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    EFOP1005B5 Search Results

    EFOP1005B5 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    EFOP1005B5 Panasonic Ceramic Resonator, Chip Type (For General Purpose) Original PDF

    EFOP1005B5 Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical


    Original
    PDF

    4069UB

    Abstract: No abstract text available
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical


    Original
    PDF 74HCU04 4069UB

    D2080

    Abstract: No abstract text available
    Text: セラミック発振子(チップ形) チップ形セラミック発振子 (汎用タイプ) Pタイプ Dタイプ Uタイプ Lタイプ 2 ~ 13MHz (13.1∼20MHz) (20.1∼30MHz) (30.1∼50MHz) • 特 長 ■ 主な用途 ● セラミックパッケージ構造採用による優れた,はんだ耐


    Original
    PDF 13MHz) 120MHz) 130MHz) 150MHz) EFOP3584B5 EFOP4004B5 EFOP8004B5 EFOP1005B5 EFOP1205B5 EFOD1605B5 D2080

    EFOP3584E5

    Abstract: EFOD1605B5 EFOD1695B5 EFOD2005B5 EFOP1005B5 EFOP1205B5 EFOP4004B5 EFOP8004B5
    Text: Ceramic Resonators Chip Type &HUDPLF 5HVRQDWRUV &KLS 7\SH )RU *HQHUDO 3XUSRVH 7\SH 7\SH 7\SH 7\SH 3  WR  0+] '  WR  0+] 8  WR  0+] /  WR  0+] • Recommended Applications ■ Features ● (QFDVHG LQ FHUDPLF SDFNDJH ● +LJK UHOLDELOLW\ DJDLQVW VROGHULQJ KHDW DQG PHFKDQLFDO


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    PDF

    EFOD1605B5

    Abstract: EFOD1695B5 EFOD2005B5 EFOP1005B5 EFOP1205B5 EFOP4004B5 EFOP8004B5
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Features ■ Recommended Applications ● Encased in ceramic package ● High reliability against soldering heat and mechanical


    Original
    PDF

    4069UBC

    Abstract: upd4069ubc EFOP1005B5 EFOP3584E5 EFOP4004E5 EFOP5004E5 EFOP8004E5 EFOP1205B5 EFOP4004B5 EFOP8004B5
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type Ceramic Resonator, Surface Mount without Capacitors P for General Purpose Type: S Built-In Capacitors Type) EFQ-P / S Type: • Features • Encased in ceramic package ■ Recommended Applications


    Original
    PDF 4069UBC 74HCU04 4069UBC upd4069ubc EFOP1005B5 EFOP3584E5 EFOP4004E5 EFOP5004E5 EFOP8004E5 EFOP1205B5 EFOP4004B5 EFOP8004B5

    OL338

    Abstract: No abstract text available
    Text: Specify Chip Ceramic Resonators General Purpose 3.2 5.5 5.0 2.7 4.0 3.9 5.5 7.8 1.3 4.4 3.2 4.5 1.2 3.6 1.2 Type P 2.5 3.1 1.6 5.0 1.6 2.7 M 1.6 7.3 M 1.6 Ceramic Resonators M M Type D 1.9 2.5 Type U 1.9 1.9 Type L 3.2 1.9 APPLICATIONS FEATURES Ceramic Encapsulation


    Original
    PDF OP3584B5 OP4004B5 OP8004B5 OP1005B5 OP1205B5 605B5 695B5 OD2005B5 OU2405B5 OU2545B5 OL338

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Recommended Applications ■ Features ● Encased in ceramic package ● High reliability against soldering heat and mechanical


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical


    Original
    PDF 74HCU04

    EF43

    Abstract: Ultrasonic welding generator
    Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Recommended Applications ■ Features ● Encased in ceramic package ● High reliability against soldering heat and mechanical


    Original
    PDF