DS35649 Search Results

Contextual Info: SDM1L30CSP 1A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE Product Summary NEW PRODUCT NEW PRODUCT VRRM V 30 IO (A) 1.0 Features and Benefits VF max(V) @ +25°C 0.40 IR max (mA) @ +25°C 1.0 2 • 2 mm Footprint – 67% smaller than PowerDI123  Off Board Profile of 0.3mm – 70% thinner than PowerDI123

Contextual Info: SDM0230CSP 0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE Product Summary VRRM V 30 IO (mA) 200 Features and Benefits VF(MAX) (V) @ +25°C IR(MAX) (mA) @ +25°C 0.50 0.05 •  2 0.18mm footprint – 70% smaller than DFN1006/SOD923 Off board profile of 0.3mm – more than 30% thinner than the

Contextual Info: SDM1L30CSP 1A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE NEW PRODUCT NEW PRODUCT Product Summary VRRM V IO (A) 30 1.0 Features and Benefits VF(MAX) (V) @ +25°C 0.40 IR(MAX) (mA) @ +25°C 1.0 2 • 2 mm Footprint – 67% smaller than PowerDI123  Off Board Profile of 0.3mm – 70% thinner than PowerDI123

Contextual Info: SDM0230CSP 0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE Product Summary VRRM V 30 IO (mA) 200 Features and Benefits VF(MAX) (V) @ +25°C IR(MAX) (mA) @ +25°C 0.50 0.05 •  2 0.18mm footprint – 70% smaller than DFN1006/SOD923 Off board profile of 0.3mm – more than 30% thinner than the