DIN 2248 Search Results

Contextual Info: 1 FSF BEAB 5 x 20mm Quick-acting Fuses – Low Breaking Capacity F Built according to IEC 127-2/2, EN 60127, ASE 1064, DIN/VDE 0820 part 1, DIN 41661, BS 4265, and SEMKO 104-1976. Series SP & SPT recommended if the short circuit current through the fuselink is more than 35A or 10 x l n, whichever is greater CENELEC Jan 1, 1993 .

D4206

Abstract: C5802 transistor nokia 2700 classic circuit diagram mobile nokia circuit diagram 1202-2 c5802 nec 7805a transistor C1162 RCA SK CROSS-REFERENCE C1162 m50442
Contextual Info: Division of RF Industries Coax Connector Solutions for over 30 years Connectors & Adapters BNC, TNC, N, SMA, SMB, SSMB, MCX, MMCX, UHF, Mini-UHF, 7-16 DIN, 1.0/2.3 and more Also available in reverse polarity, reverse thread and 75-ohm Preparation & Installation Tools

D4206

Abstract: C5802 transistor nec 7805a RCA SK CROSS-REFERENCE nokia 2700 classic circuit diagram c5802 mobile nokia circuit diagram 1202-2 DBL 2028 transistor C1162 C1162
Contextual Info: Division of RF Industries Coax Connector Solutions for over 30 years Connectors & Adapters BNC, TNC, N, SMA, SMB, SSMB, MCX, MMCX, UHF, Mini-UHF, 7-16 DIN, 1.0/2.3 and more Also available in reverse polarity, reverse thread and 75-ohm Preparation & Installation Tools

200-CIE

Abstract: 49935 200cie 200-GDS mexico
Contextual Info: Series 200 200-CIE Drop Cable Mountkit 1. 2. 3. 4. 1. Connect the 200-GDS and the mounting plate EM-MP-45 to the DIN-rail. 2. Mount the uninsulated part of the cable to the 200-GDS 3. Strap the transceiver to the mounting plate with two straps and connect the cable.

Makrolon 8035

Abstract: makrolon 2805 ISO 7045 makrolon torque for SELF TAPPING SCREW erni MINIBRIDGE EN 50041
Contextual Info: LDG-M4 Compact Housing www.erni.com Katalog D Catalog E 074576 074518 10/09 Ausgabe 3, 03/05 Edition www.erni.com 2 1 www.erni.com Catalog E 074576 10/09 Edition 2 LDG-M4 Compact Housing The LDG-M4 is a plastic housing designed for industrial applications in the field of sensors. The dimensions are according to DIN

200-OE4

Abstract: user manual for sattcon SattCon 200-IE8 200-IP2 SattCon 05 200-OW8 200-OB16 SattCon 200 200-IR8
Contextual Info: Series 200 I/O System Units 7The Series 200 I/O System features a number of interface units for various process applications. The I/O units are compatible with the I/O 200C units and can be mixed with them in any order on the same DIN rail. The units in the I/O system are

SattCon

Abstract: SattCon 05 SattCon 200 200C-IE8 Sattline 200-CIE 200C-IB16 IB10 ISA-RP55 ABB IB16
Contextual Info: I/O 200C I/O 200C is a range of cost effective I/O units which are bus compatible with Series 200 I/O and can be mixed with them in any order on the same DIN rail. I/O 200C units can be connected to controllers via adapters for various field buses. They are intended for use in

A 933 S transistors

Abstract: br 2222 npn npn 2222 N 2222 2221-2N 2N2222 2N2221 Q62702-F134 Q62702-F135 Q68000-A4573
Contextual Info: 2SC D • 6 2 3 S b O S GDGHflflb 3 H S I E < S Z 5C CK886 D NPN Silicon Planar Transistors 2 N 2220 2 N 2221 2 N 2222 'S IE M E N S AKTIENGESELLSCHAF 2 N 2 2 2 0 , 2 N 2221, and 2 N 2 2 2 2 are epitaxial NPN silicon planar transistors in TO 18 case 18 A 3 DIN 41 8 7 6 . The collector is electrically connected to the case. The transistors

DIN 41652

Abstract: ISO 2768-M
Contextual Info: +0,3 5,8 0,6 Leiterplatte 90 Verpackungseinheit 48 St. 5 x 18 = tray packaging 18 packaging unit 48 pcs 2,7 3,2 6,3 max. 138 Verpackt in Tray 36 Pin 1 pcb 7 x 36 = 252 +0,2 31 -0,4 max. 325 +0,2 +0,2 Layout: 8,25 12,6 0,3 16,8 4 x 2.74 = A 1 without : Mutter /

Erni

Contextual Info: +0,3 5,8 Verpackt in Tray 0,6 90 18 5 x 18 = Pin 1 pcb 3 x 73.5 = 69,4 220,5 0,3 max. 325 +0,2 +0,2 55,3 Layout: 8,25 0.1 63,5 without : Mutter / 49,68 1 B 37x 0,1 ø0.05 2,76 0,1 1 Bolzen / bolt : nut : 0,1 ohne / 18 x 2.76 = A 2,84 0,3 packaging unit 24 pcs

erni 41612

Abstract: Ge Spice ERNI 753
Contextual Info: 074533_Umschlag_A5_2010_d 17.10.2010 11:01 Uhr Seite U4U11 Katalog ERNI Electronics Das Technologiezentrum ERNI Electronics GmbH Seestrasse 9 73099 Adelberg/Germany Tel +49 71 66 50-0 Fax +49 71 66 50-282 info@erni.de Europa Südamerika ERNI Electronics, Inc.

WIRING diagram USB to rca CABLE

Abstract: RFU-531 ldf4-50a belden nokia 1280 circuit diagram free L1PNM-H taiko relay Intercomp 1-4082x RFB-1135-T radiall 617 320 Solitron product catalog
Contextual Info: RF Connectors Division of of RF RF Industries Industries AA Division 1-800-233-1728 CD Available on 7610 Miramar Road, San Diego, CA 92126-4202 • 858 549-6340 • (800) 233-1728 Fax (858) 549-6345 • email: rfi@rfindustries.com • website: rfindustries.com

15-TL

Contextual Info: +0,3 5,8 90 Verpackungseinheit 36St. 5 x 18 = tray packaging 18 packaging unit 36 pcs 2,7 3,2 6,3 max. 138 Verpackt in Tray 0,6 44 Leiterplatte Pin 1 5 x 44 = pcb 220 max. 325 +0,2 39,3 -0,4 +0,2 +0,2 Layout: 8,25 0.1 33,3 without : Mutter / 19,18 1 B 15x

DIN 41652

Abstract: ISO 2768-M 244441 B274
Contextual Info: 6,3 -0,25 Verpackt in Tray packaging unit 48 pcs 18 5 x 18 = 90 tray packaging 2,7 3,2 6,3 max. 138 Verpackungseinheit 48 St. 0,6 36 Pin 1 Leiterplatte 7 x 36 = +0,2 pcb 252 31 -0,4 max. 325 4 x 2.74 = A 1 25 without : Mutter / 0,1 0,1 ø0.05 2,74 B 9x 1 Bolzen / bolt :

DIN 41652

Contextual Info: +0,3 5,8 90 Verpackungseinheit 30St. 5 x 18 = tray packaging 18 packaging unit 30 pcs 2,7 3,2 6,3 max. 138 Verpackt in Tray 0,6 Leiterplatte 58 Pin 1 pcb 4 x 58 = 52,9 max. 325 +0,2 +0,2 Layout: 8,25 0.1 47 without : Mutter / 33,12 1 B 25x 0,1 ø0.05 2,76

244443

Contextual Info: 6,3 -0,25 Verpackt in Tray packaging unit 36 pcs 18 5 x 18 = 90 tray packaging 2,7 3,2 6,3 max. 138 Verpackungseinheit 36 St. 0,6 44 Leiterplatte Pin 1 5 x 44 = pcb -0,2 -0,3 Layout: 0.1 33,3 without : Mutter / 19,18 1 B 15x 0,1 ø0.05 2,74 0,1 1 Bolzen / bolt :

Contextual Info: +0,2 39,3 -0,4 25,1 +0,2 Verpackt in Tray max. 325 Verpackungseinheit 24 St. A2 A1 tray packaging 4 28 A2 0,1 44 5x44= 220 14,7 33,3 5 3x28= 84 3 2 max. 138 +0,2 8,25 12,6 0,3 packaging unit 24 pcs 1 Layout 17,44 A 8,72 +0,04 3,72 3,72 without Mutter / nut

DIN ISO 2768-M

Abstract: ERNI TMCS 9 204773
Contextual Info: Verpackt in Tray Verpackungseinheit 32 St. tray packaging packaging unit 32 pcs 1 Sonstige Angaben siehe 204630 /Additional indications please see 204630 Verpackt in Gurt Verpackungseinheit 125 St. 1 tape & reel packaging packing unit 125 pcs Abspulrichtung

Contextual Info: 6,3 -0,25 Verpackt in Tray 90 tray packaging 18 5 x 18 = packaging unit 30 pcs 2,7 3,2 6,3 max. 138 Verpackungseinheit 30 St. 0,6 Leiterplatte 58 Pin 1 pcb 4 x 58 = 53 0,3 38,5 -0,2 232 0.1 47 without : Mutter / 33,12 1 B 25x 0,1 ø0.05 2,76 0,1 1 Bolzen / bolt :

Contextual Info: max.325 30.8 Verpackt in Tray - 0,3 Verpackungseinheit 32 St. 16.8 -0,2 28 3x28= 84 0,3 12,6 8 -0,2 max.138 tray packaging packaging unit 32 pcs 1 36 7x36= 252 25 0,2 /Additional indications please see 204630 Sonstige Angaben siehe 204630 150 Verpackt in Gurt

erni 41612

Contextual Info: 074484_Cover_neu_A5_2010 29.04.2010 18:08 Uhr Seite U4U11 Catalog ERNI Electronics The Technology Center ERNI Electronics GmbH Seestrasse 9 73099 Adelberg/Germany Tel +49 71 66 50-0 Fax +49 71 66 50-282 info@erni.de Europe South America ERNI Electronics, Inc.

Contextual Info: EIN UNTERNEHMEN VON R oederstein Keramik-Kondensatoren für die professionelle Elektronik Ceramic Capacitors for professional electronics T Keramische Vielschichtkondensatoren in axialer Ausführung, Klasse 2, nach MIL-C-39014/05 Ceramic multilayer capacitors with axial leads, class 2,

Contextual Info: +0,2 39,3 -0,4 +0,2 8,25 3 2 4 Verpackungseinheit 24 St. tray packaging packaging unit 24 pcs 28 powerless assembly 3x28= 84 +0,2 0,3 1 Verpackt in Tray Bestückung kraftlos A2 A1 12,6 version 1 max. 138 25,1 max. 325 Variante 1 5 44 A2 5x44= 220 0,6 33,3

makrolon

Abstract: EN 50041 makrolon 2805 Makrolon 8035
Contextual Info: LDG-M4 Kompaktgehäuse www.erni.com Katalog D 074577 074518 Ausgabe 3, 03/05 10/09 Ausgabe www.erni.com 2 1 www.erni.com Katalog D 074577 10/09 Ausgabe 2 LDG-M4 Kompaktgehäuse Bei dem LDG-M4 handelt es sich um ein für industrielle Anwendungen im Sensorbereich konzipiertes Kunststoffgehäuse. Es