FDZ6966 Search Results

Contextual Info: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging

948d

Contextual Info: FC-12A 2 x 2.5 mm MOSFET BGA Tape and Reel Dimensions FC-12A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

Contextual Info: FDZ202P P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a

948D

Abstract: FC-09A
Contextual Info: FC-09A 2 x 2 mm MOSFET BGA Tape and Reel Dimensions FC-09A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

Contextual Info: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a

f948

Abstract: F63TNR FDZ6966
Contextual Info: FC-12A 2 x 2.5 mm MOSFET BGA with 12 balls Tape and Reel Data FC-12A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled

F63TNR

Abstract: FDZ6966 F942B
Contextual Info: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled

FC-09A

Abstract: f948 F63TNR FDZ6966 corrugated box spec
Contextual Info: FC-09A 2 x 2 mm MOSFET BGA with 9 balls Tape and Reel Data FC-09A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled

AT 30B

Abstract: F63TNR FC-30B FDZ6966 D9942
Contextual Info: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled

AT 30B

Abstract: FC-30B 942b F942B
Contextual Info: FC-30B 3.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-30B MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: FC-30B MOSFET BGA parts are shipped in tape. The carrier tape if made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

FC-09A

Abstract: F63TNR FDZ204P FDZ6966
Contextual Info: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a

Contextual Info: FDZ201N N-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ201N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a

FDZ6966

Abstract: F63TNR SK 150 BGA
Contextual Info: FC-18A 2.5 x 4 mm MOSFET BGA with 18 balls Tape and Reel Data FC-18A MOSFET BGA Packaging Configuration: Figure 1.0 Packaging Description: Moisture Sens itive Sticker Antistatic Cover Tape FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled