FG25 Search Results

25A04

Contextual Info: Mechanical Dimensions FG25A01~25A07 Description TO-220AB Mechanical Data Features Cases: TO-220AB molded plastic Epoxy: UL 94V-0 rate flame retardant Terminals: Leads solderable per MIL-STD202, Method 208 guaranteed Polarity: As marked High temperature soldering guaranteed:

FF1152

Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
Contextual Info: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428

ip30 standard

Abstract: fan 50X50 918010 FG-172 EF80 IEC592 LFG60-45 FG50 FG80 FG92K
Contextual Info: SEPA ZUBEHÖR / ACESSORIES FGxx, FGxxK, LFGxx, EFxx, LFKx Pb A D 24 28 ,2 METAL FAN GUARDS, IP20 2x3.2 4xd FGxxx FG25 Finger Guards for standardized Fan sizes 25x25mm up to 172x150mm. Material: steel wire chromium plated. Type Art. No. 912510000 913010000

FF1152

Abstract: FG256 BF957
Contextual Info: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453

BF957

Abstract: FF1517 FF1152 FG256 FF896 Virtex-II FG456 Fine-Pitch BGA Package
Contextual Info: R Chapter 4: PCB Design Considerations FG256 Fine-Pitch BGA Package 1.00 mm Pitch Figure 4-22: 490 FG256 Fine-Pitch BGA Package www.xilinx.com 1-800-255-7778 UG012 (v1.0) January 31, 2002 Virtex-II Pro Platform FPGA Handbook R Package Specifications FG456 Fine-Pitch BGA Package (1.00 mm Pitch)

FG256

Abstract: FGG256
Contextual Info: R PK033 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG256/FGG256) Package 256-BALL FINE-PITCH BGA, 1.00MM PITCH (FG256/FGG256) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

XC2V1000

Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
Contextual Info: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch

34992

Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
Contextual Info: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240

Arasan SD controller

Abstract: Embedded SDIO micro sd connector sdio mmc connector CRC generator and checker Mmcplus commands verilog code for ahb bus slave CMD39 mmc ip core dma controller VERILOG
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • Low-power Actel AGL600-FG256 IGLOO family FPGA Micro-SD connector for Micro-SD memory modules SD/MMC Connector for SD, MMC4, RS-MMC, Mini-SD, MMC Plus, RS

Contextual Info: Fusion Starter Kit Quickstart Card Kit Contents – AFS-EVAL-KIT Quantity Description 1 Evaluation board with an AFS600-FG256 Fusion device 1 FlashPro4 programmer 1 9 V power supply with international adapters Overview The Fusion Starter Kit contains basic requirements for fully experimenting with SoC Products

Contextual Info: Mechanical Dimensions MAX.412 10.5 + PIN 1 PIN 3 PIN 2 CASE .037(0.94) .027(0.68) .06(1.52) .05(1.27) .185(4.70) .175(4.44) .594(15.1) .587(14.9) PIN 1 2 MAX.05(1.5) .16(4.06) .14(3.56) FG2501~2507 .154(3.91) DIA .148(3.74) .055(1.40) .045(1.14) .27(6.86)

BF957

Abstract: 21M22
Contextual Info: R Pinout Diagrams Pinout Diagrams This section contains pinout diagrams for the following Virtex-II Pro packages: • • • • • • • FG256 Fine-Pitch BGA Composite Pinout Diagram, page 461 - FG256 Bank Information - FG256 Dedicated Pins FG456 Fine-Pitch BGA Composite Pinout Diagram, page 465

FG256

Contextual Info: R Fine Pitch BGA FG256 Package PK033 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

FG256128b

Abstract: 256x128 256 x 128 lcd module SED1335 Fenghua FG2561 vr-10k GRAPHIC LCD MODULE china LCD circuit diagram
Contextual Info: Tovics Technology Corporation Standard Graphic LCD Module Feature 1. 2. 3. 4. 5. 6. 7. FG256128B Picture Information Dot Format 256 x 128 8-Bit parallel bus interface Built-in LCD controller (SED1335) Wide operating temperature range ( Option ) High contrast ratio

FG25507

Abstract: FIAMM LEAD ACID battery FIAMM
Contextual Info: FG25507 12 Volt 55 Ah FG25507 is a general purpose application battery. Within the FG range FIAMM offer 6V and 12V monoblocs at various amp hour capacities enable the right battery selection for each requirement. FIAMM is a Manufacturer of VRLA batteries and is supported by a dedicated

FG256

Abstract: PK033
Contextual Info: R Fine-Pitch BGA FG256 Package PK033 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

BF957

Abstract: UG002
Contextual Info: R Pinout Diagrams This section contains pinout diagrams for the following Virtex-II packages: • "CS144 Chip-Scale BGA Composite Pinout Diagram" on page 412 • "FG256 Fine-Pitch BGA Composite Pinout Diagram" on page 413 • • • • • • • • -

ACTEL FUSION AFS1500

Abstract: FlashPro3 PQ208 QN108 QN180 M1AFS1500 AFS250 rc oscillator M-LVDS
Contextual Info: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

A3P600

Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
Contextual Info: v1.0 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ • Grade 1 125°C TA (135°C TJ)

A3PE3000L FG484

Abstract: Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y
Contextual Info: v1.3 ProASIC3L Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • Dramatic Reduction in Dynamic and Static Power Savings • 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power • Low Power Consumption in Flash*Freeze Mode Allows for

CORE8051

Abstract: FlashPro3 AES-128 FG256 PQ208 ac motor variable speed control rc oscillator
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)

AFS600-FG256

Abstract: zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180
Contextual Info: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

Contextual Info: Revision 22 IGLOO Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

AES-128

Abstract: FG256 FG484
Contextual Info: v2.0 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power