SOT549 Search Results

HTSSOP32

Abstract: SOT549
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

HTSSOP32

Abstract: sot549
Contextual Info: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-2 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

HTSSOP32

Abstract: HTSSOP-32
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline HTSSOP32: plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT549-1 E D A X c y HE heatsink side v M A Dh Z 32 17 A2 Eh A3 A A1 pin 1 index θ Lp

Contextual Info: Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh A3 A1 θ Lp pin 1 index A L detail X

HTSSOP32

Abstract: sot549
Contextual Info: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2

Contextual Info: Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh A3 A1 A pin 1 index θ Lp L detail X

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HTSSOP32 package SOT549-1 Hx Gx P2 0.125 0.125 nSPx SPx nSPy Hy Gy SLy SPy tot By SPy Ay SPx tot C D2 4x P1 SLx D1 (28×) Generic footprint pattern Refer to the package outline drawing for actual layout

UJA1069TW24

Abstract: HTSSOP32 J2602 TJA1020 UJA1069 UJA1069TW SAE J2602 transceiver
Contextual Info: UJA1069 LIN fail-safe system basis chip Rev. 03 — 10 September 2007 Product data sheet 1. General description The UJA1069 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Local Interconnect

PDTA144E

Abstract: ISO16750-2 TJA1021 BCP52-16 HTSSOP32 J2602 UJA1079A SAE J2602 transceiver ECU microcontroller UJA1079
Contextual Info: UJA1079A LIN core system basis chip Rev. 01 — 9 July 2010 Product data sheet 1. General description The UJA1079A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a Local Interconnect Network

Contextual Info: TDA8932B Class-D audio amplifier Rev. 04 — 18 December 2008 Product data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω

ISO11898-3

Abstract: UJA1061TW TJA1054 HTSSOP32 J2602 TJA1020 TJA1054A TJA1055 UJA1061 ecu repair
Contextual Info: UJA1061 Fault-tolerant CAN/LIN fail-safe system basis chip Rev. 06 — 9 March 2010 Product data sheet 1. General description The UJA1061 fail-safe System Basis Chip SBC replaces basic discrete components that are common in every Electronic Control Unit (ECU) with a Controller Area Network (CAN)

BAT14

Abstract: BAT42 HTSSOP32 TJA1041 TJA1041A UJA1066
Contextual Info: UJA1066 High-speed CAN fail-safe system basis chip Rev. 03 — 17 March 2010 Product data sheet 1. General description The UJA1066 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Controller Area Network

PDTA144E

Contextual Info: UJA1075A High-speed CAN/LIN core system basis chip Rev. 02 — 28 January 2011 Product data sheet 1. General description The UJA1075A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area

PDTA144E

Contextual Info: UJA1078 High-speed CAN/dual LIN core system basis chip Rev. 02 — 27 May 2010 Product data sheet 1. General description The UJA1078 core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area

PDTA144E

Abstract: UJA1076A ecu repair DATA Sheet IC 555 BCP52-16 HTSSOP32 TJA1042 ECU microcontroller 0304-07 spi flash controller
Contextual Info: UJA1076A High-speed CAN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1076A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area

ISO16750-2

Abstract: PDTA144E UJA1078A ecu repair TJA1021 BCP52-16 HTSSOP32 J2602 TJA1042 ECU microcontroller
Contextual Info: UJA1078A High-speed CAN/dual LIN core system basis chip Rev. 2 — 28 January 2011 Product data sheet 1. General description The UJA1078A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area

PDTA144E

Abstract: UJA1079A
Contextual Info: UJA1079A LIN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1079A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a Local Interconnect Network

TDA8932BT

Abstract: TDA8932BTW TDA8932B tda8932 AES17 HTSSOP32 SO32 classd 5.1 circuit diagram schematics stu* audio amplifier RSN1012
Contextual Info: TDA8932B Class-D audio amplifier Rev. 04 — 18 December 2008 Product data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω

UJA1061TW

Abstract: HTSSOP32 ISO11898-3 J2602 TJA1020 TJA1054 TJA1054A TJA1055 UJA1061
Contextual Info: UJA1061 Fault-tolerant CAN/LIN fail-safe system basis chip Rev. 04 — 27 April 2007 Product data sheet 1. General description The UJA1061 fail-safe System Basis Chip SBC replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Controller Area Network

hall effect ic 6838

Abstract: 6838 hall effect sensor 6838 sensor hall 6838 hall sensor 6838 hall effect 6838 hall elements schematic diagram brushless motor control Hall Effect sensor 6838 schematic diagram disk drive motor controller 6838 hall
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SZA1015 Brushless Motor Controller BMC12 Product specification Supersedes data of 2000 Sep 19 File under Integrated Circuits, IC01 2001 Jul 11 Philips Semiconductors Product specification Brushless Motor Controller (BMC12)

TDA10086

Abstract: 8psk HTSSOP32 TDA8260TW TDA8261TW anzac BB1518 23tkb 5 to 32 decoder using 4 t0 16 decoders transistor SMD FLO 14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8261TW Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer Preliminary specification 2003 May 28 Philips Semiconductors Preliminary specification Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer TDA8261TW

PDTA144E

Abstract: UJA1076ATW UJA1076A
Contextual Info: UJA1076A High-speed CAN core system basis chip Rev. 2 — 31 January 2011 Product data sheet 1. General description The UJA1076A core System Basis Chip SBC replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area

Contextual Info: TDA8932B Class-D audio amplifier Rev. 01 — 14 February 2007 Preliminary data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω

Contextual Info: TDA8932B Class-D audio amplifier Rev. 02 — 29 March 2007 Preliminary data sheet 1. General description The TDA8932B is a high efficiency class-D amplifier with low power dissipation. The continuous time output power is 2 x 15 W in stereo half-bridge application RL = 4 Ω