GAAS MMIC ESD, DIE ATTACH AND BONDING GUIDELINES Search Results

84-1LMI epoxy adhesive

Abstract: 84-1LMI thermocompression Die Attach and Bonding Guidelines copper bond wire PEDESTAL FOR MMIC BRASS
Contextual Info: GaAs MMIC ESD, Die Attach and Bonding Guidelines Application Note # 54 - Rev. A May 2000 1.0 ESD Considerations A GaAs IC can be destroyed electrically by a static or other discharge through the device. It must therefore be handled so these effects cannot occur.

ultrasonic probe ge

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines GaAs FET chip ultrasonic bond AN-1001 Ultrasonic bubble kulicke Soffa nec microwave
Contextual Info: California Eastern Laboratories AN-1001 APPLICATION NOTE RECOMMENDED HANDLING PROCEDURES FOR MICROWAVE TRANSISTOR AND MMIC CHIPS INTRODUCTION This document is provided to inform users of some of the handling precautions necessary and the assembly processes

KCW-10

Abstract: AuSn solder GaAs MMIC ESD, Die Attach and Bonding Guidelines thermocompression bonder AuSn a/KCW-10
Contextual Info: H GaAs MMIC Assembly and Handling Guidelines Application Note 999 Mechanical Considerations Because of the small size of the devices, handling should always be performed with the aid of a microscope. There are several methods for picking up, transferring and die

Die Attach and Bonding Guidelines

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines long range gold detector circuit diagram agilent HMMC
Contextual Info: Agilent HMMC-5033 17.7-32 GHz Power Amplifier Data Sheet Features 2.74 x 1.31 mm 108 × 51.6 mils ±10 µm (±0.4 mils) 127 ± 15 µm (5.0 ± 0.6 mils) Chip Size: Chip Size Tolerance: Chip Thickness: Description The HMMC-5033 is a MMIC power amplifier designed for use in

HMMC-5034

Abstract: HMMC-5040 GaAs MMIC ESD, Die Attach and Bonding Guidelines agilent HMMC
Contextual Info: Agilent HMMC-5034 37–43 GHz Amplifier Data Sheet TC926 Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: Description The HMMC-5034 is a MMIC power amplifier designed for use in wireless transmitters that operate within the 37 GHz to 42.5 GHz range. At 40 GHz it

1GC1

Abstract: Die Attach and Bonding Guidelines TC225 GaAs MMIC ESD, Die Attach and Bonding Guidelines 1gc1 agilent TC2-25 2tc2-25 agilent HBT transistor series
Contextual Info: Agilent 1GC1-8048 40–72 GHz Doubler TC225 Data Sheet Features • PIN = + 15 dBm • Wide Bandwidth: 40–72 GHz Usable to 80+ GHz • Low Conversion Loss: 13 dB typical • Low 1/2 and 3/2 spurs: –23 dBc typical Chip Size: Chip Size Tolerance: Chip Thickness:

TC225

Contextual Info: Agilent 1GC1-8048 40–72 GHz Doubler TC225 Data Sheet Features • PIN = + 15 dBm • Wide Bandwidth: 40–72 GHz Usable to 80+ GHz • Low Conversion Loss: 13 dB typical • Low 1/2 and 3/2 spurs: –23 dBc typical Chip Size: Chip Size Tolerance: Chip Thickness:

TC221

Contextual Info: Agilent 1GC1-8038 50 GHz Frequency Doubler TC221 Data Sheet Features • Conversion Efficiency: −12 dB Typical • 1/2 and 3/2 spurs: 15 dBc Typical Chip Size: Chip Size Tolerance: Chip Thickness: 890 x 500 µm 35.0 x 19.7 mils ±10 µm (±0.4 mils) 127 ± 15 µm (5.0 ± 0.6 mils)

TC221

Abstract: 1GC1-8038 GaAs MMIC ESD, Die Attach and Bonding Guidelines 8038 CE25 Die Attach and Bonding Guidelines
Contextual Info: Agilent 1GC1-8038 50 GHz Frequency Doubler TC221 Data Sheet Features • Conversion Efficiency: −12 dB Typical • 1/2 and 3/2 spurs: 15 dBc Typical Chip Size: Chip Size Tolerance: Chip Thickness: 890 x 500 µm 35.0 x 19.7 mils ±10 µm (±0.4 mils) 127 ± 15 µm (5.0 ± 0.6 mils)

HMMC-2006

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines Die Attach and Bonding Guidelines
Contextual Info: Agilent HMMC-2006 DC–6 GHz Unterminated SPDT Switch Data Sheet SEL1 Features • Frequency range: DC– 6 GHz SEL2 • Insertion loss: <1dB @ 6 GHz RF OUT2 RF OUT1 • Isolation: >70 dB @ 45 MHz >35 dB @ 6 GHz • Return loss: >12 dB Both input & output

HMMC-2027

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines Die Attach and Bonding Guidelines
Contextual Info: Agilent HMMC-2027 DC– 26.5 GHz SPDT GaAs MMIC Switch Data Sheet Features • Outputs terminated in 50Ω when off • Frequency range: DC– 26.5 GHz • Insertion loss: 2.5 dB @ 26.5 GHz • Isolation: >70 dB @ 45 MHz >30 dB @ 26.5 GHz • Return loss:

PUNSE

Abstract: 1GG7-8005 1GG7
Contextual Info: Agilent HMMC-2027 DC–26.5 GHz SPDT GaAs MMIC Switch 1GG7-8005 Data Sheet SEL1 RF OUT1 SEL2 RF OUT2 Features • Outputs terminated in 50 Ω when off • Frequency range: DC to 26.5 GHz • Insertion loss: 2.5 dB @ 26.5 GHz • Isolation: > 70 dB @ 45 MHz

AuSn eutectic

Abstract: inductive pickup
Contextual Info: v02.1203 Handling Precautions Follow these precautions to avoid permanent damage: Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen

GaAs MMIC ESD, Die Attach and Bonding Guidelines

Abstract: diode 716 Die Attach and Bonding Guidelines HSCH-9201 HSCH-9501 chip diode agilent HSCH9201
Contextual Info: Agilent HSCH-9501 GaAs Schottky Diode Series Pair Tee Data Sheet Features • Low Junction Capacitance – typically 40 fF • Low Series Resistance – typically 3 Ω • Large bond pads suitable for automated wire-bonding or flip-chip assembly • Polyimide scratch protection

Contextual Info: HMMC-2027 DC– 26.5 GHz SPDT GaAs MMIC Switch Data Sheet Description The HMMC-2027 is a GaAs monolithic microwave integrated circuit MMIC designed for low insertion loss and high isolation from DC to 26.5 GHz. It is intended for use as a general-purpose, single-pole,

GaAs MMIC SPDT TERMINATED SWITCH DC 6GHz

Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines
Contextual Info: Agilent HMMC-2007 DC– 8 GHz Terminated SPDT Switch Data Sheet Features • Outputs terminated in 50Ω when off • Frequency range: DC– 8 GHz • Insertion loss: <1.2 dB @ 8 GHz • Isolation: >70 dB @ 45 MHz >35 dB @ 8 GHz • Return loss: 25 dB both input & output

HMMC-3040

Abstract: HMMC-5040 GaAs MMIC ESD, Die Attach and Bonding Guidelines "common drain" amplifier impedance matching
Contextual Info: Agilent HMMC-3040 20 – 43 GHz Double-Balanced Mixer and LO-Amplifier Data Sheet Features • Both up and downconverting functions • Harmonic LO mixing capability • Large bandwidth: Chip Size: 2520 x 730 µm 99.2 x 28.7 mils Chip Size Tolerance: ±10 µm (±0.4 mils)

Die Attach and Bonding Guidelines

Abstract: schottky diode application chip diode agilent HSCH-9401
Contextual Info: Agilent HSCH-9401 GaAs Schottky Diode Data Sheet Features Chip Size: 610 x 255 µm 24 × 10 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 µm (4 mils) Chip Thickness Tolerance:± 15 µm (± 0.6 mils) Bond Pad Sizes: 175 × 175 µm (6.9 × 6.9 mils)

ALC 887

Abstract: HMMC-1015 hmmc 1015
Contextual Info: Agilent HMMC-1015 DC–50 GHz Variable Attenuator 1GG7-8008 Data Sheet Features • Specified frequency range: DC to 26.5 GHz • Pin –1 dB : 27 dBm @ 500 MHz • Return loss: 10 dB • Minimum attenuation: 2.0 dB • Maximum attenuation: 30.0 dB Chip size:

2043 dd

Abstract: HMMC-3040 HMMC-5040 Die Attach and Bonding Guidelines
Contextual Info: Agilent HMMC-3040 20 – 43 GHz Double-Balanced Mixer and LO-Amplifier Data Sheet Features • Both up and downconverting functions • Harmonic LO mixing capability • Large bandwidth: Chip Size: 2520 x 730 µm 99.2 x 28.7 mils Chip Size Tolerance: ±10 µm (±0.4 mils)

Contextual Info: Avago HMMC-5032 17.7 – 32 GHz Amplifier Data Sheet Chip Size: 1.4 x 0.78 mm 55.1 x 30.7 mils Chip Size Tolerance: ±10 µm (±0.4 mils) Chip Thickness: 127 ± 15 µm (5.0 ± 0.6 mils) Description The HMMC-5032 is a MMIC power amplifier designed for use in wireless transmitters that operate within

GaAs MMIC ESD, Die Attach and Bonding Guidelines

Abstract: all diode List Die Attach and Bonding Guidelines diode PN diode specifications Schottky schottky diode application die bonding DIODE 255 diode all
Contextual Info: HSCH-9401 GaAs Schottky Diode Data Sheet Description The HSCH-9401 is a discrete Schottky barrier diode fabricated with the Schottky Barrier Integrated Diode SBID process. Features • fC >800 GHz Applications The HSCH-9401 is a general purpose millimeter wave

ALC 887

Abstract: 1GG7
Contextual Info: Agilent HMMC-1002 DC–50 GHz Variable Attenuator 1GG7-8001 Data Sheet Features • Specified frequency range: DC to 26.5 GHz • Return loss: 10 dB • Minimum attenuation: 2.0 dB • Maximum attenuation: 30.0 dB Chip size: Chip size tolerance: Chip thickness:

Die Attach and Bonding Guidelines

Abstract: HMMC-1015 GaAs MMIC ESD, Die Attach and Bonding Guidelines
Contextual Info: Agilent HMMC-1015 DC–50 GHz Variable Attenuator Data Sheet Features • Specified Frequency Range: DC–26.5 GHz • Pin -1dB : 27 dBm @ 500 MHz • Return Loss: 10 dB • Minimum Attenuation: 2.0 dB Chip Size: 1470 x 610 µm (57.9 x 24.0 mils) Chip Size Tolerance: