DK91 Search Results

5d surface mount diode

Abstract: SWITCHING DIODE 5D marking 5D diode free diode diode marking 5D DK914LLD03 diode 5d marking 5d 5d surface diode
Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD WBFBP-03D Plastic-Encapsulate DIODE WBFBP-03D DK914LLD03 SWITCHING DIODE TOP 1.0x1.0×0.5 unit: mm DESCRIPTION Epitaxial planar Silicon diode + - 1. ANODE 2. NC 3.CATHODE FEATURES Fast Switching Speed Ultra-Small Surface Mount Package

dk91

Contextual Info: page 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DK91 sheet 1 1 2 2 A B C D E F G H I J FP date 1949.06.06 1953.11.11 1949.06.06 1953.11.11 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 1948.10.23 2000.01.21

Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD WBFBP-03D Plastic-Encapsulate Diodes - WBFBP-03D DK914LLD03 SWITCHING DIODE 1.0x1.0×0.5 unit: mm DESCRIPTION Epitaxial planar silicon diode TOP + 1. ANODE - 2. NC 3.CATHODE FEATURES Fast Switching Speed

Contextual Info: 1.85-inch 47 mm 5 x 8 Dot Matrix LED Display D-N918, D-K918, and DEGK918 Series_ The 918 group is designed to minimize space between pixels to better blend the dots together. The diameter of each dot is 5 mm, the same as in the popular "2-inch" displays, but the dot-to-dot pitch is reduced to 6 mm vs. the standard 7.62 mm.

dk91

Abstract: "10k 911" tt 4458 1S53 Vg30 S6375 Scans-0017813 DK 91
Contextual Info: DK 91 HEPTODE'for use as frequency changer in battery sets HEPTODE pour l'utilisation comme changeuse de fré­ quence dans des appareils batterie HEPTODE zur Verwendung als Mischröhre in Batteriegerfiten Heating: direct by battery current, rectified A.C.

Self-Oscillating mixer

Abstract: mixer tojo Scans-0017813 DK 91
Contextual Info: D K 91 D K 91 B a tte ry -o p e ra te d frequency changer Tlie h ep to d e D K 91 is a frequency changer for b a tte ry receiver’s designed to o p erate on low voltages; h av in g reg ard also to its sm all size, it is therefore h ighly su itab le for use in p o rta b le sets. The filam en t

dallas date code ds1230

Abstract: 25091 e8 sot223 24446
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC

Hyundai 9944

Abstract: nseb ds1000m-100 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7

DS1233 a5

Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC

MLX91802

Abstract: DK91801 TPMS transceiver carrier lfn 650 Car remote keyless entry schematic diagram 100-450 KPA piezoresistive pressure sensor tpms MLX91801KXZ-EAF-000-RE Mlx16 mems sensor for car
Contextual Info: MLX91801/2 Tire Pressure Monitoring SiP Features and Benefits Application Examples Low-Power Microcontroller-based PressureTemperature-Battery monitor, ideally suited for TPMS Ready to use Melexis firmware MLX91802 or customer’s firmware (MLX91801) Different available pressure ranges up to 1400

74 HTC 192

Abstract: DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%

fds5002

Abstract: dallas E8 24715
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC

DN901118AAB

Abstract: c5 99 sot223 dk91
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA

MLX16

Contextual Info: MLX91801 Tire Pressure Monitoring SiP Features and Benefits Application Examples 1 Low-Power Microcontroller-based PressureTemperature-Battery monitor, ideally suited for TPMS 1 Different available pressure ranges up to 1400 kPa 1 Measurement of car and truck tire pressure

Contextual Info: 1.2-inch 30 mm 5 x 7 Dot Matrix LED Display D-N9121, D-K9121, DEGN9121 & DEGK9121 Series dea Compact and x- and y-stackable, this display is a good choice for a fine resolution sign or characters about one-inch high. SELECTION GUIDE: Color Wavelength lv(mcd/dot) *

ti 9919

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA

DM92

Abstract: DM-92 472E-06
Contextual Info: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT

ECC89

Abstract: STR 6267 str g 5551 6C51H-B 6N3C ecc189 6H13C 6l6gt str f 6267 6CM5
Contextual Info: 6 Z a 121200 MOSKVA G 200 ELECTRONQRGTECHNICA 5 2 ELORG MOSKVA 200 0 240-96-07 5 3 411.386 REPLACEMENT GUIDE for USSR and FOREIGN ELECTRONIC TUBES U SSR - M O SC O W Type of U SSR Foreign eq u ivalen ts iA in 1147c 1142111 31422c 5J1038M 5I43C 5I44M K 5I44C

Scans-048

Abstract: DS3205 la 1201 DSAGER00040 dl93 N675 UG 22 W
Contextual Info: D I C D 1F D 2 C D 2 F Type Uf If 1,25 1,4 1,25 1,4 0,05 0,1 0,1 0,24 B B B ß Heizart N*> Ho N !») EP Verw. 135 150 135 250 Ua - 3 :*>) - - - - — — — _ 100.150 5 1,5 -11 - - 250 7,5 5,5 Ug-0 Ug± Ug 3 Ugt frgfl Ia ht S D Ri 2 3 - 3 — 1 — - 0,65

3TE445

Abstract: 2N3303 ECC88 TAA*310 B9D TRANSISTOR BYY32 GEX36/7 Ferranti zs70 6ej7 3n159
Contextual Info: Radio Valve and Transistor Data Characteristics of 3,000 Valves and Cathode Ray Tubes, 4, 500 Transistors, Diodes, Rectifiers and Integrated Circuits Compiled by A.M.Ball First published February 1949 Ninth Edition published in 1970 by Iliffe Books, an imprint of the Butterworth Group

74 HTC 00

Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%

25821

Abstract: dallas date code ds12887 25854
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC

218E-08

Abstract: ti 9919
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL

997E-07

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY