E737 Search Results

FSCR

Abstract: window comparator 15KW E737 E737ATF E737ATFT EVM737ATF MS-026
Contextual Info: E737 Per-Pin Precision Measurement Unit TEST AND MEASUREMENT PRODUCTS Description Features The E737 is a precision measurement unit designed for automatic test equipment and instrumentation. Manufactured in a wide voltage CMOS process, it is a monolithic solution for a per pin PMU.

E737H

Contextual Info: E737 Per-Pin Precision Measurement Unit TEST AND MEASUREMENT PRODUCTS Description Features The E737 is a precision measurement unit designed for automatic test equipment and instrumentation. Manufactured in a wide voltage CMOS process, it is a monolithic solution for a per pin PMU.

Contextual Info: DIMMPAK Robinson Nuaent — How to Order 8 Byte DIMM Sockets DIMS Series 5.0 volts Synch DRAM DIMS — 168 B SD 5 — TR Product S eries:. -Voltage Option 5 = 5.0 Volts Assembly Configuration: B = Single Row j£ 7 | RN DIMMPAK Plating Code: Specify TR

Contextual Info: Robinson Nuaent 2-Piece PC Connectors Insulation Displacement Connectors — q DIN-IDC Series • 96 position IDC socket rows A, B, C filled; 64 position rows A and C filled only • 96 or 64 position uses insulation displacement IDC for mass termina­ tion of flat cable

Contextual Info: DIN CONNECTORS Inverse R-Form DIN Press-fit Backpanel Plug Connectors DIN-RP Series mmmw- FLEXPRESS press-fit contacts eliminate soldering EMLB or grounding contacts for “hot board” replacement are set by application tooling at no additional cost see page 293

Robinson Nugent

Abstract: Robinson Nugent SBE Robinson Nugent SCREW MACHINE SOCKET TG30 press-fit terminal strips E275 Robinson Nugent socket
Contextual Info: SCREW MACHINE SOCKET STRIPS SBE Series Precision screw machine sockets for high reliability and retention Notched body snaps to custom sizes single row 100% solder/flux proof Variety of pin sockets available to meet every board stacking application Hi temp IR compatible

Robinson Nugent 6 pin dip socket

Abstract: ICT-326 Robinson Nugent SCREW MACHINE SOCKET ICt-286-S ICT-203
Contextual Info: PRODUCTION DIP SOCKETS Thin Body Screw Machine Sockets ICT Series * Very low profile * Four finger Beryllium Copper contact ac­ cepts short 1C leads * Pin socket design prevents solder wicking and flux entrapment * Side/end stackable * High temp IR compatible plastic

0 shape header with square pins

Abstract: MFAS156 mfss156 CT156F CE156F
Contextual Info: MAS-CON* IDC Connectors A23 l-Y ¿¿>105-09 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline molded wafer flat header is available in straight or right angle post versions in circuit sizes 2 through

Robinson Nugent NSH

Contextual Info: Non-Shrouded Headers Robinson Nuaent — >.025" Square Post, 100" Spacing NSH Series * Single or duai row, straight or right angle 9 Available with ROBEX , better than gold, plating option * Surface mount compatible, high temp insulator * Notched body design allows fast, easy

Robinson Nugent idh

Abstract: Robinson Nugent idc robinson nugent Robinson Nugent socket Robinson Nugent IDC board mount connectors
Contextual Info: HEADERS Low Profile Headers .025” sq. Post IDH-LP Series • Designed for applications where space is critical • Fool-proof socket polarization • Optional ROBEX betterthan-gold plating For Recommended PC Board Layout See Page 351. .250 CABLE-TO-BOARD

Contextual Info: DIMMPAK Mugent -VRAM DIMM Socket * Effectively provides double density packaging * Superior shock and vibration performance * User friendly ejector system for easy module removal High temp material compatible with IR processes

MLSS156-6

Contextual Info: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANCON. .18 .045 SQ. 4.6 1.14 .156 .08 TYP 2.0 PIN #1 REF. .45 .48 3.96 11.4 .076/.070 DIA. [1.93/1.78] 12.2 .13 .36 9.1 3.3 .17 .156 4.3 REF. "A"

E174-E175

Abstract: E727 E165-E166 Le3011-11 SLE19 E647-E DLE24 N755 E583 e773
Contextual Info: INCH-POUND MIL-M-38510/140A 22 December 2004 SUPERSEDING MIL-M-38510/140 31 October 1986 MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, MONOLITHIC AND HYBRID SILICON, MICROPROCESSOR COMPATIBLE, 12 BIT ANALOG-TO-DIGITAL CONVERTERS Reactivated after 22 December 2004 and may be used for either new or existing design acquisitions.

Contextual Info: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANCON. .156 3.96 TYP .15 .045 SQ. 3.8 .08 1.14 2.0 .076/.070 DIA. [1.93/1.78] .45 .13 11.4 3.3 .156 3.96 (TYP) .07 1.8 .18 RECOMMENDED P.C. BOARD LAYOUT

STK 2028

Abstract: RTL 2832 STK 4133 II gc 7137 ad STK 5333 stk 5392 stk 5490 stk 2265 STK 5474 STK 4197
Contextual Info: Mon Feb 6 10:03:42 1995 Page 1 'MENSCH COMPUTER ROM SOFTWARE' 'IRQVCTRS.ASM-IRQ VECTOR EQUATES FOR WDC65C265' 2500 A.D. 65816 Macro Assembler - Version 5.01g -Input Filename : irom2.asm Output Filename : irom2.obj

Contextual Info: PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series • “Flux Fighter” closed bottom design pre­ vents solder wicking and flux entrapment 9 Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible wi most insertion equipment

Contextual Info: 2mm INTERCONNECTS Applications for METPAK 2 METPAK®2 is the new industry standard high-density backpanei interconnect system with a wide range of applications communications and computer equipment. Applications include telecommunications switching, networking hubs, route

Robinson Nugent DIP socket

Contextual Info: Sockets PRODUCTION DIP Crystal Oscillator Screw Machine Sockets cK&S-_ ICA-SCO Series • Four high retention pins for shock and vibration applications * Low profile socket height * Positive closed bottom flux barrier • Other contact loadings available on request

ICB163

Abstract: Robinson Nugent DIP socket
Contextual Info: Sockets PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series * “Flux Fighter” closed bottom design prevents solder wicking and flux entrapment * Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible with

Robinson Nugent socket

Abstract: ROBINSON NUGENT
Contextual Info: HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series * Effectively provides double density packaging 9 Durability - 60 cycles minimum 9 Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” RN DIMMPAK 9 Superior shock and vibration performance

Contextual Info: SCREW MACHINE SOCKET STRIPS > SBL Series * Precision screw machine sockets for high reliability and retention * Notched body snaps to custom sizes single row * 100% solder/flux proof * Variety of pin sockets available to meet every board stacking application

Contextual Info: _ MAS-CON* IDC Connectors A23 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Polyester, U.L. 94 V-0 Rated Pin: Copper Alloy Plating: 2 0 0 /" Tin Over Nickel 3 0 /" Gold Over Nickel (Contact factory 15(jl" Gold Over Nickel (Contact factory)

Contextual Info: Socket s PRODUCTION DIP Thin Body Screw Machine Sockets cZ&D- ICT Series * Very low profile options available * Four finger Beryllium Copper contact ac­ cepts short 1C leads * Pin socket design prevents solder wicking and flux entrapment * Side/end stackable

SB SERIES ROBINSON

Contextual Info: RN PAK-50 2-PIECE CONNECTORS P50 Series * 20 to 100 position product * 3-dimensional mating * Retention clip eliminates costly hardware and secures connector during wave solder How to Order RN-PAK-50 2-Piece P50 Series - R1 XXX H ~T~ Plating Code: Specify TG