ELECTRONIC DESIGNS INC Search Results

16KX8

Contextual Info: Electronic Designs In EDH88H16N-45/55 16K x 8 SRAM NMOS The EDH88H16N 16K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H16N uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

Contextual Info: Electronic Designs In EDH8808HC-55/70 MILITARY 8K x 8 SRAM CMOS The EDH8808HC 8K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH8808HC uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

OV10

Contextual Info: Electronic Designs Inc. EDH84H16C-45/55 16K x 4 SRAM CMOS The EDH84H16C 16K x 4 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H16C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

6AL7

Contextual Info: Electronic Designs Inc. EDH88H04C-45/55 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

Contextual Info: Electronic Designs Inc. EDH81H64C-45/55 64K x 1 SRAM CMOS IMMgrUTM The EDH81H64C 64K x 1 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH81H64C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

Contextual Info: Electronic Designs Inc. EDH8816C-12/15/20 16K x 8 SRAM CMOS The EDH8816C 16K x 8 uses the advanced Electronic Designs Inc. MEMORY-PACK packaging concept which mounts several LCC memory devices on a single multilayer ceramic substrate. The EDH8816C is part of the EBM-pack

LQ6FW315

Abstract: MIL-STD-810E method 507.3 MIL-STD-810E method 503 850C D99-6F5E2P1B3M0 LC056 RS170 amlcd technology TTL sync video to vga
Contextual Info: White Electronic Designs Display Systems Division D99-6F5E2P1B3M0 AMLCD PRODUCT - MODEL LC056 RUGGEDIZED 5.6" DISPLAY HEAD ASSEMBLY w/ BACKLIGHT 320 x 234 OVERVEIW White Electronic Designs' 5.6" sunlight readable display head assembly with backlight is ruggedized for harsh

LQ6FW315

Abstract: amlcd technology pal NTSC tft display RS170 650C 850C D99-516E2P2B2M1 LC050 MIL-STD-81OE right angle 14 pin pcb connector 2mm pitch
Contextual Info: D99-516E2P2B2M1 White Electronic Designs Display Systems Division AMLCD PRODUCT - MODEL LC050 Ruggedized 5.0" Display Head Assembly with Backlight 320 x 234 OVERVIEW White Electronic Designs' 5.0" sunlight readable display head assembly with backlight is ruggedized for harsh

Contextual Info: Electronic Designs li EDH88H04C-55/70/1C MILITARY 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

Contextual Info: Electronic Designs li EDH88H04C-55/70/1C MILITARY 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

acs 08 5s

Contextual Info: B lfl Electronic Designs Inc. EDH88H08C-45/55 8K x 8 SRAM CMOS The EDH88H08C 8K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H08C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

Contextual Info: Electronic Designs Inc. EDH88H08C-55/70/10 MILITARY w 8K x 8 SRAM CMOS The EDH88H08C 8K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H08C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

cn1 df9ma-31p-1v

Abstract: DF9M-31S-1V SHARP LCD MATRIX BHR-03VS-1 DF9A-31S-1V DF9B-31S-1V LQ104V1DG21 SM02 sharp lcd tv power supply diagrams
Contextual Info: White Electronic Designs Display Systems Division ENH104V1-350/450 ENH104V1-350/450 Color TFT-LCD Module Features GENERAL DESCRIPTION White Electronic Designs Display Systems Division provides optically enhanced solutions to the standard Sharp LQ104V1DG21 color active matrix LCD module.

vqc 10 d

Abstract: IC-55 10dip
Contextual Info: ^ Electronic Designs Inc. EDH84H16C-55/85/10-DIP MILITARY 16K x 4 SRAM CMOS The EDH84H16C 16K x 4 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H16C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC

EDH8816C-12

Abstract: EDH8816C-15 EDH8816C-20
Contextual Info: Electronic Designs Inc. EDH8816C-12/15/20 16K x 8 SRAM CMOS Th e EDH8816C 16K x 8 uses the advanced Electronic Designs Inc. M EM ORY-PACK packaging concept which mounts several LC C memory devices on a single multilayer ceramic substrate. The ED H8816C is part of the EBM-pack

4VRE

Abstract: 64K X 4 SRAM
Contextual Info: Electronic Designs Inc. EDH84H64C-55/70 • . . 64K x 4 SRAM CMOS The EDH84H64C 64K x 4 is part of a new fam ily of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H64C uses the advanced EDI M EM ORYPACK packaging concept w hich m ounts several LCC

A118C

Abstract: 14D03
Contextual Info: Electronic Designs I ED H84H08C-55/70/11 MILITAR 8K X 4 SRAM CMOS The EDH84H08C 8K x 4 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H08C uses the advanced EDI M EM O R YPACK packaging concept which mounts several LC C

EDH8816C-12

Abstract: EDH8816C-15 EDH8816C-20
Contextual Info: Electronic Designs Ir EDH8816C-12/ 15/20 MILITARY 16K x 8 SRAM CMOS The EDH8816C <16K x 8 uses the advanced Electronic Designs Inc. M EM O R Y-PAC K packaging concept w hich m o un ts several LC C m em ory devices on a single m ultilayer ceram ic substrate. The EDH8816C is part o f the EBM -pack

edh8808c

Abstract: MCA-12
Contextual Info: Electronic Designs In EDH8808HC-55/70 MILITARY 8K x 8 SRAM CMOS M P l / î The EDH8808HC 8K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs fnc. The EDH8808HC uses the advanced EDI M EM O R YPACK packaging concept which mounts several LCC

Contextual Info: White Electronic Designs 256Kx72 Synchronous Pipeline SRAM WEDPY256K72V-XBX Preliminary* FEATURES DESCRIPTION ! Fast clock speed: 100, 133, 150, 166 and 200* MHz The WEDPY256K72V-XBX employs high-speed, low-power CMOS designs that are fabricated using an advanced

Contextual Info: White Electronic Designs W2Z1M72SJ Preliminary* 72Mb, 1Mx72 Synchronous Pipeline Burst NBL SRAM FEATURES DESCRIPTION Fast clock speed: 225, 200, 166 and 150MHz The WEDC SyncBurst - SRAM family employs high-speed, low-power CMOS designs that are fabricated using an

WED2ZL361MSJ35BC

Abstract: WED2ZL361MSJ38BC WED2ZL361MSJ42BC WED2ZL361MSJ
Contextual Info: WED2ZL361MSJ White Electronic Designs 1M x 36 Synchronous Pipeline Burst NBL SRAM FEATURES DESCRIPTION n Fast clock speed: 250, 225, 200, 166, 150, 133MHz The WEDC SyncBurst - SRAM family employs high-speed, low-power CMOS designs that are fabricated using an

dq35j

Abstract: CS11 CS21 CS22 WEDPY256K72V-XBX
Contextual Info: White Electronic Designs WEDPY256K72V-XBX 256Kx72 Synchronous Pipeline SRAM DESCRIPTION FEATURES The WEDPY256K72V-XBX employs high-speed, lowpower CMOS designs that are fabricated using an advanced CMOS process. The 16Mb Synchronous SRAMs integrate two 256K x 36 SRAMs into a single

Contextual Info: ELECTRONIC DESIGNS INC ^ E D I 51E D • 3230114 0001235 032 ■ E L D _ E D I 8 4 2 5 6 C S Electronic DMlgra Inc. — — High Performance Megabit Monolithic SRAM 256KX4 Monolithic CMOS Static RAM High Speed