S 0319
Abstract: CRM1525D
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS3146, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS3146,
30C/60%
S 0319
CRM1525D
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nitto GE
Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark
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A1008-07
TEBGA-580
facilitSD22-A110
JESD22-A104
JESD22-A103
JESD22-A113
SXVX-110BHG
SXVX-200BHG
SXVX-210BHG
nitto GE
GE-100L
SXVX-50BHG
nitto GE-100L
SXVX-210BHG
SXVX-50
HL832NX
SXVX-210
Nitto GE 100
HL832HS
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J-STD-020
Abstract: HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303
Contextual Info: 05/21/03 RELIABILITY REPORT FOR DS4000, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS4000,
JESD78,
J-STD-020
HC100-XJ
JSTD-020
NITTO HC-100-XJAA-M
94V-0 0303
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NITTO HC-100-XJAA-M
Abstract: CRM1525D HC-100XJAA-M
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS3148, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS3148,
30C/60%
NITTO HC-100-XJAA-M
CRM1525D
HC-100XJAA-M
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PCN0415
Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.
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PCN0415
HC100-XJ
HC100-XJAA
PCN0415
Nitto Denko HC100-XJ
Denko
trace code altera
HC100
HC100XJAA
altera top marking
nitto hc100
altera marking
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NITTO HC-100-XJAA-M
Abstract: CRM1525D HC100-XJ HC100 HC-100-XJAA-M HC100-XJAA JEDEC JESD22-B117
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS31412, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS31412,
30C/60%
NITTO HC-100-XJAA-M
CRM1525D
HC100-XJ
HC100
HC-100-XJAA-M
HC100-XJAA
JEDEC JESD22-B117
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ABLEBOND
Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
Contextual Info: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and
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HC100XJAA
CX28398-27
M28947-13
M28945-13
M28950-13
M28946-13
ABLEBOND
M28945-13
HC100
M28945
Nitto
mold compound
28237-12
M28950-13
Amkor mold compound
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R7181-38
Abstract: ablebond HC100 HC100XJAA mold compound Compound HC100-XJAA
Contextual Info: August 12, 2009 CN 081209 Customer Notification R7181-38 Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the R7181-38. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and
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R7181-38
R7181-38.
HC100XJAA
R7181-39.
ablebond
HC100
mold compound
Compound
HC100-XJAA
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