS373

Abstract: 74ALS374 74ALS563A 74ALS564A 74ALS573B 74ALS573BD 74ALS573BN 74ALS574A 74ALS574AD 74ALS574AN
Contextual Info: 74ALS573B, 74ALS574A Signetics Latch/Flip-Flops 74ALS573B Octal Transparent Latch 3-State 74ALS574A Octal D Flip-Flop (3-State) Product Specification ALS Products FEATURES TYPICAL PROPAGATION DELAY TYPE • 74ALS573B is broadside pinout version o f 74ALS373

Contextual Info: PA14-08-1-1603-6 Data Sheet 14 pin SO socket/8 pin DIP 0.6" plug Supported Device/Footprints Adapter Parts & Part Numbers This adapter allows programming of several SO devices in their DIP footprint. A partial list is: The following chart shows the various socket and board part

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/32901B2A ACTIVE LCCC FK 20 1 TBD JM38510/32901BCA ACTIVE

74hc128

Abstract: 74HCT4050 74HC273 74HC7014 74HC9046 74hct133 74HCT273 74HC1284 74HCT7597 74HC4059
Contextual Info: INTEGRATED CIRCUITS Package information Supersedes data of 1999 Jul 09 File under Integrated Circuits, IC06 1999 Sep 22 Philips Semiconductors Package information PACKAGE INFORMATION PART NO DIP N SO (D) SSOP (DB) TSSOP (PW) PIN COUNT 74HCU04 27-1 108-1

5962-9754101Q2A

Abstract: 5962-9754101QCA 5962-9754101QDA SN5437J SN54LS37J SN54S37J SN7437N SN7437N3 SN74LS37D SN74LS37N
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9754101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9754101QCA ACTIVE CDIP

SN7437

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 3-May-2010 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9754101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9754101QCA ACTIVE CDIP

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 80019012A ACTIVE LCCC FK 20 1 TBD 8001901CA ACTIVE CDIP J 14 1 TBD

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9861101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9861101QCA ACTIVE CDIP

5962-9861101Q2A

Abstract: 5962-9861101QCA 5962-9861101QDA SN54128J SN74128D SN74128DE4 SN74128DG4 SN74128N SN74128N3 SN74128NE4
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9861101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9861101QCA ACTIVE CDIP

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9861101Q2A ACTIVE LCCC FK 20 1 TBD 5962-9861101QCA ACTIVE CDIP

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 80019012A ACTIVE LCCC FK 20 1 TBD 8001901CA ACTIVE CDIP J 14 1 TBD

Enplas OTS

Abstract: Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16SD-03 16/Enplas ots-16-1.27-03
Contextual Info: PA-SOD-1603-D250-xx Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.

8001901CA

Abstract: 8001901DA SN54LS09J SN54S09J SN7409N SN74LS09D SN74LS09DR
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 80019012A ACTIVE LCCC FK 20 1 TBD 8001901CA ACTIVE CDIP J 14 1 TBD