EXPOSED DIE Search Results

Contextual Info: APPLICATION NOTE Mounting Considerations for Exposed-Paddle Packages Introduction Many of Skyworks products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, which provides

land pattern for DFN

Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
Contextual Info: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN

5SC-TT-K-30-36

Abstract: TTK thermocouple AN26020
Contextual Info: Application Note AN26020 APPLICATIONS INFORMATION PROCEDURE FOR MEASURING PAD-TO-AMBIENT THERMAL RESISTANCE RθPA FOR EXPOSED PAD PACKAGES SCOPE For devices with an exposed die pad, the die-to-exposed pad thermal resistance (RθJP) is independent of the PWB on which the device is mounted. The value of pad-to-ambient thermal resistance (RθPA) can be

Contextual Info: Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad LQFP-TEP Q128.14x20A 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C

MS-026

Abstract: 3BHB
Contextual Info: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Package with Top Exposed Pad TEP-LQFP Q128.14x20B 4 D NOTE: EXPOSED PAD 128 Lead Thin Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB SYMBOL 3 NOM MAX NOTES A B 3 D2 E 4 e E2

MS-026

Abstract: 3BHB
Contextual Info: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Package with Top Exposed Pad TEP-LQFP Q128.14x20A 4 D NOTE: EXPOSED PAD 128 Lead Thin Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB SYMBOL 3 NOM MAX NOTES A B 3 D2 E 4 e E2

Contextual Info: Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad LQFP-TEP Q128.14x20B 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C

8 NARROW SO

Abstract: dd pack m lga 133 tssop 38 DATASHEET TSSOP-6 dd pack Q exposed die
Contextual Info: MOISTURE SENSITIVITY LEVEL FOR SURFACE MOUNT PACKAGE PACKAGE CATEGORY MSOP SO SOT-223 SOT TSOT SC70 TSSOP SSOP DFN QFN LGA DD PACK NOTES: DESCRIPTION SURFACE MOUNT PACKAGE 8 LEAD MSOP 8 LEAD MSOP EXPOSED DIE PAD 10 LEAD MSOP 10 LEAD MSOP EXPOSED DIE PAD

12-UNIT

Abstract: sot633
Contextual Info: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-3 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2

sot633

Contextual Info: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-2 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2

MSE16

Contextual Info: MSE Package Variation: MSE16 12 16-Lead Plastic eMSOP with 4 Pins Removed Exposed Die Pad (Reference LTC DWG # 05-08-1871 Rev Ø) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127

HTSSOP38

Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2

HTSSOP32

Abstract: sot549
Contextual Info: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

Contextual Info: T DP / B D T T D M VIEW NOTES: 1. DIMENSIONS ARE IN MM[INCHES]. 2. CONTROLLING DIMENSION: MM. 3. EXPOSED PAD: Cu WITH Sn/Pb PLATING. DIMENSION DOES NOT INCLUDE MOLD FLASH OF 0.254[0.010] MAX. /§\ DIE A /A UP ORIENTATION SHOWN. EXPOSED PAD IS VISIBLE FROM BOTTOM

AN 7823

Abstract: Techpoint
Contextual Info: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)

"exposed pad" PCB via

Contextual Info: Application Note, Rev. 1.0, November 2008 Thermal Evaluation: Comparison of Standard and Exposed Pad DSO Package Example of SPOC Devices BTS5682E, BTS5672E, BTS5662E Automotive Division by U. Fröhler H. Hopfgartner M. Walder Thermal Evaluation: Standard vs. Exposed Pad DSO Package

HTSSOP32

Abstract: SOT549
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

HTSSOP32

Abstract: sot549
Contextual Info: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-2 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

Contextual Info: MS8E Package 8-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1662 Rev H BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 (.074) 1 1.88 ± 0.102 (.074 ± .004) 0.29 REF 1.68 (.066) 0.889 ± 0.127 (.035 ± .005) 0.05 REF 5.23 (.206) MIN DETAIL “B”

HTSSOP-20

Abstract: HTSSOP20
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index

Contextual Info: MSE Package 12-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1666 Rev C BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127 (.035 ± .005) 6 1 1.651 ± 0.102 3.20 – 3.45

MSE16

Contextual Info: MSE Package 16-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1667 Rev B BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127 (.035 ± .005) 8 1 1.651 ± 0.102 (.065 ± .004)

HTSSOP56

Abstract: HTSSOP-56 sot793
Contextual Info: PDF: 2003 Mar 14 Philips Semiconductors Package outline HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad D SOT793-1 A E X c y exposed die pad v M A HE Dh Z 56 29 A 3 A A2 Eh θ A1 pin 1 index

HTSSOP-8

Abstract: sot770
Contextual Info: PDF: 2002 May 14 Philips Semiconductors Package outline HTSSOP8: plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad SOT770-1 E D A X c y HE exposed die pad v M A Dh1 Dh Z 5 8 A Eh Eh1 A2 A3 A1 pin 1 index