H-14
Abstract: H-17 MT16LD1664A MT32LD3264A MT8LD864A DF27 MT4LC16M4H9
Text: 8, 16, 32 MEG x 64 NONBUFFERED DRAM DIMMs DRAM MODULE MT8LD864A X, MT16LD1664A X, MT32LD3264A X For the latest data sheet, please refer to the Micron Web site: www.micronsemi.com/datasheets/datasheet.html FEATURES PIN ASSIGNMENT Front View 168-Pin DIMM (H-14; 64MB)
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MT8LD864A
MT16LD1664A
MT32LD3264A
168-Pin
128MB)
256MB)
168-pin,
128MB
256MB
096-cycle
H-14
H-17
DF27
MT4LC16M4H9
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EDI9G361024C
Abstract: No abstract text available
Text: EDI9G361024C 1024K x 36 Static RAM CMOS, High Speed Module FEATURES DESCRIPTION n 1024K x 36 bit CMOS Static The EDI9G361024C is a high speed 36Mb Static RAM module organized as 1024K words by 36 bits. This module is constructed from nine 1024K x 4 Static RAMs in SOJ packages on an epoxy
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EDI9G361024C
1024K
EDI9G361024C
9G361024C
EDI9G361024C15MNC
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Untitled
Abstract: No abstract text available
Text: UG9M43722 4 KBG(T) 16M Bytes (4M x 36) DRAM 72Pin SIMM w/ECC based on 4M X 4 General Description Features The UG9M43722(4)KBG(T) is a 4,149,304 bits by 36 SIMM module.The UG9M43722(4)KBG(T) is assembled using 9 pcs of 4Mx4 2K/4K refresh DRAMs 300mil SOJ Package mounted on 72 Pin
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UG9M43722
72Pin
300mil
1000mil)
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Untitled
Abstract: No abstract text available
Text: UG10M14001DBG T Revision History Feb 17 , 1999 Rev - B Feb 16 , 1999 Rev - A Added More Detailed Dimension Information Of PCB , Full Data sheet Changed to new format. Data sheet released. 45388 Warm Springs Blvd. Fremont, CA. 94539 Tel: (510) 668-2088 Fax: (510) 661-2788
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UG10M14001DBG
72Pin
300Mil
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Untitled
Abstract: No abstract text available
Text: UG216D3654HKG T 64M Bytes (16M x 36) DRAM 72Pin SIMM w/ECC based on 16M X 4 General Description Features The UG216D3654HKG(T) is a 16,777,216 bits by 36 SIMM module.The UG216D3654HKG(T) is assembled using 9 pcs of 16Mx4 4K refresh DRAMs 400mil SOJ Package mounted on 72 Pin
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UG216D3654HKG
72Pin
16Mx4
400mil
1000mil)
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Untitled
Abstract: No abstract text available
Text: V826632M24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MICRODIMM MODULE Features Description • 172 Pin Unbuffered 33,554,432 x 64 bit Organization DDR MICRODIMM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in SOC Packages ■ Single +2.5V ± 0.2V Power Supply
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V826632M24SA
DDR400
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T 9722
Abstract: Diode T 9722 EDI8G322048C
Text: EDI8G322048C 2048Kx32 SRAM Module 2048Kx32 Static RAM CMOS, High Speed Module Features 2048Kx32 bit CMOS Static Random Access Memory • Access Times: 20, 25, and 35ns • Individual Byte Selects • Fully Static, No Clocks • TTL Compatible I/O High Density Package
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EDI8G322048C
2048Kx32
01581USA
EDI8G322048C
T 9722
Diode T 9722
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1Mx4
Abstract: No abstract text available
Text: UG8M13201DBJ N 4M Bytes (1M x 32 ) DRAM 72Pin SIMM based on 1M X 4 General Description Features The UG8M13201DBJ(N) is a 1,048,576 bits by 32 SIMM module.The UG8M13201DBJ(N) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package,mounted on a 72 Pin unbuffered
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UG8M13201DBJ
72Pin
300mil
500mil)
D661-2788
1Mx4
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"32Mx32" DRAM 72-pin simm
Abstract: HANBit 72-pin SIMM HMD32M32M16G 1760
Text: HANBit HMD32M32M16G 128Mbyte 32Mx32 72-pin Fast Page Mode 4K Ref. SIMM Design 5V Part No. HMD32M32M16G GENERAL DESCRIPTION The HMD32M32M16G is a 32M x 32bit dynamic RAM high-density memory module. The module consists of sixteen CMOS 16M x 4bit DRAMs in 32-pin TSOPII packages mounted on a 72-pin, double-sided, FR-4-printed circuit board. A
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HMD32M32M16G
128Mbyte
32Mx32)
72-pin
HMD32M32M16G
32bit
32-pin
72-pin,
"32Mx32" DRAM 72-pin simm
HANBit 72-pin SIMM
1760
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Untitled
Abstract: No abstract text available
Text: HYM64V1605GU-50/-60 HYM64V1645GU-50/-60 HYM72V1605GU-50/-60 HYM72V1645GU-50/-60 3.3V 16M x 64-Bit EDO-DRAM Module 3.3V 16M x 72-Bit EDO-DRAM Module 168pin unbuffered DIMM Module with serial presence detect • 168 Pin JE D E C Standard, Unbuffered 8 Byte Dual In-Line Memory Module
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64-Bit
72-Bit
168pin
HYM64V1605GU-50/-60
HYM64V1645GU-50/-60
HYM72V1605GU-50/-60
HYM72V1645GU-50/-60
V1605/45GU-50/-60
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Untitled
Abstract: No abstract text available
Text: 4M x 32 -Bit EDO-DRAM Module SMALL OUTLINE MEMORY MODULE HYM32 V4025G D-50/-60 HYM32V4025GDL-50/-60 Advanced Information • 72-Pin Small Outline Dual-in-Line Memory Module • 4 194 034 words by 32-bit organization • Hyper Page Mode - EDO - performance
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HYM32
V4025G
D-50/-60
HYM32V4025GDL-50/-60
72-Pin
32-bit
HYM32V4025GD
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L-DIM-72-3
Abstract: No abstract text available
Text: 4M x 32 -Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE HYM 32V4020G D L -50/-60 Advanced Information • 72-Pin Small Outline Dual-in-Line Memory Module • 4 194 034 words by 32-bit organization • Performance: -50 -60 Read / Write Cycle Time 90 110
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32V4020G
72-Pin
32-bit
HYM32V4020GD
L-DIM-72-3
L-DIM-72-3
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Untitled
Abstract: No abstract text available
Text: IBM11N32645B IBM11N32735B IBM11N32645C IBM11N32735C 32M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • System Performance Benefits: - Non buffered for increased performance - Reduced noise 35 VSs/V cc P^s
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IBM11N32645B
IBM11N32735B
IBM11N32645C
IBM11N32735C
32Mx64,
32Mx72
104ns
11N32645B
11N32735B
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Untitled
Abstract: No abstract text available
Text: IBM11M32730B IBM11M32730C 32M x 72 DRAM MODULE Features • 32Mx72 Dual Bank Fast Page Mode DIMM System Performance Benefits: -Buffered inputs (except RAS, Data) -Reduced noise (32 Vss/Vcc Pir|s) -4 Byte Interleave enabled -Buffered PDs • Performance:
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IBM11M32730B
IBM11M32730C
32Mx72
110ns
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Untitled
Abstract: No abstract text available
Text: IBM11M32735B IBM11M32735C 32M x 72 DRAM Module Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • System Performance Benefits: - Buffered inputs except RAS, Data - Reduced noise (32 VSs/V cc P^s) - 4 Byte Interleave enabled - Buffered PDs
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IBM11M32735B
IBM11M32735C
32Mx72
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Untitled
Abstract: No abstract text available
Text: IBM11N16735B IBM11N16645B IBM11N16735C IBM11N16645C 16M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • 16Mx64.16Mx72 Extended Data Out Page Mode DÎMMs • Performance: -60 Wc [RAS Access Time tCAC
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IBM11N16735B
IBM11N16645B
IBM11N16735C
IBM11N16645C
16Mx64
16Mx72
104ns
75H1640
SA14-4626-02
DD05225
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11M32735B
Abstract: No abstract text available
Text: IBM11 M32735B IBM11 M32735C 3 2 M x 72 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • System Performance Benefits: - Buffered inputs except RAS, Data - Reduced noise (32 V ss/V qq pins)
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IBM11
M32735B
M32735C
32Mx72
104ns
SA14-4627-04
11M32735B
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M8730
Abstract: No abstract text available
Text: IBM11 M8730C IBM11 M8730CB 8M x 72 DRAM MODULE Features System Performance Benefits: • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module -Buffered inputs except RAS, Data -Reduced noise (32 Vss/Vcc pins) • 8Mx72 Dual Bank Fast Page Mode DIMM
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IBM11
M8730C
M8730CB
8Mx72
110ns
130ns
M8730
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Untitled
Abstract: No abstract text available
Text: IBM11M32730B IBM11M32730C 32M x 72 DRAM Module Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 32Mx72 Dual Bank Fast Page Mode DIMM • Performance: -60 Wc RAS Access Time 60ns toAC CAS Access Time 20ns tAA Access Time From Address
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IBM11M32730B
IBM11M32730C
32Mx72
110ns
50H8198
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Untitled
Abstract: No abstract text available
Text: IBM11N8645B IBM11N8735B IBM11N8645C IBM11N8735C 8M x 64/72 DRAM MODULE Features • System Performance Benefits: • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module -Non buffered for increased performance -Reduced noise 35 V s s ^ c c P'ns
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IBM11N8645B
IBM11N8735B
IBM11N8645C
IBM11N8735C
8Mx64,
8Mx72
SA14-4624-04
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Untitled
Abstract: No abstract text available
Text: IBM11 M8735C IBM11 M8735CB 8M x 72 DRAM MODULE Features System Performance Benefits: • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 8Mx72 Dual Bank Extended Data Out Mode DIMM • Performance: : -50 : -60 : -70 RAS Access Tim e 50ns 60ns
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IBM11
M8735C
M8735CB
8Mx72
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Untitled
Abstract: No abstract text available
Text: IB M 1 1 M 4 7 3 5 C IB M 1 1 M 4 7 3 5 C B 4M x 72 DRAM MODULE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Optimized for ECC applications • System Performance Benefits: - • 4Mx72 Extended Data Out Page Mode DIMM • Performance:
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4Mx72
124ns
104ns
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Untitled
Abstract: No abstract text available
Text: Discontinued 9/98 - Iasi order; 3/93 » las! ship IBM11M8735H 8M x 72 DRAM Module Features • 168-Pin JEDEC-Standard 8-Byte Dual In-Line Memory Module Optimized for ECC applications System Performance Benefits: • 8Mx72 Extended Data Out Mode DIMM -Buffered inputs (except RAS, Data)
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IBM11M8735H
168-Pin
8Mx72
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1024 Megabit CMOS DRAM MICROSYSTEMS DPD32MS32PW5 PRELIMINARY PIN-OUT DIAGRAM D ESC R IPT IO N : The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Sup er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks
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DPD32MS32PW5
DPD32MS32PW5
72-pin
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