EDWA Search Results

IPC-D-330

Abstract: JESD51-2
Contextual Info: Freescale Semiconductor Application Note AN3962 Rev. 1.0, 10/2009 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat

TDA21102

Abstract: thermistor vei 35 TDA21106 TDA21107 TDA21301 VRD10 4439 gm
Contextual Info: Version 1.02 , Aug 2004 Datasheet DS-CoreControl-TDA21301 TDA21301 Authors: Edward Chang Published by Infineon Technologies AG http://www.infineon.com/DCDC Power Management & Supply N e v e r s t o p t h i n k i n g. CoreControl TM Page 1 of 25 DS-CoreControl-TDA21301

RL-7200

Contextual Info: RENCO ELECTRONICS INC. SINCE 1955 5 9 5 International Place, Rockledge, FL 3 2 9 5 5 -4 2 0 0 • 3 2 1 -6 3 7 -1 0 0 0 • FAX: 3 2 1 -6 3 7 -1 6 0 0 TO FROM DATE SUBJECT FRIENDS & COLLEAGUES EDWARD W. RENSING, PRESIDENT MARCH 2003 NEW PRODUCT ANNOUNCEMENT

Contextual Info: ol Ta Co E U 20 pl ia nt C HS m Ro 02/95 XL Wu 11/01/06 Sondra Sang 11/01/06 Edward Wu 11/01/06 an A mp en iw h /E

CRACK DETECTION PATTERNS

Abstract: Kemet Flex Solutions CRACK PROPAGATION PATTERNS CRACK SOFTTERM 1210 Cracked chip resistor Components Technology Institute
Contextual Info: Introducing Flex “Fail-Open” Capabilities for MLC Chip Capacitors Edward Chen 1, Ken Lai 2, Travis Ashburn 3, John Prymak 4, Mike Prevallet 5 KEMET Electronics Asia Ltd. 1,2 / KEMET Electronics Corp. 3,4,5 3-4F, No. 148, Section 14, Chung-Hsiao E. Rd., Taipei, Taiwan ROC 1,2

ANSI-T1-101

Abstract: GR-378-CORE ITU-T-G813 GR-1244 GR-1244-CORE GR-253 ITU-T-G812
Contextual Info: Application Note 101 Author: Edward K. Miguel Vice President of Engineering The Connor-Winfield Corporation June 2008 Selecting Synchronous Timing Modules Consider an off-the-shelf module that best fits the requirements of the telecommunications design Introduction

BGA heatsink compressive force

Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
Contextual Info: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014

IRF7822

Abstract: UCC2919 UCC3919
Contextual Info: Application Report SLUA339 – June 2005 SIZING THE UCC3919 CHARGE-PUMP CAPACITOR Edward Jung . PMP Systems Powers ABSTRACT The UCC3919 works in most hot-swap designs with the charge-pump capacitance

Storage of Products Supplied by Infineon Technologies

Abstract: GATE DRIVER SIEMENS P-DSOP-14 intersil MARKING CODE ZA P-2720-093 tda21103 Siemens Halbleiter
Contextual Info: Version 1.0 , Aug 2004 Datasheet DS-CoreControl-TDA21203 TDA21103 Authors: Edward Chang Published by Infineon Technologies AG http://www.infineon.com/DCDC Power Management & Supply N e v e r s t o p t h i n k i n g. CoreControl TM Page 1 of 13 DS-CoreControl-TDA21103

DC step down 120V

Abstract: flashing led light 101BS-N5 101FINA-E1 p-047550 101FINHA-N5 101SINHR-G1 101bs-g1 wiring strobe light 101SLEDR-N5
Contextual Info: Installation Instructions for Edwards AdaptaLightTM Cheshire, CT 06410 203-699-3300 Ph Heavy Duty Industrial Stackable Beacons 203-699-3365 (Cust. Serv. Fax) 203-699-3078 (Tech. Serv. Fax) Figure 1. Dimensions Description Edwards AdaptaLight Series 101 Stackable Beacon is a unique

TDA21301

Abstract: TDA21102 TDA21106 TDA21107 VRD10 RRT 6.2 TDA213
Contextual Info: Version 1.03 , Aug 2004 Datasheet DS-CoreControl-TDA21301 TDA21301 Authors: Edward Chang Published by Infineon Technologies AG http://www.infineon.com/DCDC Discrete & Power Management N e v e r s t o p t h i n k i n g. CoreControl TM Page 1 of 25 DS-CoreControl-TDA21301

A26F

Abstract: A26F6629
Contextual Info: SIZE A A26F6629 2.91 +/- .06 0.81+/-.03 1.91 +/- .06 2 BLADES PER BUSHING (0.032 X 0.25) GRND TAB (0.032 X 0.25) 0.50 +/-.06 VOLTS uF Hz Ph 60 1 0.75 +/- .03 660 VAC 18 6.75 +.12/-.06 SIZE Engineer: J COZZENS GE Transmission Systems Fort Edward, NY USA Drawn

A26F6636

Abstract: VAC-30
Contextual Info: SIZE A A26F6636 3.66 +/- .06 0.81+/-.03 Date: 1.97 +/- .06 2 BLADES PER BUSHING (0.032 X 0.25) GRND TAB (0.032 X 0.25) 0.50 +/-.06 VOLTS uF Hz Ph 60 1 0.75 +/- .03 660 VAC 30 8.00 +.12/-.06 SIZE Engineer: R. Flanagan GE Transmission Systems Fort Edward, NY USA

GE 900

Contextual Info: SIZE A A26F6712 Prepared for: 3.66 +/- .06 0.813 +/- .03 Date: 1.97 +/- .06 # 10-32 Thread Terminals 0.44 +/- .06 0.78 +/- .06 VOLTS uF Hz Ph 0.75 +/- .03 900 VAC 4.0 1 4.75 +.06/.06 Engineer: SIZE J COZZENS GE Transmission Systems Fort Edward, NY USA Drawn

GE capacitors

Abstract: dielectrol 35 GE SCR 1000 AMP GE capacitor CATALOG GE film capacitors catalog A28F5602 A26F7502 97F7500 97F7512 A28F5606
Contextual Info: CPD 513 g Rev. B 3-00 5k GE Capacitors Capacitors for High Current, Power Semiconductor, and DC Applications GE TD&IS Transmission, Distribution & Industrial Systems, Fort Edward, NY 12828 GE Capacitors for High-Current, Power Semiconductor, and DC Applications

high power fet amplifier schematic

Abstract: GaAs MESFET amplifier fet amplifier schematic x-band mmic core chip MMIC X-band amplifier x-band microwave fet HPA Ku x-band core chip "high power microwave" fet small signal
Contextual Info: Application of Loadline Simulation to Microwave High Power Amplifiers Edward L. Griffin Abstract Loadline theory is described as applied to high power microwave amplifiers. An example design with simulation is presented. Introduction The design of microwave GaAs high power amplifiers HPAs to demanding

Contextual Info: Column #19: Connect the BS2-IC to Phone Lines, Give the BS1-IC an LED Display Column #19, September 1996 by Scott Edwards: Connect BS2 to Phone Lines, Give the BS1 an LED Display Project double-header for the BASIC Stamps I and II THIS MONTH we’re going to blast our way through two frequently requested

IPC-D-330

Abstract: AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2
Contextual Info: Freescale Semiconductor Application Note AN3962 Rev. 2.0, 8/2010 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat

AN1955

Abstract: dupont delrin infrared temperature measure Motorola Microwave power Transistor EMISSIVITY
Contextual Info: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1955/D AN1955 Thermal Measurement Methodology of RF Power Amplifiers Prepared by: Mali Mahalingam and Edward Mares Motorola Semiconductor Products Sector Freescale Semiconductor, Inc.

DN16NW

Contextual Info: EXT75DX turbomolecular pump Edwards is a world leader in the design and manufacture of turbomolecular pumps with over 200,000 units installed worldwide. The range of products includes the EXT75DX compound turbomolecular pumps that combine the proven technology of a ceramic mechanical lower bearing,

501-0726

Abstract: 1E475ZY5U-C304 sepic converter 12v 30A dc to dc converter 12v to 5v 30a 24W zener diode 1e475zy5u UP4-100 negative dc dc sepic 5V converter DN183 P6KE15A diode
Contextual Info: advertisement The LT1370: A 500kHz, 6A Monolithic Boost Converter Design Note 183 Karl Edwards Complementing and expanding on the current LT 1371/ LT1372 family of 500kHz switchers, Linear Technology introduces the LT1370, a 6A boost converter. A high efficiency switch is included on the die, along with all the

EIA-809

Abstract: EIA 809 Electronic Industries Alliance
Contextual Info: Ripple Current Confusion Edward Chen, Mike Prevallet, John Prymak – KEMET Electronics Corp. RIPPLE CURRENT1 Ripple current ratings for capacitors can be somewhat arbitrary. Although the EIA has standards for calculating ripple current ratings, some manufactures use their own methods.

C0805C226K9PAC

Abstract: series and parallel RLC circuit applications of rlc circuits C0805C226K simulation model electrolytic capacitor T510 T520 T525 t528z477m2r5ate005
Contextual Info: Capacitor EDA Models with Compensations for Frequency, Temperature, and DC Bias John Prymak, Peter Blais, William Buchanan, Edward Chen, Ken Lai, Gianpietro Malagoli, Allen Mayar, Matti Niskala, Axel Schmidt, Paul Staubli, Boris Vildaver KEMET Electronics Corporation, 2835 KEMET Way, Simpsonville, SC 29681

Contextual Info: Version 1.0 , Aug 2004 Datasheet DS-CoreControl-TDA21107 TDA21107 Authors: Edward Chang Published by Infineon Technologies AG http://www.infineon.com/DCDC Power Management & Supply N e v e r s t o p t h i n k i n g. CoreControl TM Page 1 of 12 DS-CoreControl-TDA21107