FOOTPRINT WSON Search Results

lm5112

Contextual Info: LM5112 www.ti.com SNVS234B – SEPTEMBER 2004 – REVISED APRIL 2006 LM5112 Tiny 7A MOSFET Gate Driver Check for Samples: LM5112 FEATURES DESCRIPTION • The LM5112 MOSFET gate driver provides high peak gate drive current in the tiny WSON-6 package SOT23 equivalent footprint or an 8-Lead exposed-pad

lm5112

Abstract: L132B
Contextual Info: LM5112 www.ti.com SNVS234B – SEPTEMBER 2004 – REVISED APRIL 2006 LM5112 Tiny 7A MOSFET Gate Driver Check for Samples: LM5112 FEATURES DESCRIPTION • The LM5112 MOSFET gate driver provides high peak gate drive current in the tiny WSON-6 package SOT23 equivalent footprint or an 8-Lead exposed-pad

SST25WF016

Abstract: footprint WSON-8 footprint WSON soic-8 200mil footprint soic SST25VF080B BIOS WSON SST25WF080 SST25VF080B SST25LF020A
Contextual Info: SPI Serial Flash Product Brief 25 Series April 2007 Product Description SPI Serial Flash is small, low-power flash memory that features Serial Peripheral Interface SPI and pin-for-pin compatibility with industry-standard SPI EEPROM devices. Its small footprint

footprint WSON-8

Abstract: WSON footprint WSON 6x8 WSON-8 WSON8 SST25VF016B footprint WSON SST25VF064C WSON 6x8 footprint soic8 150
Contextual Info: SPI Serial Flash Product Brief 25 Series October 2010 Product Description SPI serial flash is small, low-power flash memory that features a Serial Peripheral Interface SPI and pin-for-pin compatibility with industry-standard SPI EEPROM devices. Its small footprint reduces ASIC

footprint WSON

Abstract: WSON QT100A-ISG atmel Reflow soldering QT100-ISG QT100A atmel touch pattern QT100AISG QT100 QTAN0027
Contextual Info: PCB Design Considerations when Changing from 6-pin SOT23 to 6-pin WSON Atmel Products 1. Introduction The new QTouchTM product family from Atmel is packaged in a lower profile 6-pin WSON package. Existing product users may choose to convert to this new product

footprint WSON

Abstract: WSON WSON socket S72030-00-000 soic 16 Jedec package outline DSAE003956 land pattern wson
Contextual Info: Recommended Land Pattern for SST’s SOIC and WSON Packages Design Versatility of the Ultra-thin, Small Outline No-lead WSON Package Application Note May 2002 INTRODUCTION SOIC PACKAGE SST introduces an innovative, ultra-thin package for it’s Serial Flash family of devices.

PM25LV040

Abstract: PM25LV020 SO8w footprint MX25L8005M2C-15G MX25L8005M2C MLP8 FOOTPRINT ICE25P05 SST25VF016-33-4C-QA M25PE10-VMP6TG Y25f05
Contextual Info: SPI Serial Flash for code, data and parameter storage Cross-reference guide August 2005 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties

Contextual Info: User's Guide SNVU192A – October 2012 – Revised April 2013 AN-2280 LMR10530 Evaluation Module 1 Introduction The LMR10530 evaluation module is designed to provide the power supply design engineer with a fully functional regulator design using the LMR10530 3MHz switching regulator in an WSON-10 package. The

WINBOND Serial flash cross reference

Abstract: ICE25P05 SST25VF016-33-4C-QA Y25f05 Atmel part numbering SST25VF080-33-4C-SA footprint wide SOIC8 SST MLP8 FOOTPRINT footprint WSON ICE25P10
Contextual Info: Serial Flash for code storage – SPI bus Cross reference guide www.st.com/serialflash How to use this cross reference guide This cross reference guide is intended to help you choose the ST product most compatible with competitive devices. It is very easy to use: simply identify the competitor’s part number, with the memory

NGF0006A

Contextual Info: User's Guide SNVA173B – September 2006 – Revised April 2013 AN-1494 LP5900SD 6 Pin WSON Evaluation Board 1 Introduction This evaluation board is designed to enable the evaluation of the LP5900 Voltage Regulator. Each board is assembled and tested in the factory. This evaluation board has the 6 pin WSON package mounted.

S25FL129

Abstract: S98GL064NB0 S98GL064 s29gl256p90 S70FL256 S98GL064NB s71vs128 S25FL129P WSON 6x8 S25FL032K
Contextual Info: Spansion Product Selector Guide Embedded and Mobile Applications Portfolio March 2011 Spansion ® Products Portfolio . Automotive . Consumer electronics . Gaming . Industrial equipment . Machine-to-Machine Spansion offers a wide range of NOR Flash memory solutions in multiple voltages,

WSON-8

Abstract: footprint WSON footprint WSON-8 WSON8 WSON SST25VF016 SST25VF080 spi In Circuit Serial Programming SST25 SST25VF010
Contextual Info: Product Brief August 2002 SST25 Series SPI Serial Flash Make Obsolescence Obsolete! The Breakthrough Flash with a Clear Migration Path. Take your flash designs to the next level with the new SST SPI Serial Flash. With our split-gate cell design, thick oxide tunneling, and patented,

S25FL256

Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
Contextual Info: Spansion Product Selector Guide April 2012 Spansion ® Products Portfolio Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including:

Contextual Info: User's Guide SNVA176A – March 2007 – Revised April 2013 AN-1501 LP3905-30 Evaluation Board 1 General Information The evaluation board is a complete circuit allowing full operation of the LP3905 within the recommended application circuit. Each board is pre-assembled and tested in the factory. The board contains the LP390530 in a 14 lead WSON package with all the associated passive components to enable all features of the

CDA 194

Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Contextual Info: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Advance Information)

Contextual Info: User's Guide SNVA187C – January 2007 – Revised May 2013 AN-1529 LM3430 Evaluation Board 1 Specifications of the Board The Evaluation Board has been designed for testing of various circuits using the LM3430 boost regulator controller. A complete schematic for all the components is shown in Figure 1. The board is two layers with

S25FL256* spansion

Abstract: S25FL256 S70FL01GS S25FL128* spansion SPI flash PCB LAYOUT GUIDE S70FL01 S25FL512 S25FL128S S25FL256S S29FL128
Contextual Info: Spansion Serial Peripheral Interface SPI FL Flash Layout Guide Application Note 1. Introduction The Spansion serial peripheral interface (SPI) flash devices are high speed synchronous access non-volatile memory devices. Standard high speed layout practices should be followed when performing printed circuit

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®

S25FL256

Abstract: S25FL256SA S25FL256SAGMFI00 S25FL256SAG FL256SA fl256saif00 S25FL256S FL128S S25FL256* spansion S25FL256SAGMF
Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion®

FL256S

Abstract: SDR-80
Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)

Contextual Info: S25FL128S and S25FL256S S25FL128S 128 Mbit 16 Mbyte S25FL256S 256 Mbit (32 Mbyte) MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O S25FL128S and S25FL256S Cover Sheet Data Sheet (Preliminary)