EPF8209S Search Results

Contextual Info: 10/100Base-TX Interface PCMCIA Module ELECTRONICS INC. EPF8209S • Robust design allows for toughest soldering processes • • 1500 Vrms Isolation • • Complies with or exceeds IEEE 802.3, 10/100 Base-TX Requirements • Electrical Parameters @ 25° C

BCM5221

Abstract: BCM5201 EPF8209S
Contextual Info: 10/100Base-TX Interface PCMCIA Module ELECTRONICS INC. EPF8209S • Designed to work with Broadcom BCM5201, BCM5221 Chipsets • Complies with or exceeds IEEE 802.3, 10/100Base-TX Standards • Robust design allows for toughest soldering processes • 1500 Vrms Isolation

EPF8209S

Contextual Info: 10/100 Base-TX Interface PCMCIA Module ELECTRONICS INC. EPF8209S • Robust design allows for toughest soldering processes • • 1500 Vrms Isolation • • Complies with or exceeds IEEE 802.3, 10 Base-T Requirements • Electrical Parameters @ 25° C OCL

broadcom MSL

Abstract: BCM5221 BCM5201
Contextual Info: 10/100Base-TX Interface PCMCIA Module ELECTRONICS INC. EPF8209S-RC • Designed to work with Broadcom BCM5201, BCM5221 Chipsets • Complies with or exceeds IEEE 802.3, 10/100Base-TX Standards • Robust design allows for toughest soldering processes • Add “-RC” after part number for RoHS Compliant

EPE6119G-RC

Abstract: jd 1803 jd 1803 data jd 1803 19 B EPF8125S BCM5201 jd 1803 4 pin EPG4000S EPA1885-6 EPE6119G
Contextual Info: Networking www.pca.com Contents 10Base-T Networking PCA Part No. OCL µH EPA1829C EPA1990A 200 EPA2013D Turns Ratio Package Style Length Width Height 1:1/1:1 16 Pin DIP 1.00 .400 .350 1:1/1:1 16 Pin DIP 1.00 .280 .300 1:1/1:1 16 Pin DIP 1.00 .280 .310 EPE6009S