HB56G19B Search Results

Contextual Info: HB56G19 Series 1,048,576-Word x 9-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN OUT The HB56G19 is a 1M x 9 dynamic RAM module, mount­ ed two 4 Mbit DRAM HM514400AS sealed in SOJ package and 1 Mbit DRAM (HM511000AJP) sealed in SOJ package.

HM511000

Abstract: hb56g19b-7
Contextual Info: HB56G19A/B Series Maintenance only 1,048,576-word x 9-bit High Density Dynamic RAM Module The HB56G19 is a 1M × 9 dynamic RAM module, mounted two 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 1 Mbit DRAM (HM511000 AJP/ALJP) sealed in SOJ package. An outline of the HB56G19 is 30pin single in-line package. Therefore, the

M5M23160

Abstract: TC5117400 oki cross kmm5322000a THM324080AS lh538000 424100 IBM025161 MC-421000A36 uPD482445
Contextual Info: OKI Semiconductor Memory Cross Reference 16-Meg DRAMs OKI Part Number MSM5116160 MSM5116400 MSM5117100 MSM5117400 MSM5117800 MSM51V16100 MSM51V16160 MSM51V16400 MSM51V17100 MSM51V17400 MSM51V18160 Configuration Voltage Refresh 1 Meg x 16 4 Meg x 4 16 Meg x 1

hb56g19b

Contextual Info: HB56G19 S e rie s -1,048,576-Word x 9-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN OUT The H B56G19 is a 1M x 9 dynamic R A M module, mount­ ed two 4 Mbit D R A M HM514400AS sealed in S O J package and 1 Mbit DRAM (HM511000AJP) sealed in S O J package.

514400

Abstract: hb56g19b
Contextual Info: HB56G19 Series 1,048,576-Word x 9-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN O U T T h e H B 5 6 G 1 9 is a 1M x 9 dynam ic R A M m odule, m ount­ ed tw o 4 M bit D R A M H M 5 1 4 4 0 0 A S se a le d in S O J p a c ka g e and 1 M b it D R A M (H M 5 1 1 0 0 0 A JP ) s ealed in S O J package.