EDID EPI Search Results

Contextual Info: PC 99 FAQ and Changes PC 99 FAQ and Changes Important: Features and functionality are described in PC 99 System Design Guide as either “required,” “recommended,” or “optional.” Please note: • “Recommended” features are not expected to become requirements unless the expectation is

EPI LVDS

Abstract: VT6421
Contextual Info: w .c XTX Module ong ate c.co m conga-XLX Entry level module based on AMD Geode LX800 Entry Level Model Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions CPU AMD Geode™ LX 800 Processor, 500 MHz, 400 MT/s memory bus speed, 128 kByte L2 Cache

CS5536AD

Contextual Info: ww w .c ETX Module ong ate c.co m Entry Level Model conga-ELXeco Formfactor ETX® Spec 2.7 Onboard DRAM CPU AMD Geode LX 800 Processor, 400 MT/s memory bus speed, 128 kByte L2 Cache DRAM Up to 256 MByte onboard DDR memory Chipset Companion Device: AMD Geode™ CS5536 Ethernet: Davicom DM9102D

Contextual Info: COM Express Type 6 Module m conga-TS87 H P COM E G I B I T Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU Intel® Core™ i7-4700EQ (4x 2.4 GHz, TDP 47W) Intel® Core™ i5 planned Intel® Core™ i3 planned Intel® Celeron® planned

Contextual Info: w .c ETX Module ong ate c.co m conga-ELX Low power consumption Featuring AMD® Geode® LX800 U GB Eco Model Formfactor ETX® Spec 2.7 CPU AMD Geode LX 800 Processor, 400 MT/s memory bus speed, 128 kByte L2 Cache DRAM SO-DIMM PC2700 up to 1 GByte Chipset

Contextual Info: w .c XTX Module ong ate c.co m conga-XA945 Featuring Intel Atom® processor N270, 1.6 GHz Low Power Consumption Formfactor ETX® Spec 2.7. without ISA Support, XTX™ Extensions CPU Intel® Atom™ processor N270, 1.6 GHz, 512kB cache, 533MHz FSB, 45nm, 2.5W TDP

83627HG

Abstract: American Megatrends 2.54 BIOS Insyde bios manual AMD Geode CS5536 i2c xpressrom setup ALC658 Insyde bios kontron TFT LCD AVR EPI LVDS 1920x1440x32
Contextual Info: Entry Level Model conga-XLX Formfactor ETX Spec 2.7. without ISA Support, XTX Extensions CPU AMD Geode™ LX 800 Processor, 500 MHz, 400 MT/s memory bus speed, 128 kByte L2 Cache Entry level module based on AMD® Geode® LX800 DRAM SO-DIMM DDR333/PC2700 up to 1 GByte

CG82NM10

Contextual Info: ww w .c ong COM Express Compact Type 6 Module ate c.co m conga-TCA COM E T E L M Formfactor Formfactor COM Express Compact, 95 x 95 mm , Type 6 Connector Layout CPU Intel® Atom™ D2550, 2 cores, 4 threads, 1.86GHz, 1MB L2 Cache, TDP 10W Intel® Atom™ N2800, 2 cores, 4 threads, 1.86GHz, 1MB L2 Cache, TDP 6.5W

RTL8110SC

Abstract: Insyde bios manual RTL8110SCL CS5536 EPI LVDS RTL8110 Insyde bios kontron
Contextual Info: Entry Level conga-CLX Formfactor COM Express Compact, 95 x 95 mm , Type II Connector Layout Entry level COM Express™ Module CPU AMD Geode™ LX 800 Processor, 500 MHz, 400 MT/s memory bus speed, 128 kByte L2 Cache DRAM SO-DIMM DDR333/PC2700 up to 1 GByte

RTL8105E

Abstract: JMB368
Contextual Info: ong ETX Module ate c.co m conga-EAF High graphics performance with low power consumption Formfactor ETX® Spec 3.02 CPU AMD Embedded G-Series Processors AMD G-T56N 1.6 GHz Dual Core L2 cache 512kB x2, 18 W AMD G-T40N 1.0 GHz Dual Core (L2 cache 512kB x2, 9W)

Contextual Info: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TS67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU I I I I I I I Based on 2nd Generation Intel® Core™ lowpower processors Soldered CPUs for higher shock resistance

Contextual Info: w .c COM Express Basic Module ong ate c.co m Economy Class conga-B915 Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout Economy priced COM Express™ modules CPU Intel Celeron® M 370 1.5 GHz, 1 MB cache, FSB 400 MHz Intel® Celeron® M 373 1.0 GHz, ULV, 512 KB cache, FSB 400 MHz

Contextual Info: m conga-BS45 Small-Footprint Mobile Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel Core™ 2 Duo SU9300, 1.20 GHz (3M cache, 800 MHz FSB, TDP 10W) Intel® Core™ 2 Duo SP9300, 2.26 GHz (6M cache, 1066 MHz FSB, TDP 25W)

RTL8105E

Abstract: rtl-8105e
Contextual Info: w .c ong XTX Module ate c.co m conga-XAF High graphics performance with low power consumption ETX Spec 2.7. without ISA Support, XTX™ Extensions CPU AMD Embedded G-Series Processors AMD G-T56N 1.6 GHz Dual Core L1 cache 64KB, L2 cache 512kB x2, 18 W

Contextual Info: w .c ong Qseven Module ate c.co m conga-QAF High graphics performance with low power consumption Formfactor Qseven Form Factor, 70 x 70 mm CPU AMD Embedded G-Series Processors AMD G-T40E 1.0 GHz Dual Core L2 cache 512kB x2, 6.4W AMD G-T40R 1.0 GHz Single Core (L2 cache 512kB, 5.5W)

Contextual Info: ong COM Express Type6 Module ate c.co m conga-TFS COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU AMD Embedded R-Series processors AMD Embedded R-464L with AMD Radeon™ HD 7660G Graphics (Quad-Core 2.3/3.2 GHz / 35W / PGA) AMD Embedded R-460H with AMD Radeon™ HD 7640G Graphics (Quad-Core 1.9/2.8 GHz / 35W / PGA)

82801GHM

Abstract: RTL8111 intel 945 RTL8111C DVMT 5.0 American Megatrends 82801g ATMEL USB controller IC RealTek RTL8111C 1920x1200
Contextual Info: Ultra Low Power conga-CA945 Formfactor COM Express Compact, 95 x 95 mm , Type II Connector Layout CPU Intel Atom™ N270, 1.6 GHz, 512 kB cache, 533 MHz FSB, 45nm, 2.5W TDP DRAM 1 Socket, SO-DIMM DDR2 533, up to 2 GByte Allows cost effective and power efficient COM Express™

82801HBM

Abstract: AHCI lvds 1080p panel 82801hbm ICH8M GME965 L7500 X3100 U7500
Contextual Info: conga-X965 High Graphics Performance Provides latest graphics performance featuring the latest Intel GME 965 chipset Formfactor ETX® Spec 2.7. without ISA Support, XTX Extensions CPU Intel® Core™ 2 Duo U7500 1.06 GHz, 2M cache, 533 MHz FSB, 65nm

Contextual Info: ong ate c.co m conga-BM45 High End Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel Core™ 2 Duo T9400, 2.53 GHz (6M cache, 1066 MHz FSB, 45nm), Socket mPGA479M Intel® Core™ 2 Duo P8400, 2.26 GHz (3M cache, 1066 MHz FSB, 45nm), Socket mPGA479M

Contextual Info: ong ate c.co m conga-B945 Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel Core™ 2 Duo T7400, 2.16 GHz, (4M cache, 667 MHz FSB, 65nm), Socket mPGA479M Intel® Core™ 2 Duo L7400 LV, 1.5 GHz, (4M cache, 667 MHz FSB, 65nm)

83627HG

Abstract: IEEE 802.3u 100Base 82801GBM L2400 M440 82801GBM ICH7M Atmel TPM intel LPC interface spec 1.0 Winbond LPC Intel Asia Electronics
Contextual Info: High Performance conga-X945 Formfactor ETX Spec 2.7. without ISA Support, XTX Extensions CPU Intel® Intel® Intel® Intel® Intel® Featuring the latest Intel® Core™ 2 Duo LV Processors up to 1.5 GHz Core™ 2 Duo L7400 LV, 1.5 GHz, 4M cache, 667 MHz FSB, 65nm

Contextual Info: XTX Module ong ate c.co m High Performance conga-X945 F I C Processors up to 1.5 GHz D LV Provides up to 2 GByte top of the line DRAM performance ACPI Battery Support, Flat Panel detection . Formfactor ETX Spec 2.7. without ISA Support, XTX™ Extensions

Contextual Info: High Performance COM Express m conga-BP77 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU I I I I I Highest Performance COM Express Type 2 G I B I C P QE LE UE ME ME I I HD HD HD V G C C C C C C D S DRAM X I GB HD G

Contextual Info: ate c.co m conga-BS67 High Performance COM Express Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W)