dow corning 732
Abstract: Dow Corning DC-4 material safety for nitrile rubber methyltriacetoxysilane acetic acid
Text: PRODUCT SAFETY DATA SHEET According to EC directive 91/155/EEC and subsequent amendments Version: 1.5 Revision Date: 14.01.2004 DOW CORNING R 732 INDUSTRIAL SEALANT BLACK 1. IDENTIFICATION OF THE SUBSTANCE AND OF THE COMPANY Trade name : DOW CORNING(R) 732 INDUSTRIAL SEALANT BLACK
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91/155/EEC
B-7180
dow corning 732
Dow Corning DC-4
material safety for nitrile rubber
methyltriacetoxysilane
acetic acid
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dow corning 732
Abstract: Dow Corning methyltriacetoxysilane Dow Chemical Company Amorphous 7631-86-9 425334 dow corning 112
Text: PRODUCT SAFETY DATA SHEET According to EC directive 91/155/EEC and subsequent amendments Version: 1.0 Revision Date: 28.06.2000 DOW CORNING R 732 ADHESIVE SEALANT BLACK 1. IDENTIFICATION OF THE SUBSTANCE AND OF THE COMPANY Trade name : DOW CORNING(R) 732 ADHESIVE SEALANT BLACK
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91/155/EEC
B-1310
144673product
dow corning 732
Dow Corning
methyltriacetoxysilane
Dow Chemical Company
Amorphous 7631-86-9
425334
dow corning 112
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MIL-S-8660
Abstract: MIL-S-8660C 8660C Corning
Text: Product Information DOW CORNING 4 Electrical insulating compound FEATURES • High dielectric strength Grease like material containing an inert silica filler in combination with selected polydimethyl silicone fluids • Low volatility APPLICATIONS • Moisture resistant
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MIL-S-8660C
10-1187D-01
MIL-S-8660
MIL-S-8660C
8660C
Corning
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dow corning 732
Abstract: Dow Corning DC 11 Dow Corning DC 896 MIL-A-46106A MIL-A-46106 Dow Corning DC 1200 Dow Corning Taiwan 0097B 10-1096E-01 PRIMER
Text: Product Information DOW CORNING 732 Multi-Purpose Sealant FEATURES Multi-purpose silicone adhesive/sealant • One-component adhesive/sealant • Cures at room temperature when exposed to moisture in the air • Acetoxy cure system • Non-sag, paste consistency
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MIL-A-46106A
0097B
D1475
D2240
APPLICAT87
01-1125C-01
dow corning 732
Dow Corning DC 11
Dow Corning DC 896
MIL-A-46106A
MIL-A-46106
Dow Corning DC 1200
Dow Corning Taiwan
10-1096E-01
PRIMER
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Dow Corning 340
Abstract: Dow Corning Dow Corning d 340 DOW 340 heat sink compound 340 Heat Sink Compound Semco cartridge AGP5223 D 217 dow corning silicone compound
Text: Product Information Silicon-Based Compounds Dow Corning 340 Heat Sink Compound FEATURES • High thermal conductivity • Low bleed • Stable at high temperatures COMPOSITION • Greaselike silicone fluid thickened with metal oxide filler Compound provides thermal coupling of electrical/electronic
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sic wafer
Abstract: No abstract text available
Text: Correlation between carrier recombination lifetime and forward voltage drop in 4H-SiC PiN diodes 1 ,a Gil Chung , M. J. Loboda1), Sid Sundaresan2) and Ranbir Singh2) 1 Dow Corning Compound Semiconductor Solutions, Midland MI 48611, USA 2 GeneSiC Semiconductor Inc., Dulles, VA, 20166, USA
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00A/cm2.
N00014-05-C-0324
sic wafer
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Dow Corning DC 11
Abstract: Dow Corning Q3-6611 Q36611 Dow Corning 307 polysulphide Dow Corning DC 11 compound
Text: Product Information DOW CORNING Q3-6611 Adhesive FEATURES Flowable, one-component silicone adhesive • One-part • Flowable • Rapid heat cure • Addition cure system: no cure by-products • Self-priming • High tear strength • Flexible rubber - protects against
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Q3-6611
10-1169C-01
Dow Corning DC 11
Dow Corning
Q3-6611
Q36611
Dow Corning 307
polysulphide
Dow Corning DC 11 compound
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Dow Corning 736
Abstract: Dow Corning FPH29194
Text: Product Information Silicone Sealants Dow Corning 736 Heat Resistant Sealant FEATURES • Will not sag or run • May be applied overhead or on side walls • May be used in applications with continuous exposure to 260°C 500°F and intermittent exposure
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305-mL
300-mL
52-gal)
10-730C-01
FPH29194
Dow Corning 736
Dow Corning
FPH29194
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SC102
Abstract: intel 2114 4405 delta young DHS-C8979-03 2114 Delta Electronics
Text: DHS-C8979-03 Specification: • Material: Copper 1100 · Weight: 500 g ref. · Type: Soldering · Dimension: 88.9*79*25.5 (mm) · Heat Source size: 31*31 (mm) · Thermal Interface Material: Dow Corning SC102 · Test Condition: Fully Confined · Application: Intel Socket 603/604 Nocona CPU
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DHS-C8979-03
SC102
283A0404
SC102
intel 2114
4405
delta
young
DHS-C8979-03
2114
Delta Electronics
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Sylgard 170
Abstract: Dow Corning 4 Catalyst sylgard 160 Dow Corning 140 MIL-PRF23586F SYLGARD low volatile potting silicone 92023 CORNING Resistor sylgard 186
Text: P R O D U C T I N F O R M A T I O N Information about Dow Corning brand Silicone Encapsulants Silicones and Electronics Long-term, reliable protection of sensitive circuits and components is becoming more important in many of today’s delicate and demanding electronic applications. Silicones function as durable
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AGP7297
10-898E-01
Sylgard 170
Dow Corning 4 Catalyst
sylgard 160
Dow Corning 140
MIL-PRF23586F
SYLGARD
low volatile potting silicone
92023
CORNING Resistor
sylgard 186
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Sylgard 170
Abstract: No abstract text available
Text: Product Information Electronics Encapsulants FEATURES & BENEFITS • Low viscosity Long working time Room temp or heat accelerated cure Moderate thermal conductivity UL 94V-0 and Mil Spec tested to MIL-PRF-23586F specifically listed material numbers only
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MIL-PRF-23586F
11-3181C-01
Sylgard 170
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Untitled
Abstract: No abstract text available
Text: Product Information Solar Sylgard 184 Silicone Elastomer FEATURES • Transparent • Cures to flexible elastomer • Constant cure rate, regardless of sectional thickness or degree of confinement • Service range of -45 to 200°C -49 to 392°F • No post cure required
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AGP8735
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SYLGARD 527
Abstract: SYLGARD 527 A B Dow Corning 527 D1084 SYLGARD 527 A B gel Dow Corning SYLGARD D1824 silicone red rubber viscosity
Text: Product Information SYLGARD 527 Silicone dielectric gel FEATURES Purity tested gel • Two-part, 1:1 mixing ratio • Low viscosity • Room temperature cure or rapid heat cure • Addition cure system: no cure by-products • Self-healing gel • Permanent pressure sensitive
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61-0390J-01
SYLGARD 527
SYLGARD 527 A B
Dow Corning 527
D1084
SYLGARD 527 A B gel
Dow Corning
SYLGARD
D1824
silicone red rubber
viscosity
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Dow Corning 340
Abstract: DOW 340 Dow Corning POWER MODULE TM 31 SIL-PAD transistor Common Base configuration STR-M65 strs 20 silicone grease SMA70
Text: PACKAGE OUTLINES POWER MULTI-CHIP MODULE PMCM SERIES SLA70 — — M Dimensions in Inches (Based on 1 mm = 0.03937”) 0.126 ±0.006 x 0.150 1.22 ±0.008 0.126 ±0.006 0.961 ±0.008 ø 0.189 ±0.008 0.646 0.512 ±0.008 0.390 ±0.008 0.630 0.067 ±0.004
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SLA70
MK-002-18
MK-003-9
Dow Corning 340
DOW 340
Dow Corning
POWER MODULE TM 31
SIL-PAD
transistor Common Base configuration
STR-M65
strs 20
silicone grease
SMA70
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DOW 1-2620
Abstract: Dow Corning 1-2620 low voc RTV Silicone Dow Corning RTV Silicone Dow Corning 1-2577 dow 1-2577 asymtek conforming corning 1-2577 12620 conformal rabbit semiconductor TN303
Text: TN303 Conformal Coating Z-World has started to apply conformal coating to high-impedance circuits such as the 32 kHz oscillator on Rabbit-based boards to protect them from moisture and contaminants. This Technical Note explains the purpose, types, and application procedures for the conformal coatings used to protect these sensitive circuits.
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TN303
DOW 1-2620
Dow Corning 1-2620 low voc RTV Silicone
Dow Corning RTV Silicone
Dow Corning 1-2577
dow 1-2577
asymtek
conforming corning 1-2577
12620
conformal
rabbit semiconductor TN303
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molex 2759T 08-50
Abstract: WIESON 2510c888-001 wire 1007 AWG24 Socket 754 C1100 AMD athlon socket 754 Dow Corning 340 heat sink socket 478 Dow Corning AMD Athlon 5000 k8
Text: FHS-A7015A40/FHS-A7015B40 Application: • Intel Socket 478 Prescott FMB1.5 Thermal & Mechanical Specification: · Thermal resistance: 0.28oC/W ref. · Heatsink Weight: 370 g (ref.) · Clipping Force: 32.0 Kgf (ref.) Component Specification: Noise (dBA) Thermal Resistance
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FHS-A7015A40/FHS-A7015B40
28oC/W
C1100
SC102
288A0404
molex 2759T 08-50
WIESON 2510c888-001
wire 1007 AWG24
Socket 754
AMD athlon socket 754
Dow Corning 340
heat sink socket 478
Dow Corning
AMD Athlon 5000 k8
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Polydimethylsiloxane
Abstract: power supply hv laser co2 MSDS ferrite Dow Corning DC 11 40KV CABLE HV transformer 5kv LC1202 40kv transformer SERVICE MANUAL OF FLUKE 724 Dow Corning 340
Text: INSTRUCTION MANUAL FOR LC1202 HIGH VOLTAGE POWER SUPPLY 83-494-001 Revision D TDK-Lambda Americas Inc. 405 ESSEX ROAD, NEPTUNE, NJ 07753 TEL: 732 922-9300 FAX: (732) 922-9334 WEB: www.US.TDK-Lambda/HP THIS PAGE INTENTIONALLY BLANK ONE YEAR WARRANTY TDK-Lambda Americas, Inc. (405 Essex Road, Neptune, N.J. 07753), warrants that the unit is free from defects in
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LC1202
Polydimethylsiloxane
power supply hv laser co2
MSDS ferrite
Dow Corning DC 11
40KV CABLE
HV transformer 5kv
40kv transformer
SERVICE MANUAL OF FLUKE 724
Dow Corning 340
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Untitled
Abstract: No abstract text available
Text: XAL - 53 Description Explosion-Proof Pull Station Applications The KILLARK , XAL-53 fire alarm stations are suitable for use in the following conditions: • Hazardous areas due to the presence of flammable gases or vapors, combustible dusts or easily ignitable
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XAL-53
XAL-53
SBA-10
CS-2506
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austerlitz WPS
Abstract: austerlitz wacker P12 v6515 Wacker igbt eupec V6515 Paste Dow Corning d 340 Dow Corning 340 wps 50gr
Text: APPLICATION NOTE Date: 2002-12-19 Page 1 of 4 AN Number: AN2002-12 Aging stability of various heatconducting pastes for use with modules without baseplates Heat-conducting pastes from various manufacturers were tested for their aging stability in conjunction with an
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AN2002-12
V6515
austerlitz WPS
austerlitz
wacker P12
v6515
Wacker
igbt eupec
V6515 Paste
Dow Corning d 340
Dow Corning 340
wps 50gr
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Delta Electronics
Abstract: a6063 molex 2759T intel lga775 Dow Corning TC 1996 FHS-A9025S16 TC-1996* Dow Corning Q8000 TC-1996 Dow Corning
Text: FHS-A9025S16 DELTA ELECTRONICS, INC. Application: Picture: Intel LGA775 Wolfdale / Yorkfield 45nm CPU E8000/E7000/E6000/E5000/Q9000S/Q8000S sequence Thermal & Mechanical Spec.: Thermal performance for 65W CPU HSK Assembly Weight: 205 g (ref.) Clipping Force: 20 Kgf (ref.)
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FHS-A9025S16
LGA775
E8000/E7000/E6000/E5000/Q9000S/Q8000S
A6063
TC-1996
90x90x25
July-2009
Delta Electronics
molex 2759T
intel lga775
Dow Corning TC 1996
FHS-A9025S16
TC-1996* Dow Corning
Q8000
Dow Corning
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Untitled
Abstract: No abstract text available
Text: REVISIONS MATERIALS: 1. 2. 3. 4. 5. INSULATOR = VIRGIN WHITE TEFLON PER ASTM D 1710, GRADE 1, TYPE I, CLASS ” B ” . CONTACT Sc WIRE ADAPTOR = BERYLLIUM COPPER PER ASTM B 196, ALLOY C 173 0 0 , TEMPER TD04. GASKET = SILICONE RUBBER PER 4 5 - 5 5 DUROMETER DOW CORNING SILASTIC 250.
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burle 8850
Abstract: Harshaw scintillator pmt Power Supply Schematic Diagram pmt divider circuit burle tc electronic 40 w tube light circuit harshaw scintillator crystal harshaw CO52 burle
Text: Photomultiplier 51-mm 2-inch Diameter 12-Stage, End Window Quantacon PMT The BURLE 8850 is a 12-Stage, end-win- - Low Dark Noise dow, 51-mm (2-inch) Quantacon™ photom - High Gain ultiplier employing a semi-transparent bialkali photocathode and an extremely high-gain
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51-mm
12-Stage,
AJ2252.
burle 8850
Harshaw scintillator
pmt Power Supply Schematic Diagram
pmt divider circuit
burle tc
electronic 40 w tube light circuit
harshaw scintillator crystal
harshaw
CO52
burle
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Untitled
Abstract: No abstract text available
Text: SPECIFICATION CONTROL DRAWING 1. MATING INTERFACE DIMENSIONS PER MIL-STD-348 Fig. 326.2 SMP MALE 2. ELECTRICAL DC TO 39.0 GHz. 1.02 + .003 x FGHz. .045 dB x 7 FGHz. 50 250 N/A - 6 5 ° c TO +165 ° c 750 FREQUENCY RANGE G H z -VSWR (MAX.) * -INSERTION LOSS (d B M AX) * -NOMINAL IMPEDANCE (OHMS)-VOLTAGE RATING (MAX VRMS)-RF LEAKAGE (MIN. dB DOW N)-TEMPERATURE RATING (DEGREES CENTIGRADE) —
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MIL-STD-348
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Untitled
Abstract: No abstract text available
Text: SPECIFICATION CONTROL DRAWING 1. MATING INTERFACE DIMENSIONS PER DYNAWAVE SPEC. MD-21 SMP MALE AND MIL-STD-348A - 326.2 2 . ELECTRICAL DC TO 39.0 GHz. 1.02 + .003 x FGHz. .045 dB x VFGHz. 50 250 N/A - 6 5 ° c TO +165 ° c 750 FREQUENCY RANGE GHz • VSWR (M A X ) * -INSERTION LOSS (d B M AX) * NOMINAL IMPEDANCE (O H M S )VOLTAGE RATING (MAX VRMS)-RF LEAKAGE (MIN. dB DOW N)-TEMPERATURE RATING (DEGREES CENTIGRADE)-DIELECTRIC WITHSTANDING VOLTAGE (MAX VRMS)
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MD-21
MIL-STD-348A
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