DPD16M Search Results

Contextual Info: PENSE-PAC 64 Megabit CM OS DRAM DPD16MX4PY5 VI i C R 0 S Y S i H M S D E S C R IP T IO N : The DPD16MX4PY5 is the 16 Megx 4 Dynamic RAM module that utilize the new and innovative space savingTSOP stacking technology. The module is constructed of four 16 Meg x 1

Contextual Info: DENSE-PAC MICROSYSTEMS 64 Megabit C M O S D R A M DPD16MX4PKY5 PRELIMINARY D E S C R IP T IO N : The DPD16M X4PKY5 is the 16 M eg x 4 Dynamic R A M module that utilize the new and innovative space saving 300m il T S O P stacking technology. The module is constructed of four 16 Meg x 1 Dynamic RAM's.

D032

Contextual Info: DENSE-PAC MICROSYSTEMS 640 Megabit C M O S D R A M DPD16MS40PKW5 PRELIMINARY D E S C R IP T IO N : The D PD 16M S40PKW 5 is the 16 Meg x 40 Dynamic R A M module in the family of S o p e rS / M M modules that utilize the new and innovative space saving TSOP

Contextual Info: DENSE-PAC MICROSYSTEMS 640 Megabit CMOS DRAM DPD16MX40PKW5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The DPD16MX40PKW5 is the 16 Meg x 40 ECC Dynamic RAM module in the family of SuperSIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 4 stacks consisting of four 16 Meg x

Contextual Info: D E N S E - P A 512 Megabit C M O S D R A M C M I C E OS Y S T EM S DPD16MS32PW5 PRELIMINARY DESCRIPTION: The DPD16MS32PW 5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM1*1 modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface

Contextual Info: DENSE-PAC 512 Megabit CMOS DRAM DPD16MS32PW5 MICROSYSTEMS ADVA N CED INFORM ATION PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the fam ily of S uper SIMM modules that utilize the new and innovative space saving TSOP

du27

Abstract: AL3124 d04s DU32 1-23AL
Contextual Info: DENSE-PAC 1152 Megabit CMOS DRAM MI C R O S Y Ë T EM S DPD16MS72RW5 ADVANCED INFORMATION PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS72RW5 is the 16 Meg x 72 Dynamic RAM module in the family of Super DIMM modules that utilize the new and innovative space saving TSOP

CL480

Contextual Info: 576 Megabit CMOS DRAM DPD16MS36PW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MS36PW5 is the 16 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface

DQ2451

Abstract: DPD16MS32P
Contextual Info: DENSE-PAC 512 Megabit CMOS DRAM M I C R O S Y ST E M S DPD16MS32PW5 P R E L IM IN A R Y DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the family of S u per SIM/VP modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface

Contextual Info: 640 Megabit CMOS DRAM DPD16MS40PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MS40PKW5 is the 16 Meg x 40 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 12 stacks, 4 consisting of four 16

Contextual Info: 512 Megabit CMOS DRAM DPD16MS32PW5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface

Contextual Info: DENSE-PAC MICROSYSTEMS 576 Megabit CMOS DRAM DPD16MX36PKW5 PRELIMINARY D E S C R IP T IO N : The DPD16MX36PKW5 is the 16 Meg x 36 Dynamic RAM module in the family of S u p erS IM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twelve dynamic RAM stacks

DQ29-DQ31

Contextual Info: D E N S E -P A C 576 Megabit CMOS DRAM MICROSYSTEMS DPD16MS36PKW5 PRELIMINARY D ESCRIPTIO N : PIN -OUT DIAGRAM The DPD16MS36PKW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP

Contextual Info: DENSE-PAC 576 Megabit CMOS DRAM DPD16ML36PL5/DPD16ML36PW5 MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: The DPD16ML36PL5 and the DPD16ML36PW5 are the Low Profile 16 Meg x 36 Dynamic RAM module in the family of SuperSIM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed

16M 72PIN

Contextual Info: DENSE-PAC o vi i c R 576 Megabit CMOS DRAM DPD16MS36RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS36RW is the 16 Meg x 36 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of eight 16M x 4 and four 16M x 1 dynamic RAMs surface mounted on an industry

Contextual Info: PENSE-PAC M Í Ü R O S YS T IÍM S 64 Megabit CM OS DRAM DPD16MX4PKY5 D E SC R IP T IO N : The DPD16MX4PKY5 is the 16 Meg x 4 Dynamic RAM module that utilize the new and innovative space saving 300 mil TSOP stacking technology. The module is constructed of four 16 Megx 1 Dynamic RAM's.

Contextual Info: DENSE-PAC o vi i c R 512 Megabit CMOS DRAM DPD16MS32RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32RW is the 16 Meg x 32 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of eight 16M x 4 dynamic RAM surface mounted on an industry standard 72-pin

Contextual Info: 128 Megabit CMOS DRAM Dense-Pac Microsystems. Inc. ^ DPD16MX8PH4 PRELIMINARY DESCRIPTION: The DPD16MX8PH4 DRAM module is a revo lu tio n ary m em ory system using Dense-Pac M icrosystem s' new 2nd G eneration Stacking Technology. The module combines eight stackable ceramic

Contextual Info: DENSE-PAC 512 Megabit CMOS DRAM MICROSYSTEMS DPD16MX32PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MX32PKW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 12 dynamic RAM stacks surface

A273D

Abstract: 16J3 512X32 48pin
Contextual Info: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32

DQ51d

Contextual Info: DENSE-PAC MICROSYSTEMS 1152 Megabit CMOS DRAM DPD16MS72PKW5 ADVANCED INFORMATION D E S C R IP T IO N : PIN -O U T DIAGRAM The DPD16MS72PKW5 is the 16 Meg x 72 Dynamic RAM module in the family of Super DIMM modules that utilize the new and innovative space saving TSOP

dram zip 256kx16

Contextual Info: INDEX GENERAL PRO D U CT INFORM ATION Dense-Pac Memory Module and Monolithic . 4 Emerging Technology / P r o d u c t s . 5

Contextual Info: DENSE-PAC 576 Megabit CMOSDRAM vi i c Ro SYS r i: m s D PD 16M X36RW PRBJMINARY PIN-OUT DIAGRAM DESCRIPTION: T h e D PD 16M X 3 6 R W i s th e 1 6 M e g x 3 6 D ynam i c RAM m o d u ie an th e jam iiy o f m o d u l e s fh a t u t iliz e th e s p a c e s a v in g TSO P t e c h n o l o g y . T h e m o d u ie i s c o n s t r u c t e d

Contextual Info: 512 MegabitDCMOSDRAM PD 16M X32RW DENSE-PAC vi i c Ro sys r i: m s PRBJMINARY PIN-OUT DIAGRAM DESCRIPTION: T h e D PD 16M X32RW is th e 1 6 M e g x 32 D ynam ic RAM m o d u Je in th e Jam Hy o f m o d u ie s th a tu tU iz e th e sp a c e sa v in g TSO P te c h n o ] o g y . T h e m o d u ie is c o n stru c te d