EN294 Search Results

copper wire s.w.g 22

Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D
Contextual Info: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.

EN29453

Abstract: EN29454 Halide soldering wire
Contextual Info: SOLDERING HAND SOLDER WIRES, Flux-cored NO CLEAN / LOW RESIDUE FLUX A solder wire using a high purity 60/40 tin/lead alloy employing a reduced level typically 1% of non-corrosive, halide-free flux to EN29454. Leaves a negligible residue on the pcb thereby eliminating

SB100-05J

Abstract: EN2949
Contextual Info: SB100-05J Ordering number : EN2949A SANYO Semiconductors DATA SHEET SB100-05J Schottky Barrier Diode Twin Type • Cathode Common 50V, 10A Rectifier Applications • High frequency rectification (switching regulators, converters, choppers). Features • •

SB100-05J

Contextual Info: Ordering number : EN2949 SB 1 0 0 - 0 5 J Schottky Barrier Diode Twin Type • Cathode Common 50V, 10A Rectifier A pplications • High frequency rectification (switching regulators, converters, choppers) F eatures • Low forward voltage (Vp max = 0.55V)

EN2948

Abstract: V11M DBF10 DBF10B DBF10C DBF10E DBF10G
Contextual Info: Ordering number : EN2948 No.2948 _ D B F 1 0 Silicon Diffused J u n c tio n Type 1.0A Single-Phase Bridge Rectifier F e a tu re s • P la stic molded s tru ctu re * P e a k re v erse voltage : V rm = —200 to —600V •A verage rectified c u r re n t : I q —1.0A

SB100-05J

Contextual Info: SB100-05J Ordering number : EN2949A SANYO Semiconductors DATA SHEET SB100-05J Schottky Barrier Diode Twin Type • Cathode Common 50V, 10A Rectifier Applications • High frequency rectification (switching regulators, converters, choppers). Features • •

SB100 DIODE

Abstract: N2-98t EN2949 SB100-05J SB-100 SB100
Contextual Info: Ordering number :EN2949 SB100-05J Schottky Barrier Diode Twin Type • Cathode Common 50V, 10A Rectifier Package Dimensions Applications · High frequency rectification (switching regulators, converters, choppers). unit:mm 1178 [SB100-05J] Features · Low forward voltage (VF max=0.55V).

EN29453

Abstract: bar led 68011 EN294
Contextual Info: SOLDERING SOLID SOLDER BARS WAVE / FLOW LEAD-FREE EXTRUDED SOLDER Solid bars of high purity lead-free extruded solder alloy, each polythene protected, with a choice of alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars.

IPC-SF-818

Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC
Contextual Info: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue

EN294

Abstract: JAN07 kabel power AC SOLENOID 110V DC DRIVER SOLENOID 110V DRIVER 8 rele driver SchutzartIP67
Contextual Info: AutoLok Solenoid-Controlled Interlock Auxiliary Unlocking Mechanism General The AutoLok is a robust, heavy duty, solenoid controlled guard interlock. When properly installed, it provides safe access and control of for a variety of machinery. This unit may be installed in any orientation, to

EN29453

Abstract: 20swg 68011 22swg Rosin Activated Core Wire
Contextual Info: SOLDERING SOLDER WIRES, Flux-cored HAND GENERAL PURPOSE High purity solder wire carefully formulated to meet the exacting standards of the UK manufacturing industry. Suitable for all general electronic assembly work and precision applications. 60/40 tin/lead alloy with non-corrosive rosin flux available in single core or multiple core 4 core .

nas1130

Abstract: nasm21209 MA3279 ln9499 LN9039 na0276 ms21209 ags3731 AS7245 MA3279-102
Contextual Info: 0130/10.02 THE BLUE BOOK Aerospace Buyer’s Directory To HELICOIL Wire Thread Inserts made by Issue 2/June 2010 We serve all stages of Development • Application engineering ■ Prototyping ■ Customer-specific solutions Testing ■ Mechanical testing

SAC387

Abstract: IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS
Contextual Info: Technical Data Sheet C502 December-2009 PRODUCT DESCRIPTION C502 provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium • No clean • Clear residue

GR-78-CORE

Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Contextual Info: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased

OFL-12

Abstract: EN294 Abrasive paper KJW100100 KJW100100 EN292-2 KJW100200 polish ferrule KJW100400 KJW100300 KJW1002
Contextual Info: DOCUMENT NUMBER 39NPI-53E1-03 OFL-12 SERIES OFL-126001 OFL-127001 MASS PRODUCTION POLISHER INSTRUCTION MANUAL Seiko Instruments Inc. Components Sales Dept. 1-8, Nakase, Mihama-ku Chiba-shi, Chiba-ken, 261, Japan Telephone: 043-211-1211 Facsimile: 043-211-8030

EN29453

Abstract: 680102 68010 183C
Contextual Info: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin

air cylinder festo

Abstract: PILZ PNOZ X3 safety relay
Contextual Info: RAST2.5 Semi-Automatic Terminator Machine RAST2.5 SEMI-AUTOMATIC TERMINATOR MACHINE For Appli-Mate Connectors Instruction Manual Order No. 62300-6200 Description Operation Maintenance Doc: No: ATS-623006200 Revision: B Release Date: 04-23-09 Revision Date: 06-18-09

Contextual Info: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both

IPC-SF-818

Abstract: SAC387 SAC387 solder
Contextual Info: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue

GR-78-CORE

Contextual Info: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and