DN033 Search Results

DN033 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
MSP430PM64 Abstract: MSP430-FET MSP430F16111 dimmer MSP430 MSP430F1611 msp430F SPI code for two way audio communication for msp430 i CC2420 swrc045 Atmel zigbee dimmer Contextual Info: Application Note DN033 Porting of RF Blinking LED Software Example to CC2420 MSP430 By J. Hønsi 1 Keywords • • • • • MSP430 MSP430F1611 IEEE 802.15.4 2 • • • • CC2420 CC2420EM CC2420DB IAR Embedded Workbench GNU RF Blinking LED Software Example	Original	DN033 CC2420 MSP430 MSP430F1611 CC2420 CC2420EM CC2420DB MSP430F1611 MSP430PM64 MSP430-FET MSP430F16111 dimmer MSP430 msp430F SPI code for two way audio communication for msp430 i swrc045 Atmel zigbee dimmer	PDF
TI date code Abstract: 271-14 Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103	Original	DS21352 DN033071AAA DS2108 DN041061AAE TI date code 271-14	PDF
JSTD-020 Abstract: DM035 26438 Contextual Info: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	DS1232L DK038265AAC DS1232 J-STD-020 85C/85% 14x20x DS80CH11 DS80CH11 DN034351AA JSTD-020 DM035 26438	PDF
dallas date code ds1230 Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00	Original	DH046190AAI DS1620 DS1869 DH833210AAB DS5002 DN028766AAD DN030363AAA J-STD-020 DS1302 dallas date code ds1230	PDF
2-5779 Contextual Info: RELIABILITY MONITOR DS1230AB-200 JUL '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-A 0019 720 117143 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25775 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 2 2 25776 PHYSICAL DIMENSIONS MIL-STD-883-2016	Original	DS1230AB-200 DS1230 MIL-STD-883-2003 MIL-STD-883-2016 60C/90% DS3816 DS3801 -C501 2-5779	PDF
25821 Abstract: dallas date code ds12887 25854 Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC	Original	DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854	PDF
997E-07 Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY	Original	DK031452AB DS21352 DM941230AG DN041061AAE DK007198AAF DK016058AA DK016058AA DS2108 997E-07	PDF
25804 Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1	Original	DS1000Z-25 DS1000 DE009456ACE 150x1 DS87C520 DE029195AAB 650x65 25804	PDF