FUTUREBUS Search Results

223011-2

Abstract: 536511 536510-4 9588 223004-5 tyco MGCD0-00008 223000-4
Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 METRIC Catalogue 1654741 Z-PACK 2mm FutureBus+ Connectors Revised 1-04 Dimensions are millimetres over inches 4 Row Signal Modules, Vertical Pin Assemblies, Fixed-Board Connector, 2mm x 2mm Circuit Grid

fad27

Abstract: FAD47 FRQ01 FAD21 FAD30 FAD45 FAD26 fca 173 FAD 203 FAD37
Contextual Info: NEUBRIDGE MICROSYSTEMS NEWBRIDGE fc.4E D • b5öölQl JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 - 1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol

DIN41626

Contextual Info: r TEMPUS C B C 20 2mm Interconnect Hybrid Modules Features Allows application of high power, coaxial inserts, guiding features and fibre optics into an industry standard DIN41626 style cavity Designed to conform with IEC 48b237, EIAis64, IEEEP896 Futurebus+, IEEE P1596

Contextual Info: 2mm Interconnect TEMPUS CBC 20 Shrouds Features Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC917 metric modular order To be used in conjunction with TEM PU S CBC 20 male pressfit long tail modules Stackable with other TEM PU S CBC 20

CBC20B00-048MDS1-5-1

Abstract: TRI-1.25-6
Contextual Info: 2mm Interconnect TEMPUS C B C 20 Male Signal Modules — Narrow Wall — Solder Termination — 4 Row Features Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with

Contextual Info: Catalog 1307515 Issued 9-99 Z-PACK 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 4 Row — Power Modules, Vertical Pin Assemblies (Fixed-Board Connector), 2mm x 2mm Circuit Grid 11.50 [ 453 ] 16 m m W id e Body Pin A s s e m b lie s w ith S o ld e r

205ae

Contextual Info: C a ta log 1 3 0 7 5 1 5 Issued 9-99 Z-PACK 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 5 Row — Power Modules, Right Angle Receptacle A ssem blies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assemblies with Solder Leads and Compliant Press-Fit Leads

Contextual Info: m o le x 2.00mm .079" Pitch MFB (Futurebus+) Receptacle Code Key FEATURES AND SPECIFICATIONS Physical Features and Benefits • Integral keying on bottom row does not interrupt pin grid Housing: Glass-filled PBT and leaves full front face of connector available for signals

Contextual Info: TEMPUS C B C 20 2mm Interconnect Male Signal Modules — Wide Wall — Pressfit Termination — 4 Row Features * Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with

Contextual Info: TEMPUS CBC 20 2mm Interconnect Male Signal Modules — Wide Wall — Solder Termination — 5 Row Features » Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with

51153-I

Contextual Info: m o le x 2.00mm .079" Pitch MFB (Futurebus+) Header Code Key FEATURES AND SPECIFICATIONS Features and Benefits Physical • Integral keying on bottom row does not interrupt pin grid Housing: Glass-filled PBT and leaves full front face of connector available for signals

CBC20D00-192WDS2-4-1

Abstract: CBC20A00-024WDS2-5-1 CBC20B00-048WDS1-8-1
Contextual Info: TEMPUS C B C 20 2mm Interconnect Male Signal Modules — Wide Wall — Solder Termination — 4 Row Features - Designed to conform with IEC 4 8 b 2 3 7, EIAis64, IE E E P896 Futurebus+, IE E E P1596 SCI and IEC 9 17 metric modular order - Stackable with other T E M P U S modules, with

Contextual Info: 2mm Interconnect TEMPUS C B C 20 Male Signal Modules — Wide Wail — Solder Termination — 5 Row Features • Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order • Stackable with other TEMPUS modules, with

IPC-D300

Abstract: 223004-5 IPC-D-300
Contextual Info: Catalog 1307515 Issued 9-99 Z-P A C K 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 5 Row — Signal Modules, Right Angle Receptacle Assemblies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assem blies with Solder Leads and Com pliant Press-Fit Leads

Contextual Info: Catalog 1307515 Issued 9 -9 9 Z-PACK 2mm FutureBus+ Connectors Contin ued IEC61076-4-0X(48B) 4 Row — Power Modules, Right Angle Receptacle Assemblies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assemblies with Solder Leads and Compliant Press-Fit Leads

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

Futurebus

Contextual Info: 3M MetPak™ 2-FB Power Header 2 mm 4/5 Row, Vertical, Press-Fit Tail MP2 Series • 6.50 Amps per contact • Early mate late break EMLB for hot swap or selective loading options • End-to-end stackable • Optional feed-through tail (Press-Fit) • Futurebus+ compatible

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA)

DS3884A

Abstract: DS3884AVF VF44B
Contextual Info: DS3884A BTL Handshake Transceiver General Description The DS3884A is one in a series of transceivers designed specifically for the implementation of high performance Futurebus+ and proprietary bus interfaces. The DS3884A is a BTL 6-bit Handshake Transceiver designed to conform to

Contextual Info: DS2112 PRELIMINARY Di?2112 DALLAS BTL Terminator s e m ic o n d u c to r PIN ASSIGNMENT FEATURES • Complies with Backplane Transceiver Logic BTL specifications (IEEE 1194.1-1991) and Futurebus+ specifications (IEEE 896.2-1991) • Provides active termination for eight signal lines

Contextual Info: DS2112 PRELIMINARY DALLAS SEMICONDUCTOR DS2112 BTL Terminator PIN ASSIGNMENT FEATURES • Com plies with Backplane Transceiver Logic BTL specifications (IEEE 1194.1-1991) and Futurebus+ specifications (IEEE 8 9 6.2-1991) • Provides active term ination for eight signal lines

b 0787

Abstract: cc 089
Contextual Info: 7300 Series Futurebus CCS 4 Row Right Angle Female Power Specifications Insulator Material: Liquid Crystal Polymer LCP 94V-O, UL Recognized. Contact Material: Phosphor Bronze Contact Plating: Gold and Tin over .000050” Ni (See contact plating options)

Contextual Info: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications

DS3890

Abstract: DS3893A FB1650 FB2031 FB2040 TFB2010
Contextual Info: Next-Generation Futurebus+/BTL Transceivers Allow Single-Sided SMT Manufacturing SCBA003 13–1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version