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    EMP24 Search Results

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    EMP24 Price and Stock

    Kang Yang Hardware Enterprise Co Ltd KYI-EMP2-4V0

    Light Pipe
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey KYI-EMP2-4V0 Bulk 190 5
    • 1 -
    • 10 $1.18
    • 100 $0.8
    • 1000 $0.8
    • 10000 $0.8
    		Buy Now

    Pomona Electronics EMP-240-0#

    TIP PLUG TO TIP PLUG 240"
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EMP-240-0# Bulk
    • 1 -
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    RS EMP-240-0# Bulk 1 Weeks 24
    • 1 -
    • 10 -
    • 100 $11.39
    • 1000 $11.39
    • 10000 $11.39
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    L-com Inc PXPEMP2-410P-E

    PHOTOELECTRIC SENSOR, FLAT STYLE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PXPEMP2-410P-E Bulk 1
    • 1 $52.84
    • 10 $40.921
    • 100 $35.2
    • 1000 $35.2
    • 10000 $35.2
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    RS PXPEMP2-410P-E Bulk 3 Weeks 1
    • 1 $42.67
    • 10 $42.67
    • 100 $42.67
    • 1000 $42.67
    • 10000 $42.67
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    L-com Inc PXPEMP2-410N-E

    PHOTOELECTRIC SENSOR, FLAT STYLE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PXPEMP2-410N-E Bulk 1
    • 1 $43.45
    • 10 $33.241
    • 100 $27.7625
    • 1000 $27.7625
    • 10000 $27.7625
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    RS PXPEMP2-410N-E Bulk 3 Weeks 1
    • 1 $33.65
    • 10 $33.65
    • 100 $33.65
    • 1000 $33.65
    • 10000 $33.65
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    L-com Inc PXPEMP2-410N-WD

    PHOTOELECTRIC SENSOR, FLAT STYLE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PXPEMP2-410N-WD Bulk 1
    • 1 $40.4
    • 10 $30.763
    • 100 $25.5489
    • 1000 $25.4
    • 10000 $25.4
    		Buy Now
    RS PXPEMP2-410N-WD Bulk 3 Weeks 1
    • 1 $30.79
    • 10 $30.79
    • 100 $30.79
    • 1000 $30.79
    • 10000 $30.79
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    Find more EMP24 price and stock on Findchips.com

    EMP24 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: パッケージ外形図 EMP24-E2 0 ~8ﾟ 1 5 .4 ±0 . 2 13 1 12 1 0. 3 ±0 .4 7 . 5 ±0. 1 0. 6 24 0 .1 0 1. 2 7 0. 2 ±0 .1 2 .5 ± 0. 1 5 0 .2 8 ±0 .0 5 0 .4 2 ±0 .1 単位 : mm Ver.2005-08-20


    Original     		PDF EMP24-E2

    EMP24-E3

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS EMP24-E3 0 ~ 8° 15.4±0.2 13 1 12 10.3±0.4 7.5±0.1 0.6 24 0.10 1.27 0.2±0.1 2.5±0.15 0.28±0.05 0.42±0.1 UNIT : mm


    Original     		PDF EMP24-E3 EMP24-E3

    diode E2

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS EMP24-E2 0 ～8ﾟ 15 . 4 ±0. 2 13 1 12 1 0 .3 ±0 . 4 7.5 ±0.1 0 .6 24 0 .1 0 1 .2 7 0.2 ±0.1 2 .5 ± 0 . 15 0 .2 8 ±0 .0 5 0. 4 2 ±0. 1 UNIT : mm Ver.2005-08-26


    Original     		PDF EMP24-E2 diode E2

    EMP24-E3

    Abstract: No abstract text available
    Text: パッケージ外形図 EMP24-E3 0 ~8° 15.4±0.2 13 1 12 10.3±0.4 7.5±0.1 0.6 24 0.10 1.27 0.2±0.1 2.5 ±0.15 0.28±0.05 0.42±0.1 単位 : mm


    Original     		PDF EMP24-E3 EMP24-E3

    motor winding formula

    Abstract: NJM6219 NJM6219E3
    Text: NJM6219 STEPPER MOTOR DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE The NJM6219 is a stepper motor driver, which consists of a LS-TTL compartible logic input stage, off time control circuits and a pair of high power H-bridges and protection diodes. The output current is up to 1000mA.


    Original     		PDF NJM6219 NJM6219 1000mA. NJM6219E3 1000mA EMP24 motor winding formula NJM6219E3

    VQFN28

    Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
    Text: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 VQFN28 DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420

    EMP20-E2

    Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP20-E2 QFP80 QFP64 package QFP80-C3 SSOP20

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。


    Original     		PDF 50pcs/ 25pcs/ 20pcs/ 16pcs/ 10pcs/ DIP16 DIP18 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    JIS C 0806

    Abstract: ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


    Original     		PDF ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 JIS C 0806 ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3

    ARM5

    Abstract: NJM2670E3 NJM2670 DIP-22 NJM2670D2 PD125 PD25
    Text: NJM2670 デュアルＨブリッジドライバ • 概要 ■ 外形 ＮＪＭ２６７０は汎用Ｈブリッジドライバで耐圧は６０ Ｖです。 基本回路として 2 つの高出力 H ブリッヂ、サーマ ルシャットダウン回路で構成されています。信号入力部は


    Original     		PDF NJM2670 NJM2670D2 NJM2670E3 DIP-22EMP-24 DIP-22 EMP-24 U2009T DIP16) ARM5 NJM2670E3 NJM2670 DIP-22 NJM2670D2 PD125 PD25

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2

    DIP18

    Abstract: DIP20 DIP40
    Text: スティックケース寸法図 ３．スティックケース寸法図 DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC パッケージ品はスティックケースでの出荷が可 能です。以下にスティックケースの寸法を示します。


    Original     		PDF 14/16pin) DIP14 DIP16 DIP14-D1 DIP14-D1 DIP16-D2/D3 DIP16-D2/D3 18/20pin) DIP18 DIP20 DIP40

    DMP14

    Abstract: DMP16 EMP14 SDMP30 SSOP10
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを


    Original     		PDF OT-89 USB10-C3 USB12-E3 BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 SDMP30 SSOP10

    JRC 6001

    Abstract: JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2
    Text: テーピング寸法図 ４．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）」に準じ、エンボスキャリアテーピングの規


    Original     		PDF EIAJET-7101: JISC-0806: 14pin 30pin 24pin 20pin 16pin 18pin JRC 6001 JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2

    NJM3775D2

    Abstract: NP3775 NJM3775 NJM3775E3 NJM3775FM2 PLCC28 3775D2
    Text: NP3775 DUAL STEPPER MOTOR DRIVER • GENERAL DESCRIPTION The NJM3775 is a switch-mode chopper , constantcurrent driver with two channels: one for each winding of a two-phase stepper motor. NJM3775 is equipped with a Disable input to simplify half-stepping operation.


    Original     		PDF NP3775 NJM3775 750mA NJM3775D2 NJM3775E3 NJM3775FM2 NJM3775D2 NP3775 NJM3775E3 NJM3775FM2 PLCC28 3775D2

    all transistor

    Abstract: VCP 200 DIP18 NJW4371 EMP24
    Text: NJW4371 デュアルHブリッジドライバ •概要 NJW4371は出力にDMOSを採用した汎用デュアルHブリッジドライ バICです。 出力部は高い効率を実現するために、Nｃh DMOSにて 構成され、ゲートドライブ用のチャージポンプを内蔵しています。 ま


    Original     		PDF NJW4371 NJW4371DMOSH NJW4371E3 NJW4371D 1000mA EMP24DIP18 EMP24 DIP18 all transistor VCP 200 DIP18 NJW4371 EMP24

    B7 SOT-89

    Abstract: DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF EQFN14-D7 QFN12-11 QFN16-21 QFN16-44 QFN24-T2 QFN24-34 QFN28-N2 QFN48-Q1 PCSP14-C3 PCSP16-E4 B7 SOT-89 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2

    DIP18

    Abstract: DIP20 DIP40 702 mini transistor
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 O-220F O-220F-4 25pcs/tube PLCC28-M2 DIP18 DIP20 DIP40 702 mini transistor

    ET-7101

    Abstract: jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


    Original     		PDF ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 ET-7101 jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30

    QFP-144L

    Abstract: VSP8 Package EMP8
    Text: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 0.51M IN 1.0±0.2 0.46±0.1 2.54 2.8M IN 0.74MAX 4.7M AX 1.5±0.2 +0.15 0.25 -0.05 ~ 15º UNIT: mm 19.0±0.3 DIP14 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51M IN 4.7M AX 2.03MAX +0.15


    Original     		PDF 74MAX DIP14 03MAX DIP16 51MIN 76MAX DIP16-D2 25MAX 84MAX 33MAX QFP-144L VSP8 Package EMP8

    EMP24-E3

    Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP24-E3 EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10

    DMP24 JRC

    Abstract: kw2j JRC 8002 EMP14 SDMP30
    Text: テーピング寸法図 ３．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）


    Original     		PDF EIAJET-7101: JISC-0806: 14pin 20pin 24pin 30pin 16pin 18pin DMP24 JRC kw2j JRC 8002 EMP14 SDMP30

    SSOP10

    Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


    Original     		PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube SSOP10 SSOP10 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    all transistor

    Abstract: NJW4371
    Text: NJW4371 DUAL H BRIDGE DRIVER GENERAL DESCRIPTION The NJW4371 is a general purpose dual H Bridge driver IC. It consists of a pair of Nch DMOS H bridges, gate driving charge pump circuit, thermal shut down and UVLO circuit. Each H bridge can individually be controlled with TTL/CMOS compatible


    Original     		PDF NJW4371 NJW4371 NJW4371E3 1000mA 100nF, -50dg 150dg all transistor