DIP22 PACKAGE Search Results

Contextual Info: PACKAGE DIMENSIONS DIP22-D2 27.81±0.3 12 1 11 9.02±0.3 22 1.52 5.33MAX 0.46±0.1 3.3 0.39MIN 1.27MAX 2.54 10.79MAX 0.25±0.13 0 ~ 15° UNIT : mm

Contextual Info: DIP22-P-400-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.90 TYP. 2/Dec. 11, 1996

Contextual Info: DIP22-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.88 TYP. 2/Dec. 11, 1996

Application Note 05

Abstract: 2683 DIP22
Contextual Info: PACKAGE DIMENSIONS DIP22 26.8±0.3 12 1 11 8.6±0.2 22 1.5±0.2 0.46±0.1 2.8MIN 2.54 0.51MIN 1.0±0.2 0.85MAX 5.08MAX 10.16 +0.15 0.25 -0.05 0 ~ 15º UNIT : mm

Contextual Info: SANYO Semiconductor Dual In-line Package 22Pin Plastic DIP22 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

dip22p

Contextual Info: DIP22-P-300-2.54-S1 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

LA7520

Abstract: DIP30S LA7521 CHIYODA
Contextual Info: LA7520,7521 No.1475 Monolithic Linear Integrateci Circuii! VIF +: SIF Cikcuiì f o r tVJ iVTR;AppiLicationìì 1 SANYO The ¡LÀ7520 is an IC containing thè VIF séctlon and SIF section o|i a single chip in the DIP30S package (equivalent to th i DIP22 package heretofore in usu) of

1P040

Abstract: 0FP100
Contextual Info: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24

Contextual Info: DIP22-P-400-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24

3931L

Abstract: BA9211
Contextual Info: BA9211 BA9211F Digital-to-analog converter, 10 bit The BA9211 and BA9211F are 10-bit D/A converters with a built-in reference voltage supply. Dimensions Units : mm BA9211 (DIP22) The reference voltage supply circuit is an independent block and it can use an

Contextual Info: Package outline DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b 22 MH 12 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.

Contextual Info: 22P4 Plastic 22pin 400mil DIP Lead Material Alloy 42/Cu Alloy 12 1 11 E 22 c Weight g 2.2 JEDEC Code – e1 EIAJ Package Code DIP22-P-400-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08

BA9211

Abstract: K2281 BA9211F Zr 1023 Vee-12V BA921
Contextual Info: Digital-to-analog converter, 10 bit BA9211 BA9211F The BA9211 and BA9211F are 10-bit D/A converters with a built-in reference voltage supply. Dimensions U nits: mm BA9211 (DIP22) I3 .6 + 0 .2 The reference voltage supply circuit is an independent block and it can use an

Contextual Info: 22P4H Plastic 22pin 300mil DIP Weight g 1.5 JEDEC Code – Lead Material Alloy 42 12 1 11 E 22 e1 c EIAJ Package Code DIP22-P-300-2.54 D L A1 A A2 Symbol SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.7

sot116

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

DIP22 Package

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

LA7520

Abstract: 11175 DIP30S LA7521
Contextual Info: No.1475 LA ^ Ä © ?7521 Monolithic Linear Integrated Circuit V I F + S I F C i r c u i t f o r TV, V TR A p p lic a tio n s SANYO •4 ? The LA7520 is an IC containing the VIF section and SIF/%6 cti|iv"bn;a singly chip in the DIP30S package (equivalent to the DIP22 packs#! h | r ^ p f ^ e in/uie) of

IC LA7830

Abstract: LA7830 LA7830 equivalent la7621 LA7629 LA 7831 ctv circuit diagram IC vertical lg la 7830 LA 7830 vertical TV Circuit
Contextual Info: I SAiYO I J LA7629 NO.Z837A Monolithic Linear IC Color TV/Video, Chrom a, Deflection C ircu it - H,- ,|i *<# The LA7629 is a small-sized m ultifunctional IC containing the “video, c h r o m a /|0 lile c ti^ ^ ^ c u it of ftTSC color TV in a. DIP30S equivalent to the DIP22 package heretofore in use jrf^ihrif\|^pe. B i^ides4eing

vqfp100 package

Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Contextual Info: Dimensions I l l II I I I I Dimensions •DIP/SDIP/SK-DIP Unit : mm DIP 14 DIP8 o o 0. 5+ 0. I O’ - |[o's±o. 15" 1 O' ~ I 5 ' DIP 18 DIP 16 o 19 . 4 ± 0. 3 l?6_ ' o 9 -t-i I l;.5±o, I ’o" DIP22 DIP20 22 O 12 () ) o O H J v °.5 .± 0 . I 0.5± 0. I

DIP-22

Abstract: DIP22
Contextual Info: SANYO Semiconductor Dual In-line Package 22Pin Plastic DIP22 400mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

NJM3771D2

Abstract: analog switch SPDT DIP-8 NJM37770D3 NJM3770AD3 mmic s3 NJM2624AD DMP-30 NJM3717D2 pll dip switch NJM3772D2
Contextual Info: BACK NEXT NEW AT MOUSER NEW AT MOUSER NJR Analog ICs NJR Communication, Interface, Driver ICs, & Video ICs COMMUNICATIONS/INTERFACE: SWITCHES/MULTIPLEXERS NEW AT MOUSER Surface Mount Device Price Each MOUSER STOCK NO. Package Description Mfr. Mfr. Part No.

NJM2670E3

Abstract: motor dc 48v NJM2670D2 48v dc motor DIP-22 NJM2670 PD125 PD25 diode u stepper motor application
Contextual Info: NJM2670 DUAL H BRIDGE DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE The NJM2670 is a general-purpose 60V dual H-bridge drive IC. It consists of a pair of H-bridges, a thermal shut down circuit and its alarm output. The alarm output can detect application problems and the system reliability will be

NJU39612 NJM3775

Abstract: step down chopper EMP24 analog bipolar DRIVER BIPOLAR MICROSTEPPING DRIVER MOTOR STEPPER BIPOLAR DRIVER ttl and cmos digital ic PLCC-28 njm3517 njm3717
Contextual Info: Motor Driver IC Line-Up • Motor Drivers Features Part Number Stepper Motor Controller/Driver NJM3517 Line Up Complete driver and phase logic Continuous output current: 2 x 350mA Half and full-step operations Bilevel drive mode for high step rates Voltage doubling drive