Untitled
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS DIP22-D2 27.81±0.3 12 1 11 9.02±0.3 22 1.52 5.33MAX 0.46±0.1 3.3 0.39MIN 1.27MAX 2.54 10.79MAX 0.25±0.13 0 ~ 15° UNIT : mm
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DIP22-D2
33MAX
39MIN
27MAX
79MAX
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Untitled
Abstract: No abstract text available
Text: DIP22-P-400-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.90 TYP. 2/Dec. 11, 1996
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DIP22-P-400-2
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Untitled
Abstract: No abstract text available
Text: DIP22-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.88 TYP. 2/Dec. 11, 1996
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DIP22-P-300-2
54-S1
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Application Note 05
Abstract: 2683 DIP22
Text: PACKAGE DIMENSIONS DIP22 26.8±0.3 12 1 11 8.6±0.2 22 1.5±0.2 0.46±0.1 2.8MIN 2.54 0.51MIN 1.0±0.2 0.85MAX 5.08MAX 10.16 +0.15 0.25 -0.05 0 ~ 15º UNIT : mm
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DIP22
51MIN
85MAX
08MAX
Application Note 05
2683
DIP22
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 22Pin Plastic DIP22 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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22Pin
DIP22
400mil)
ED-7303A)
51MIN
95ormation
95MAX
DIP22
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dip22p
Abstract: No abstract text available
Text: DIP22-P-300-2.54-S1 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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DIP22-P-300-2
54-S1
dip22p
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Untitled
Abstract: No abstract text available
Text: DIP22-P-400-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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DIP22-P-400-2
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Untitled
Abstract: No abstract text available
Text: Package outline DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b 22 MH 12 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.
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DIP22:
OT116-1
40ximum
060G07
MS-010
SC-502-22
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Untitled
Abstract: No abstract text available
Text: 22P4 Plastic 22pin 400mil DIP Lead Material Alloy 42/Cu Alloy 12 1 11 E 22 c Weight g 2.2 JEDEC Code – e1 EIAJ Package Code DIP22-P-400-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08
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22pin
400mil
42/Cu
DIP22-P-400-2
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Untitled
Abstract: No abstract text available
Text: 22P4H Plastic 22pin 300mil DIP Weight g 1.5 JEDEC Code – Lead Material Alloy 42 12 1 11 E 22 e1 c EIAJ Package Code DIP22-P-300-2.54 D L A1 A A2 Symbol SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.7
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22P4H
22pin
300mil
DIP22-P-300-2
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sot116
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP22:
OT116-1
OT116-1
060G07
MO-026AA
sot116
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DIP22 Package
Abstract: No abstract text available
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP22:
OT116-1
060G07
MS-010
SC-502-22
DIP22 Package
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DIP-22
Abstract: DIP22
Text: SANYO Semiconductor Dual In-line Package 22Pin Plastic DIP22 400mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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22Pin
DIP22
400mil)
ED-7303A
95MAX
51MIN
DIP22
DIP-22
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NJM3771D2
Abstract: analog switch SPDT DIP-8 NJM37770D3 NJM3770AD3 mmic s3 NJM2624AD DMP-30 NJM3717D2 pll dip switch NJM3772D2
Text: BACK NEXT NEW AT MOUSER NEW AT MOUSER NJR Analog ICs NJR Communication, Interface, Driver ICs, & Video ICs COMMUNICATIONS/INTERFACE: SWITCHES/MULTIPLEXERS NEW AT MOUSER Surface Mount Device Price Each MOUSER STOCK NO. Package Description Mfr. Mfr. Part No.
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513-NJM2533D
513-NJM2533M
513-NJM2283D
DIP-16
513-NJM2283M
DMP-16
513-NJM2284V-TE1
SSOP-16
513-NJM2285V-TE1
NJM3771D2
analog switch SPDT DIP-8
NJM37770D3
NJM3770AD3
mmic s3
NJM2624AD
DMP-30
NJM3717D2
pll dip switch
NJM3772D2
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NJU39612 NJM3775
Abstract: step down chopper EMP24 analog bipolar DRIVER BIPOLAR MICROSTEPPING DRIVER MOTOR STEPPER BIPOLAR DRIVER ttl and cmos digital ic PLCC-28 njm3517 njm3717
Text: Motor Driver IC Line-Up • Motor Drivers Features Part Number Stepper Motor Controller/Driver NJM3517 Line Up Complete driver and phase logic Continuous output current: 2 x 350mA Half and full-step operations Bilevel drive mode for high step rates Voltage doubling drive
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NJM3517
350mA
DIP16/EMP16
NJM3717
5-1200mA
0-50V
EMP20
NJM3545
2000mA
O-220
NJU39612 NJM3775
step down chopper
EMP24
analog bipolar DRIVER
BIPOLAR MICROSTEPPING DRIVER
MOTOR STEPPER BIPOLAR DRIVER
ttl and cmos digital ic
PLCC-28
njm3517
njm3717
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LA7520
Abstract: DIP30S LA7521 CHIYODA
Text: LA7520,7521 No.1475 Monolithic Linear Integrateci Circuii! VIF +: SIF Cikcuiì f o r tVJ iVTR;AppiLicationìì 1 SANYO The ¡LÀ7520 is an IC containing thè VIF séctlon and SIF section o|i a single chip in the DIP30S package (equivalent to th i DIP22 package heretofore in usu) of
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LA7520
LA7520,
LA7521
DIP30S
DIP22
N153KI
LA7520
CHIYODA
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1P040
Abstract: 0FP100
Text: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP40
SDIP22
SDIP24
SDIP28
1P040
0FP100
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Untitled
Abstract: No abstract text available
Text: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP40
SDIP22
SDIP24
SDIP28
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3931L
Abstract: BA9211
Text: BA9211 BA9211F Digital-to-analog converter, 10 bit The BA9211 and BA9211F are 10-bit D/A converters with a built-in reference voltage supply. Dimensions Units : mm BA9211 (DIP22) The reference voltage supply circuit is an independent block and it can use an
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BA9211
BA9211F
BA9211F
10-bit
BA9211
DIP22)
DIP22
000kil
3931L
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BA9211
Abstract: K2281 BA9211F Zr 1023 Vee-12V BA921
Text: Digital-to-analog converter, 10 bit BA9211 BA9211F The BA9211 and BA9211F are 10-bit D/A converters with a built-in reference voltage supply. Dimensions U nits: mm BA9211 (DIP22) I3 .6 + 0 .2 The reference voltage supply circuit is an independent block and it can use an
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BA9211
BA9211F
10-bit
DIP22
BA9211
000kii
01juf
G012411
K2281
Zr 1023
Vee-12V
BA921
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LA7830 equivalent
Abstract: la7629
Text: j O rdering num ber : EN 2837A Monolithic Linear 1C I SA \YO No.2837A L A 7629 Video, Chroma, Deflection Circuit for Color TV Use I The LA7629 is a small-sized multifunctional IC containing the “video, chroma, deflection” circuit of NTSC color TV in a DIP30S equivalent to the DIP22 package heretofore in use of shrink type. Besides being
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LA7629
DIP30S
DIP22
LA7520N
LA7832
LA7629
LA7830,
LA7830 equivalent
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LA7520
Abstract: 11175 DIP30S LA7521
Text: No.1475 LA ^ Ä © ?7521 Monolithic Linear Integrated Circuit V I F + S I F C i r c u i t f o r TV, V TR A p p lic a tio n s SANYO •4 ? The LA7520 is an IC containing the VIF section and SIF/%6 cti|iv"bn;a singly chip in the DIP30S package (equivalent to the DIP22 packs#! h | r ^ p f ^ e in/uie) of
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LA7520
DIP30S
DIP22
LA7521
N153KIÂ
11175
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IC LA7830
Abstract: LA7830 LA7830 equivalent la7621 LA7629 LA 7831 ctv circuit diagram IC vertical lg la 7830 LA 7830 vertical TV Circuit
Text: I SAiYO I J LA7629 NO.Z837A Monolithic Linear IC Color TV/Video, Chrom a, Deflection C ircu it - H,- ,|i *<# The LA7629 is a small-sized m ultifunctional IC containing the “video, c h r o m a /|0 lile c ti^ ^ ^ c u it of ftTSC color TV in a. DIP30S equivalent to the DIP22 package heretofore in use jrf^ihrif\|^pe. B i^ides4eing
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LA7629
DIP30S
DIP22
LA7520N/7566
LA7830,
LA7G20
LA1835,
LA7620
LA7621
IC LA7830
LA7830
LA7830 equivalent
la7621
LA 7831
ctv circuit diagram
IC vertical lg
la 7830
LA 7830 vertical TV Circuit
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vqfp100 package
Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Text: Dimensions I l l II I I I I Dimensions •DIP/SDIP/SK-DIP Unit : mm DIP 14 DIP8 o o 0. 5+ 0. I O’ - |[o's±o. 15" 1 O' ~ I 5 ' DIP 18 DIP 16 o 19 . 4 ± 0. 3 l?6_ ' o 9 -t-i I l;.5±o, I ’o" DIP22 DIP20 22 O 12 () ) o O H J v °.5 .± 0 . I 0.5± 0. I
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DIP20
DIP22
DIP24
DIP28
SQFP56
VQFP80
FP-A64
FP-T80
SQFP-T80
SQFP100
vqfp100 package
VQFP-100
Tray SOP24
065j
SCHP30
p04m
BA4558F-T1
SQFP-144
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