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copper wire s.w.g 22 Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D Text: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.	Original	PDF	EN29454. EN29454 18swg 22swg PG/0412 copper wire s.w.g 22 swg copper wire EN29454 EN29453 swg copper wire datasheet 22 swg copper wire Halide 43C501D
EN29453 Abstract: bar led 68011 EN294 Text: SOLDERING SOLID SOLDER BARS WAVE / FLOW LEAD-FREE EXTRUDED SOLDER Solid bars of high purity lead-free extruded solder alloy, each polythene protected, with a choice of alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars.	Original	PDF	45E501A 45E102C PG/0526 EN29453 bar led 68011 EN294
EN29453 Abstract: EN29454 Halide soldering wire Text: SOLDERING HAND SOLDER WIRES, Flux-cored NO CLEAN / LOW RESIDUE FLUX A solder wire using a high purity 60/40 tin/lead alloy employing a reduced level typically 1% of non-corrosive, halide-free flux to EN29454. Leaves a negligible residue on the pcb thereby eliminating	Original	PDF	EN29454. EN29453 EN29454 EN29454, EN29453 EN29454 Halide soldering wire
EN29453 Abstract: 20swg 68011 22swg Rosin Activated Core Wire Text: SOLDERING SOLDER WIRES, Flux-cored HAND GENERAL PURPOSE High purity solder wire carefully formulated to meet the exacting standards of the UK manufacturing industry. Suitable for all general electronic assembly work and precision applications. 60/40 tin/lead alloy with non-corrosive rosin flux available in single core or multiple core 4 core .	Original	PDF	EN29453 EN29453 20swg 68011 22swg Rosin Activated Core Wire
GR-78-CORE Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800 Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased	Original	PDF	MP200 ANSI/J-STD-004 GR-78-CORE J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
EN29453 Abstract: 680102 68010 183C Text: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin	Original	PDF	45A50ns. 45A501A 45A102C EN29453, 45B501A 45B102C EN29453 680102 68010 183C
Untitled Abstract: No abstract text available Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both	Original	PDF	MP200 December-2011 MP200 200mms-1
GR-78-CORE Abstract: No abstract text available Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and	Original	PDF	WS200â June-2009 GR-78-CORE