GP POWER BANK Search Results

Contextual Info: REVISION A LPHT-XX-XX-X-RTX-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT OPTIONS -GP: GUIDE POSTS LEAVE BLANK FOR NO -GP OPTION *(NO -GP NOT TOOLED) *-HS: HOT SWAP (ONE BANK OF OUTER POWER POS ARE SIGNAL POS (TOTAL) LONG PINS, POWER PIN ONLY)

Contextual Info: REVISION D QFS-XXX-XX-XX-D-RA-XXX FIG. 1 QFS-052-01-XX-D-RA SHOWN OPTION -K: KAPTON PAD (USE K-850-650) *-PC4: 4 POWER PINS (NOT AVAILABLE WITH -GP OR -104 POS. OR -02 LEAD STYLE) *-PC8: 8 POWER PINS (NOT AVAILABLE WITH -GP OR -104 POS.OR -02 LEAD STYLE)

Contextual Info: REVISION C QFS-XXX-XX-XX-D-RA-XXX FIG. 1 QFS-052-01-XX-D-RA SHOWN OPTION -K: KAPTON PAD (USE K-850-650) *-PC4: 4 POWER PINS AVAILABLE WITH -GP C (NOT OR -104 POS. OR -02 LEAD STYLE) *-PC8: 8 POWER PINS (NOT AVAILABLE WITH -GP OR -104 POS.OR -02 LEAD STYLE)

Contextual Info: RIGHT ANGLE GROUND PLANE SOCKET SPECIFICATIONS Board Mates: QRM8 -GP required Integral ground/power plane For complete specifications and recommended PCB layouts see www.samtec.com?QRF8-RA Insulator Material: Black LCP Contact Material: BeCu Ground Plane Material:

Contextual Info: REVISION B QFS-XXX-01-XX-D-RA-XXX FIG. 1 QFS-052-01-XX-D-RA SHOWN (No OF POS / 26) x .840[21.34]) + .490[12.45] REF .250 6.35 REF (TYP) DO NOT SCALE FROM THIS PRINT OPTION -K: KAPTON PAD (USE K-850-650) *-PC4: 4 POWER PINS (NOT AVAILABLE WITH -GP OR -104 POS.)

VOLTMETER SELECTOR SWITCH

Abstract: CM1625 ammeter selector AMMETER WITH POINTER CM052 cts rotary switch
Contextual Info: AUGAT/ INTCON PRDT GP D I 1 0 ^ 5 33 5 D0D 1 72 Ô Q22 CM SERIES IAUI P A Compact Modular Power Rotary Switches CM Series pow er rotary switches have a m odular design that com bines the use of assemblies of standard contact elements with a variety of contact cam and panel-m ounted actuators and front

M58LT128HT

Abstract: Numonyx M36L0T7050T2 M58LT128HB M58LT128HTB 32-Mbit
Contextual Info: M36L0T7050T2 M36L0T7050B2 128 Mbit Multiple Bank, Multi-Level, Burst Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package Preliminary Data Feature summary • ■ ■ ■ Multi-Chip Package – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory

M36L0T8060

Abstract: flash E2p M69KW096B
Contextual Info: M36L0T8060T1 M36L0T8060B1 256 Mbit 16 Mb x16, multiple bank, multilevel, burst Flash memory and 64 Mbit PSRAM, 1.8 V core, 3 V I/O supply, multichip package Features Multichip package • 1 die of 256 Mbit (16 Mb ×16, multiple bank, multilevel, burst) Flash memory

numonyx

Abstract: M36W0R604BT1 M36W0R604 M58WR064HTB PSRAM JESD97 M36W0R6040T1 M69AR024B 8810h 8811h
Contextual Info: M36W0R6040T1 M36W0R604BT1 64 Mbit 4 Mb x16, Multiple Bank, Burst Flash memory and 16 Mbit (1 Mb ×16) PSRAM, multi-chip package Features • Multi-chip package – 1 die of 64 Mbit (4 Mb x 16) Flash memory – 1 die of 16 Mbit (1 Mb x 16) Pseudo SRAM ■

M36L0T7050T2

Abstract: M58LT128HB M58LT128HT M36L0t7050
Contextual Info: M36L0T7050T2 M36L0T7050B2 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 32 Mbit (2 Mb x16) PSRAM, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash Memory – 1 die of 32 Mbit (2 Mb x16) Pseudo SRAM

Numonyx

Abstract: A0-A21 M36W0R6050B1 M36W0R6050T1
Contextual Info: M36W0R6050T1 M36W0R6050B1 64 Mbit 4 Mb x16, Multiple Bank, Burst Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multi-chip package Features • Multi-Chip Package – 1 die of 64 Mbit (4 Mb × 16) Flash memory – 1 die of 32 Mbit (2 Mb × 16) Pseudo SRAM

8811h

Abstract: flash E2p A0-A21 J-STD-020B M36D0R6040T0 M69AR024B
Contextual Info: M36D0R6040T0 M36D0R6040B0 64 Mbit 4Mb x16, Multiple Bank, Page Flash Memory and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM • SUPPLY VOLTAGE

Contextual Info: M36W0R6050T1 M36W0R6050B1 64 Mbit 4 Mb x16, multiple bank, burst Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multichip package Features • Multichip package – 1 die of 64 Mbit (4 Mb × 16) Flash memory – 1 die of 32 Mbit (2 Mb × 16) PSRAM ■ Supply voltage

A0-A21

Abstract: M36W0R6050B1 M36W0R6050T1
Contextual Info: M36W0R6050T1 M36W0R6050B1 64 Mbit 4 Mb x16, Multiple Bank, Burst Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multi-chip package Features • Multi-Chip Package – 1 die of 64 Mbit (4 Mb × 16) Flash memory – 1 die of 32 Mbit (2 Mb × 16) Pseudo SRAM

M58WR064KT

Abstract: M36W0R M36W0R604
Contextual Info: M36W0R6040T3 M36W0R6040B3 M36W0R6050T3 M36W0R6050B3 64-Mbit 4 Mbits x16, multiple bank, burst Flash memory and 16-Mbit (1 Mbit ×16) or 32-Mbit (2 Mbits x16) PSRAM MCP Preliminary Data Features • Multichip package – 1 die of 64 Mbits (4 Mbits x16) flash

A0-A21

Abstract: J-STD-020B M36W0R6050T0 M69AR048B 26-MAR-2004 8811h
Contextual Info: M36W0R6050T0 M36W0R6050B0 64 Mbit 4Mb x16, Multiple Bank, Burst Flash Memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 32 Mbit (2Mb x 16) Pseudo SRAM •

PSRAM

Abstract: M36P0R9070E0 M58PR512J M69KB128AA
Contextual Info: M36P0R9070E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA Features summary • ■ ■ ■ Multi-chip package – 1die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash Memory

M36W0R6040T

Abstract: A0-A21 J-STD-020B M36W0R6040B0 M36W0R6040T0 M69AR024B
Contextual Info: M36W0R6040T0 M36W0R6040B0 64 Mbit 4Mb x16, Multiple Bank, Burst Flash Memory and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY • ■ ■ ■ ■ MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM

Contextual Info: M36D0R6040T0 M36D0R6040B0 64 Mbit 4Mb x16, Multiple Bank, Page Flash Memory and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM • SUPPLY VOLTAGE

M36W0R5040

Abstract: m36w0r5040t M36W0R5040T5 M36W0R5040B5 8815h 8814h
Contextual Info: M36W0R5040T5 M36W0R5040B5 32-Mbit 2 Mbits x16, multiple bank, burst flash memory and 16-Mbit (1 Mbit ×16) PSRAM, 1.8 V supply, MCP Features • ■ ■ ■ Multi-chip package – 1 die of 32-Mbit (2 Mbits x16, multiple bank, burst) flash memory – 1 die of 16 Mbit (1 Mbit x16) PSRAM

M69KB096AB

Abstract: PSRAM M36P0R9060E0 M58PR512J
Contextual Info: M36P0R9060E0 512 Mbit x16, Multiple Bank, Multi-Level, Burst Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package PRELIMINARY DATA Features summary • ■ ■ ■ Multi-chip package – 1 die of 512 Mbit (32Mb x 16, Multiple Bank, Multi-Level, Burst) Flash memory

PSRAM

Abstract: M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT ubp 100
Contextual Info: M36L0R7060T1 M36L0R7060B1 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash memory

e2p 25

Abstract: J-STD-020B M30L0R7000B0 M30L0R7000T0 M36L0R7040B0 M36L0R7040T0 M69AR024B
Contextual Info: M36L0R7040T0 M36L0R7040B0 128 Mbit Multiple Bank, Multi-Level, Burst Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 16 Mbit (1Mb x16) Pseudo SRAM

M36P0R8070E0

Abstract: M58PR256J M69KB128AA strataflash 256 x 2 Mbits ECR15
Contextual Info: M36P0R8070E0 256 Mbit x16, multiple bank, multilevel, burst Flash memory 128 Mbit (burst) PSRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 256 Mbit (16 Mb x 16, multiple bank, multilevel, burst) Flash memory – 1 die of 128 Mbit (8 Mb x16) PSRAM